Electronic isolator

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Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white graphite. Material of Boron Nitride Ceramics Pyrolytic Boron Nitride: 99.99% Boron Nitride* UHB: >99.7% Boron Nitride HB: >99% Boron Nitride BC: >97.5% Boron Nitride BAN: Boron Nitride + Aluminum Nitride BMZ: Boron Nitride + Zirconium Oxide BMA: Boron Nitride + Zirconium Oxide + Aluminum Oxide BSC: Boron Nitride + Silicon Carbide BMS: Boron Nitride + Silicon Oxide+Aluminum Oxide BSN: Boron Nitride + Silicon Nitride Processing of Boron Nitride Ceramics Hot Pressed Sintering Chemical Vapor Deposition Applications of Boron Nitrides Ceramics Thermal Management Excellent electrical insulation and thermal conductivity make BN very useful as a heat sink in high-power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide, and other electronic packaging materials, and are easier machinable to desired shapes and sizes. High Temperature Environments Temperature stability and excellent resistance to thermal shock make BN the ideal material in the toughest high-temperature environments such as equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing. Molten Metal Handling BN is inorganic, inert, nonreactive with halide salts and reagents, and is not wet by most molten metals and slags. These characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processes.