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Axiom X-1020 Dispensing System
The Axiom%u2122 X-1020 system is designed to meet high-volume dispensing requirements for inline semiconductor package and printed circuit board assembly. The X-1020 system offers precise control over positioning accuracy using sealed glass manufacturer of linear encoders.
Features
- Provides enhanced fluid dispensing control with choice of jet or pump: DJ-9000 DispenseJet, DP-3000 linear volumetric pumps and DV-7000 Heli-flow%u2122 pumps
- Supports a full range of applications, including flip chip and CSP underfill, dam and fill, die attach, and thermal compounds
- New, unique CAN bus architecture for efficient operations now, and simplified integration for future improvements
- Closed-loop linear-encoded X-Y positioning system manufacturers with fast-motion acceleration ensures high throughput
- All new and enhanced pattern recognition system with red/blue LEDs for a larger dynamic range of lighting
- No periodic calibration required
- No special needles required
- Backwards-compatible software %u2013 customers can use existing dispensing programs
- Many Asymtek pumps already work with the X-1020 %u2013 protecting investments in pumps and cocks
Recommended Applications
- Underfill for flip chip and chip scale packaging
- Chip Encapsulation
- Dam and Fill
- Solder Paste
- Thermal Compounds
Productivity Enhancements
- Dual Lane Configuration
- Loaders/Unloaders
- Film-Frame Wafer Handler
- Dual-Action Dispensing
- Dual-Simultaneous Dispensing
- Low Fluid Sensors
- Custom Heated Tooling (impingement or contact)
- Process Development Hot Plate
- SECS/GEM Interface Software
- Slim Line Height Sensor |
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| Sinergo as a result of hard work and daily study of the most varied brazing applications makes completes assembling, welding, testing and stamping systems, art the customer's specific request. The designing and manufactoring of both professional software and electronic-mechanical components are carried out by Sinergo itself. |
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High performance automatic machine for drilling and routing of printed circuits boards
UltraSpeed Machine fitted with individual Z axis per professional spindle and a spindle per station, supplied by a chain driven
tool magazine.
UltraSpeed D Machine fitted with individual Z axis per spindle and two spindle per station (DUAL), for the simultaneous
machining of two identical images (STEP & REPEAT), offset along the X axis, supplied by a chain driven
tool magazine.
UltraSpeed C Machine fitted with individual Z axis per spindle and a spindle per station, supplied by a tool magazine
with removable cassette. |
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Bondjet BJ820
The Bondjet BJ820 is the latest development of Hesse & Knipps' wedge bonding innovation, handling all challenging wire bonding applications on a single platform - RF and microwave devices, COB, MCM and hybrids, fiberoptics and automotive using aluminium or gold wire or ribbon.
High Speed Fine Pitch Wedge Bonder
Precision:
- 1 μm at 3 σ axis repeatibility at an interpolated professional encoder resolution of 20 nm
Largest Bonding Area
- 305 mm x 410 mm (12'' x 16,1'') work area can serve as two or mor smaller stations for efficient handling of smaller products or substrates, eliminating index time and maximizing throughput
- Enables intelligent automation of extra large products
Speed:
- Up to 7 wires per second
Quality:
- Consistant performance for the highest yields
- Realtime bond quality professional monitoring system
- Wear- and maintenance free piezo bondhead with solid state professional hinges
- Professional software supports control by host computer, product traceability and external statistical analysis
Small footprint, big capability:
- Integrates easily into complex machining lines |
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Bondjet BJ920
The Bondjet BJ920 is a nex development in heavy wire bonding. Hesse & Knipps has designed a bonder available with integrated pull and shear test, a high speed and accuracy and largest bonding area which is presently unique in the market. Advanced features available only on Bondjet BJ920 and enhanced quality control systems serve to meet your customers' requirements and greatly enhance productivity.
