Product DescriptionPorous silicon carbide (SiC) ceramic discs engineered for precision vacuum adsorption and air‑floating (air bearing) applications in semiconductor and advanced manufacturing environments. SiC material provides high hardness, thermal conductivity and chemical resistance to maintain stable vacuum holding force and uniform airflow distribution for non‑contact handling of wafers, panels and thin substrates.
Product SpecificationsFormula: SiC
Form: Disc
Material: Porous silicon carbide ceramic
CAS Number: 409-21-2
Commodity: Porous ceramic discs
Typical Applications- Semiconductor vacuum chuck systems (wafer grinding, wafer dicing, printing chucks)
- Vacuum chuck cleaning
- Transfer and handling vacuum chucks
- Precision air bearings and air‑floating platforms
- LCD and OLED display panel manufacturing
- Semiconductor microelectronics processing
- Mobile phone glass and panel handling
- Thin‑film processing
- Laser processing platforms
- Printing and coating systems
- Photovoltaic and solar cell production
Key Features- Uniform and stable porous structure for consistent performance
- Reliable vacuum adsorption suitable for wafer handling
- Even airflow distribution for air‑floating applications
- Enables non‑contact, low‑damage handling of delicate substrates
- High dimensional accuracy with tight tolerances
- Designed for cleanroom and high‑clean manufacturing environments
Specifications & Variants- Standard example: D80×2 mm (other diameters and thicknesses available)
- Multiple pore structures (typical pore sizes: 15 µm; also available: 30 µm)
- Consistent pore distribution across variants
Specifications / Tolerances (Disc)Thickness: 2 mm ±0.1 mm
Outer diameter: 80 mm ±0.1 mm
Physical PropertiesDensity (g/cm³): 2.0 - 2.2
Mechanical PropertiesHardness (HRA): ≥ 40.00
Technical Characteristics- Available diameters and thicknesses on request (example shown: D80×2 mm)
- Typical packaging: 1 piece per unit (custom packaging available)
- Color: grey (shades may vary)