RF attenuator TSX WB2

chip

The TSX Series of chip attenuators pushes the boundaries of Size, Weight and Power in a cost effective, easy to implement surface mount or wire bondable solution, suitable for a wide array of applications. The TSX Series offers excellent broadband RF performance to 50 GHz while delivering increased power handling in a solder mount or chip and wire form factor. The chip attenuator design offers 1 to 3 watts of power handling performance and multiple attenuation values are available for surface mounting. The use of a robust, proven all thin film process technology on an alumina substrate provides a product suitable for harsh environments, such as those of Space and Defense applications. ■ Small form factor - Reduces overall footprint ■ Surface mountable or wire bondable – Ideal for pick and place or chip and wire applications ■ Broad frequency range – Reduces BOM count ■ Low VSWR – Increases transmitted power ■ Wide range of attenuation values – 1-10, 15 and 20d ■ Tight attenuation tolerance – For optimal performance ■ Amplifier Circuits ■ Transmit/Receive Modules ■ Up/Down Converters ■ Instrumentation ■ Satellite Communications ■ Radar ■ 5G