Advanced Features:
- E-Box: patent-pending solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge
- Quality monitoring by high resolution deformation and transducer current measurement
- Program upload and download via LAN
- Flexible multi-lane handlers
Integrated Non-destructive Shear and / or Pull Test:
- Fast shear test with less stress for the connection than pull test
- Programmable pull test for each wire
Speed:
- 450 ms per wire (300 μm diameter, 8 mm loop length, 4 mm loop height)
Accuracy:
- 10 μm at 3 σ repeatibility at each position in the large work area
- 7 μm pattern recognition system accuracy
Largest Bonding Area:
- Up to 380 mm x 500 mm (15'' x 19.7'')
Bondhead Highlights:
- Maintenance-free solid state joints
- Active cutting bondhead with extended cutter lifetime
- No pusher provides better access into tight packages
- Closed loop force control, programmable from 0 to 1400 cN
- Touchdown and deformation sensor without signal delay |
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| performs low-profile (fine pitch) interconnects and is also well suited for running stitch interconnects, reverse bonding, and ribbon bonding. It performs high speed, fine pitch automatic gold and aluminum wedge bonding, and gold ribbon bonding. |
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Model 522A is a Thermosonic Ball Bonder for wires from 0.7mil (18µm) to 2.0mil (50µm) in diameter featuring HYBOND’s exclusive Soft Touch TM force ramping system. Imitated but never duplicated, the Soft Touch™ system bonds effectively with less trauma to sensitive materials like GaAs and InP. Wire control is provided by a motorized feed system which features front panel adjustment for tail length and a swing away workholding assembly which makes threading wire easier. Front panel controls include independent 1st and 2nd bond dials for U/S, Time & Force as well as a built in work stage temperature controller manufacturer. The 522A has a proven track record of safe and effective wire bonding worldwide.
Other Ball Bonder models available are the 522A with option 18 (OP-18) for deep access, 522A-40 for deep access and long reach and the 626 with motorized vertical movement and capability to wedge bond, peg bond and bump bond.
Please contact us at mailus@hybond.com for more detailed information. |
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# The model 844USB is a great low cost USB interface programmer designed for anyone who wants to read, copy, program or burn common IC’s. USB 2.0/1.1 Interface
# 40 pin DIL ZIF (Zero Insertion Force) socket accepts both 300/600 mil devices up to 40 pins
# Small, fast and powerful programmer
# In circuit serial programming (ISP) capability
# Easy to use control program, Windows 95/98/Me/NT/2000/XP compatible |
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Conformal Coating
When it comes to conformal coating operations, PCB manufacturers are continually challenged by the need to balance throughput, materials and labor investments, while also addressing the regulatory and environmental concerns associated with the process. Traditional methods for applying conformal coatings, such as dipping and air spray, have always been expensive in terms of materials and labor. The expense of solventless conformal coating materials has driven costs even higher.
Asymtek's selective coating systems provide a host of advantages for manufacturers at every level of production from batch to high-volume, in-line processing. These flexible, programmable, integrated coating and curing systems provide precise application of conformal coating and IR/convection or UV curing. A choice of patented dispensing heads allows systems to be configured to meet specific customer coating requirements. The result is cost savings, increased throughput and productivity. In addition, the elimination of VOC emissions delivers a rapid return on investment.
Dispensing System
C-740 and C-741 Century® Selective Conformal Coating System
C-341 Century® Selective Conformal Coating System
Coating Applicators
SC-400 PreciseCoat%u2122 Applicator
SC-300 Swirl Coat%u2122 Applicator (Pictured Top-Right)
SC-105/205 Film Coater Module
Swirl Coat Module
Control Coat Dispensing Module
Productivity Enhancements
Four-Position Tilt Accessory
Industrial laser Professional fan Width Control
Viscosity Control System
IR/Convection Module
Flow Monitoring
Select Cure UV-6 Cure® Module
Select Cure UV-5 Cure® Module |
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Nordson systems help manufacturers of electronic products improve gasketing, bonding and sealing applications using automated, precision-dispensing technologies.
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Jetting is the best way to dispense many fluids quickly and accurately. It is non-contact and has a high shot-generation rate. . Jetting offers many advantages over traditional industrial needle dispensing to deliver speed, quality, and low cost of ownership. The DispenseJet DJ-9000 can be cleaned in a few minutes, and has fast changeover of wetted parts The DispenseJet DJ-9000 is for use exclusively on Asymtek automated dispensing systems.
Features
- Jets a wide range of fluids including underfill, SMA, encapsulants, conformal coating, UV industrial adhesives and silver epoxy
- Fast - jetting eliminates z-axis motion
- Accurate - jetting is highly repeatable
- Easy to use and maintain
- Small wetted path so less fluid is wasted
- One model handles multiple applications
- Dot diameter as small as 200 manufacturer of micrometers (0.008 in.), compatible with typical 0402 components |
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In spite of all accuracy in the production process the repair / reworking of electronic PCBs belongs to the daily business. Relating to the components and used circuit boards (double-sided, Multilayer etc.) there are different requests imaginable. Also the quantity, in other words the complete quantity of repairs plays a decisive role. Beside the processes Dispensing, Placing and Soldering the process Removing und Cleaning of components is certainly added. Our µPlacer is a complex rework system, which considers all these elements with high precision.
