Silicon nitride ceramic

aluminum nitridesilicon carbideboron nitride

Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials, this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. It is also called hexagonal boron nitride (HBN) or white graphite. - Material of Boron Nitride Ceramics: - Pyrolytic Boron Nitride: 99.99% Boron Nitride - UHB: >99.7% Boron Nitride - HB: >99% Boron Nitride - BC: >97.5% Boron Nitride - BAN: Boron Nitride + Aluminum Nitride - BMZ: Boron Nitride + Zirconium Oxide - BMA: Boron Nitride + Zirconium Oxide + Aluminum Oxide - BSC: Boron Nitride + Silicon Carbide - BMS: Boron Nitride + Silicon Oxide + Aluminum Oxide - BSN: Boron Nitride + Silicon Nitride - Processing of Boron Nitride Ceramics: - Hot Pressed Sintering - Chemical Vapor Deposition - Applications of Boron Nitride Ceramics: - Thermal Management: Excellent electrical insulation and thermal conductivity make BN very useful as a heat sink in high-power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide, and other electronic packaging materials, and are easier machinable to desired shapes and sizes. - High Temperature Environments: Temperature stability and excellent resistance to thermal shock make BN the ideal material in the toughest high-temperature environments such as equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing. - Molten Metal Handling: BN is inorganic, inert, nonreactive with halide salts and reagents, and is not wet by most molten metals and slags. These characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processes. Comparison of Boron Nitride Ceramics: Properties | Units | BMA | BSC | BMZ | BAN ---|---|---|---|---|--- Main Composition | – | BN+ZR+AL | BN+SIC | BN+ZRO2 | BN+ALN Color | – | White Graphite | Greyish Green | White Graphite | Greyish Green Density | g/cm3 | 2.25-2.35 | 2.4-2.5 | 2.8-2.9 | 2.8-2.9 Three-Point Bending Strength | MPa | 65 | 80 | 90 | 90 Compressive Strength | MPa | 145 | 175 | 220 | 220 Thermal Conductivity | W/m·k | 35 | 45 | 30 | 85 Thermal Expansion Coefficient (20-1000℃) | 10-6/K | 2 | 2.8 | 3.5 | 2.8 Max Using Temperature In Atmosphere In Inactive Gas In High Vacuum (Long Time) | (℃) | 900 1750 1750 | 900 1800 1800 | 900 1800 1800 | 900 1750 1750 Room Temperature Electric Resistivity | Ω·cm | >1013 | >1012 | >1012 | >1013 Typical Application | – | Powder Metallurgy | Powder Metallurgy | Metal Casting | Powder Metallurgy High Temperature Electrical Furnace Components | – | √ | √ | √ | √ Metal Vaporize Crucible | – | √ | √ | √ | √ The Container of Metal or Glass Melting | – | √ | √ | √ | √ The Casting Mould Components of The Precious Metal and Special Alloy. | – | √ | – | – | √ High Temperature Support Part | – | √ | – | √ | √ Nozzle and Transport Tube of The Melting Metal | – | √ | √ | √ | √ Nitrides Sintering (Sagger and Setter Plate) | – | – | – | – | – Remark: The value is just for review, different using conditions will have a little difference. - Technical Specifications / Features: - Microstructure similar to graphite (layered platelets) - Excellent machinability - Low-friction properties - High electrical insulation - High thermal conductivity - Temperature stability and resistance to thermal shock - Inert, nonreactive with halide salts and reagents - Not wetted by most molten metals and slags - Low thermal expansion - Available in various compositions (see above) - Processed by hot pressed sintering or chemical vapor deposition