High-accuracy alignment system PIC&SOA-AA-10

automatic

The PIC&SOA-AA-10 is an active coupling system for PIC and SOA assembly, designed to improve product quality stability and production yield by combining precise alignment and efficient process automation. It integrates dual six-degree-of-freedom active coupling mounts with multiple high-precision control and automation functions.

Key features

• Two six-degree-of-freedom active coupling mounting systems for precise alignment.
• Carrier table temperature control: 20–80°C, ±0.5°C.
• High‑precision visual guidance and pressure feedback for closed-loop alignment.
• Automatic, precise dispensing with integrated UV curing capability.
• Efficient air‑float vibration damping system to isolate external vibration and improve yield.
• High compatibility: replaceable fixtures and software switching for rapid model change and industrialized mass production.

Application Area

• Photonics
• Power devices
• Microwave/RF device manufacturing
• New energy vehicle sector

Characteristics / Technical specifications

• Carrier temperature control: 20~80℃, ±0.5℃
• Repeatable positioning accuracy of coupled linear axes: ±100 nm
• Equipment weight: Approx. 650 kg
• Positive pressure source: Pressure ≥ 0.5 MPa; connection diameter: 8 mm
• Negative pressure source: Vacuum degree ≤ -80 kPa; connection diameter: 8 mm; optional vacuum pump
• Additional capabilities: SOA vacuum adsorption + electric‑jaw clamping; automatic zapping probe power supply; PIC temperature‑control fixture with air‑cooled heat dissipation and PIC auto tie probes; end‑pressure feedback; automatic dispensing with automatic UV curing; air‑float vibration damping system.