Flip-chip die bonder HB75

epoxy

With motorized Z - Axis With our Die Bonder HB75 die bonding tasks can be handled with ease and precise. Touch Screen Easy Handling and Control with the 6,5" TFT Our long tested 6,5“control panel provides you with an intuitive entry bonding with our product. All processes are visible for you at any time. 3in1 Bond Head Rotatable Bond Head for changing from dispensing to stamping and placing HB75’s rotation bond head includes a pickup tool, a stamping tool and an epoxy dispenser. Pick & Place with integrated vacuum pump With the HB75, picking up chips or small parts from the die carrier and its placement on the substrate is simple and accurate.