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Temperature testing machine SI CHIP-AA-10
couplingautomatedindustrial

Temperature testing machine - SI CHIP-AA-10 - Suzhou Lieqi Intelligent Equipment Co., Ltd. - coupling / automated / industrial
Temperature testing machine - SI CHIP-AA-10 - Suzhou Lieqi Intelligent Equipment Co., Ltd. - coupling / automated / industrial
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Characteristics

Test type
coupling, temperature
Operating mode
automated
Sector
industrial
Technology
mass
Other characteristics
precision

Description

SI CHIP-AA-10 is a coupling test system developed for SI CHIP coupling verification and designed for industrial-scale mass production. It delivers precise, repeatable coupling and test operations by integrating automated subsystems for motion, temperature control, vision guidance and force feedback.

Main functions and design highlights
  • Independent 6-axis high-precision coupling system supporting accurate positioning and coupling procedures.
  • Stage high-precision temperature control with integrated TEC and chiller for chip thermal management.
  • High-accuracy vision guidance and force-feedback system enabling real-time pressure monitoring at the chip interface.
  • Automated power supply, automatic feeding, zoned unloading and wafer cassette auto-feed for industrial mass production.
  • Independent vibration isolation for coupling/test area and loading area; coupling zone equipped with precision granite and air-bearing isolation for enhanced stability.
  • High compatibility: adaptable to different models via changeable fixtures and corresponding software.

Product highlights
  • Fully automated
  • High compatibility
  • High resolution (0.05 μm coupling resolution)

Application fields
  • Optoelectronics
  • Power devices
  • Microwave/RF components
  • New energy vehicles

Technical specifications
  • Model: SI CHIP-AA-10
  • Coupling process: SI CHIP coupling test
  • Coupling method: micro-motion with instrument display, supported by coupling algorithms
  • Coupling resolution: 0.05 μm
  • Force control range: 10 g – 3000 g
  • Equipment weight: approx. 850 kg
  • Chip temperature control: TEC + chiller
  • Power and probes: chip vacuum adsorption + automatic probe power
  • Feeding and storage: wafer cassette auto-feed + zoned chip storage
  • Vibration design: independent isolation for coupling/test area and loading area; coupling zone uses precision granite and air-bearing isolation
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.