Product descriptionThis rectangular porous alumina (Al2O3) ceramic plate is engineered for precision vacuum adsorption and air bearing (air floating) applications in semiconductor and advanced manufacturing environments. Its uniform porous structure ensures consistent vacuum holding force and even airflow distribution to enable non-contact, low-damage handling of wafers, panels and thin substrates. The plate is suited to high-cleanliness, high-precision production lines and display manufacturing processes.
Product specificationsFormula: Al2O3
Form: Plate
Material: Porous alumina ceramic
CAS Number: 1344-28-1
Commodity: Porous ceramic plate
Specifications / TolerancesLength: 400 mm ±0.1 mm
Width: 300 mm ±0.1 mm
Thickness: 4 mm ±0.1 mm
Typical Applications- Semiconductor vacuum chuck systems (wafer grinding vacuum chuck, wafer dicing vacuum chuck, printing vacuum chuck)
- Cleaning and maintenance of vacuum chucks
- Transfer and handling vacuum chuck for wafer/panel transport
- Precision air bearing and air floating platforms
- LCD and OLED display panel manufacturing
- Semiconductor microelectronics processing
- Mobile phone glass and panel handling
- Thin film and coating processing
- Laser processing platforms
- Printing and coating systems
- Photovoltaic and solar cell manufacturing
Key Features- Uniform and stable porous structure for predictable performance
- Reliable vacuum adsorption suitable for wafer handling
- Even airflow distribution for air bearing/air floating use
- Enables non-contact handling to minimize damage
- High dimensional accuracy and tight tolerances
- Designed for cleanroom and high-clean manufacturing environments
- Large rectangular format to accommodate bigger wafers or panels
Physical PropertiesDensity: 2.3–2.5 g/cm³
Mechanical PropertiesHardness (HRA): ≥ 50.00
Technical characteristics- Chemical formula: Al2O3
- Standard dimension: 400 × 300 × 4 mm (tolerance ±0.1 mm)
- Pore size (example variant): 30 µm
- Color (example variant): Light brown
- Package quantity: 1 pc per unit
- SKU (example variation): 69296-00001-1068
- Typical density range: 2.3–2.5 g/cm³
- Hardness: HRA ≥ 50
- Intended use: semiconductor vacuum chuck, air bearing/air floating platforms, wafer/panel handling in high-clean environments