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Ceramic vacuum chuck
workpiecefor grindingfor metrology

Ceramic vacuum chuck - Xiamen Innovacera Advanced Materials Co., Ltd - workpiece / for grinding / for metrology
Ceramic vacuum chuck - Xiamen Innovacera Advanced Materials Co., Ltd - workpiece / for grinding / for metrology
Ceramic vacuum chuck - Xiamen Innovacera Advanced Materials Co., Ltd - workpiece / for grinding / for metrology - image - 2
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Characteristics

Specifications
ceramic
Applications
for grinding, workpiece, for metrology, for polishing

Description

Product overview
In semiconductor, optics and high-precision electronic manufacturing, stable workpiece clamping and damage-free transfer are critical. Traditional porous metal vacuum chucks present limitations in uniformity, cleanliness and long-term stability. The new-generation ceramic-metal composite microporous vacuum chuck combines a high-performance microporous ceramic adsorption layer with a metal flange base to optimize functional performance and structural strength.

01 The key role of the microporous ceramic adsorption surface
The adsorption surface uses high-purity alumina (Al2O3) or silicon carbide (SiC) microporous ceramic materials, precisely sintered to form a uniformly distributed microporous structure. This enables:
  • Uniform vacuum pressure distribution to avoid localized stress concentration
  • Stable, scratch-free support for wafers, glass and thin-film substrates
  • High surface cleanliness to reduce particulate contamination risk

02 Structural reinforcement design of the metal flange base
The microporous ceramic layer is bonded to the metal flange via high-vacuum brazing sealing, forming an integrated vacuum adsorption unit. The metal flange provides:
  • High mechanical strength and impact resistance
  • Improved installation and interface compatibility
  • Optimized sealing paths to reduce leakage risk

03 Comparative analysis of traditional metal porous chucks and ceramic-metal composite chucks
  • Pore uniformity: Traditional metal porous chucks show large deviation and uneven distribution leading to local pressure differences; ceramic-matrix microporous surfaces deliver uniform micropore arrangement and consistent full-area negative pressure
  • Surface cleanliness: Metal surfaces are prone to oxidation and particle shedding, risking contamination; ceramic surfaces are chemically inert without impurity precipitation, suited for high-cleanliness environments
  • Wear resistance: Metals have lower surface hardness and can wear or deform over time blocking pores; ceramic surfaces are high-hardness, wear- and aging-resistant, extending service life
  • Workpiece adaptability: Metal surfaces can scratch thin sheets and wafers causing warpage; smooth ceramic surfaces enable damage-free clamping compatible with precision thin workpieces
  • Structural stability: Metal porous chucks may deform and leak under long-term high-frequency operation; integrated ceramic-metal composite structure offers strong impact resistance and airtightness
  • Application scenarios: Metal porous chucks suit general processing and cost-sensitive mass production; ceramic-metal composites are designed for high-precision semiconductor, optics and high-end electronics processes

04 Application value in precision manufacturing
Ceramic-metal composite microporous vacuum chucks are used in:
  • Semiconductor wafer handling and alignment
  • Flat panel display (LCD/OLED) substrate processing
  • Fixturing for optical lens grinding and polishing
  • High-precision processing of ceramic and thin-film materials

Conclusion
As semiconductor and precision manufacturing advance, vacuum gripping technology evolves toward ceramic composite structures. Ceramic-metal composite microporous vacuum chucks combine material and structural design to deliver more stable, cleaner adsorption solutions for high-precision production processes.

Technical characteristics / specifications
  • Adsorption material: high-purity alumina (Al2O3) or silicon carbide (SiC) microporous ceramic
  • Manufacture: precise sintering to achieve uniform microporous structure
  • Composite structure: ceramic functional surface bonded to metal flange via high-vacuum brazing sealing
  • Key benefits: uniform vacuum distribution, high surface cleanliness, scratch-free support, high wear resistance
  • Metal flange functions: mechanical reinforcement, impact resistance, installation/interface compatibility, optimized sealing paths
  • Typical applications: semiconductor wafer handling, LCD/OLED substrate processing, optical lens fixturing, thin-film and ceramic processing

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.