Large substrate mask aligner

fully-automaticfor production

Overview
Designed for high-definition glass exposure, this system integrates a UV optical layout optimized for fine-pattern exposure and a precision mechanism to parallelize photomask and substrate. Fully automatic operation supports vacuum contact, soft contact and proximity gap exposure modes. Vertical and horizontal configurations accommodate different mask sizes: vertical for large masks (G5 and above), horizontal for G4.5 or smaller.

Use
Suitable for glass processing in FPD, touch panel (TP) and cell fabrication (CF) production lines.

Specification

• Available substrate size: G4.5 - G8.5
• Alignment accuracy: ±1 μm
• Exposure modes: vacuum contact, soft contact, proximity gap

Key features

• UV optical system optimized for high-definition exposure
• High-precision parallelization mechanism for photomask and substrate
• Fully automatic operation with selectable exposure modes
• Configurations: vertical (recommended for G5+) and horizontal (recommended for G4.5 or less)
• Designed for integration into industrial FPD/TP/CF lines