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Crucible for the semiconductor industry
for molten metal transferfor high-temperature applicationsboron nitride

Crucible for the semiconductor industry - Xiamen Innovacera Advanced Materials Co., Ltd - for molten metal transfer / for high-temperature applications / boron nitride
Crucible for the semiconductor industry - Xiamen Innovacera Advanced Materials Co., Ltd - for molten metal transfer / for high-temperature applications / boron nitride
Crucible for the semiconductor industry - Xiamen Innovacera Advanced Materials Co., Ltd - for molten metal transfer / for high-temperature applications / boron nitride - image - 2
Crucible for the semiconductor industry - Xiamen Innovacera Advanced Materials Co., Ltd - for molten metal transfer / for high-temperature applications / boron nitride - image - 3
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Characteristics

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pyrolytic boron nitride (PBN), for high-temperature applications, boron nitride, for molten metal transfer, for the semiconductor industry

Description

Overview
  • INNOVACERA manufactures a wide range of PBN ceramic components including discs, sheets, filament rings, VGF crucibles, LEC crucibles, MBE crucibles, conical crucibles and custom-machined parts.


Material and Manufacturing
Pyrolytic Boron Nitride (PBN) is produced by chemical vapor deposition (CVD) from hexagonal boron nitride (hBN). The CVD process aligns BN crystallites parallel to the substrate, delivering ultra-high purity (≈99.99%) and a layered microstructure. Typical maximum wall thickness for CVD PBN is 3 mm; the material offers high mechanical strength suitable for high-vacuum and molten-metal use.

Applications
  • Vacuum furnace components
  • Crystal growth crucibles (including MBE crucibles for GaAs production)
  • Molecular Beam Epitaxy (MBE) processes
  • High-vacuum and molten metal environments


Key properties
  • Anisotropic thermal conductivity
  • High electrical insulation and strong dielectric strength over a wide temperature range
  • Ultra-high purity (≈99.99%)
  • Non-wettability and chemical inertness
  • Non-toxic
  • Resistance to high temperatures and thermal shock


Technical specifications
  • Material: Pyrolytic Boron Nitride (PBN) derived from hexagonal boron nitride (hBN)
  • Manufacturing: Chemical Vapor Deposition (CVD)
  • Purity: ≈99.99%
  • CVD structure: crystallites aligned parallel to substrate
  • Maximum typical wall thickness (CVD): 3 mm
  • Mechanical: high mechanical strength suitable for vacuum environments
  • Thermal: anisotropic thermal conductivity; resistant to high temperatures and thermal shock
  • Electrical: high insulation resistance and strong dielectric strength over a wide temperature range
  • Chemical: non-wettable, chemically inert, non-toxic
  • Typical product forms: discs, sheets, filament rings, VGF crucibles, LEC crucibles, MBE crucibles, conical crucibles, custom-machined parts

Catalogs

Other Xiamen Innovacera Advanced Materials Co., Ltd products

Boron Nitride Ceramic

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