Wafer mask aligner

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Product
Full-automatic wafer exposure system (mask aligner) for LED chip production. Compatible with Micro LED and standard LED wafers; available in two combined-size versions for 2–4 in and 4–6 in wafers.

Overview
Two versions of the full-automatic exposure system are provided to cover different wafer size ranges:

• 2–4 in combined-use type
• 4–6 in combined-use type

Applications
Designed for Micro LED and LED chip exposure processes in R&D labs and production lines.

Specifications

• Tact capacity (first stage): 150 pcs or more per hour
• Tact capacity (second stage): 130 pcs or more per hour
• Alignment accuracy: ≤ 0.5 μm

Technical characteristics

• Automatic wafer handling and mask alignment
• Support for combined wafer sizes: 2–4 in and 4–6 in
• Engineering focused on precise alignment and measured throughput