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| HYBOND’s Model EDB-140A is a semiautomatic epoxy/silver glass chip bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement. The EDB-140A can be fitted with a waffle pack/jel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with Hybond’s micro-dispense head for extremely low volume epoxy dispensing. This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual PROFESSIONAL CCTV industrial cameras and a split screen monitor which incorporates a die and package visual targeting system. The EDB-140A is modular and easily adapts to modifications to accommodate fixturing for custom packages. |
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Designed for 300mm wafer processing, the Despatch AST-1100 also accommodates 200mm wafers. This automated photoresist bake tool increases throughput and eliminates handling errors while conserving valuable floor space.
Thermal Data - The Despatch AST-1100 Automated Photoresist Bake Tool provides tight temperature uniformity. The tool maintains uniformity of +/-1.0°C within each wafer and throughout all 25 wafers in the thermal chamber at soak.
Increase Throughput, Eliminate Errors, and Improve Ergonomics - Utilizing Despatch's automated wafer handling unit will eliminate costly errors, improve ergonomics, and boost throughput. This process eliminates manual handling of 300mm wafers that exceed the weight limit for repetitive human handling, set by OSHA. The professional oven's two chambers each hold up to 25 wafers during the process cycle. Despatch can add additional heat chambers to increase throughput.
Conserve Valuable Wash room Space - The Despatch 300mm oven measures approximately 103 inches (262 cm) wide by 88 inches (224 cm) long. Its small footprint will minimize clean room space needed and maximize your production environment. Compatible with either ballroom or bulkhead mounted installations.
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| is designed for fully automatic, precision microelectronics assembly and performs professional adhesive dispense, pick and place component placement, eutectic die attach, and flip chip operations. This versatile machine is well suited for a high mix, low volume production environment, and can easily be configured for high volume production by adding automated handling capabilities. |
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DATRON dispensing systems
High precision and process security at short set-up and cycle times
The increasing economic demands in the area of dispensing require precise, process-sure and flexible system engineering. DATRON dispensing systems were specially developed for industrial bonding, sealing or EMC applications and have earned customer confidence with their high performance and high volume consistency.
DATRON dispensing systems offer the highest possible process security and flexibility with its combination of electronic dispensing head with the patented control engineering. The use of special professional software technology allows speed-independent dispensing, which ensures high dispensing speeds and short cycle times. Also, these systems work independently of pressure and viscosity, so that process parameters don't need to be adjusted due to modified manufacturing conditions. In connection with the accessories developed for dispensing tasks, DATRON offers system solutions from one source to guarantee optimum quality for your manufacturing.
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4550
Flying Probe Professional test system
The new 4550 provides a powerful and flexible solution for today's test needs. With its fixtureless environment, the 4550 combines incredible speed with extremely high accuracy probing. Add the ability to perform advanced test techniques and the 4550 becomes the number one choice for both prototype and production test. Using the latest in flying probe hardware technology and innovative software techniques, the 4550 ensures short turnaround times for all applications guaranteeing cost effective test solutions.
• High speed, high accuracy fixtureless test
• Short program development times
• Improved test accessibility
• NetzTest intelligent shorts test
• Up to 1012 additional test channels
• Enhanced optical inspection
• Comprehensive toolkit of test techniques
• Optimization in X, Y and Z planes
• Suite of UUT change tools
• Integral manufacturers of conveyor system
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Advantages of Ultrasonic Flip Chip Bonding against Lead/Professional adhesive Process
In comparison to other flip chip processes the ultrasonic process allows a four to five times higher contact density. Only one process step is needed for the chip attach. This process guarantees extremely high mechanic stability and termal strength for the connections. It is a so called "clean process" (no adhesive, monometallic connections, leadfree process).
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| The Uni-Slide stand-alone product line is a system concept with a linear product movement. The product is safely and accurately loaded, aligned and unloaded in the front position of the slide, and processed in the rear position. The linear slide is manual operated |
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Integrated, In-line Diffusion System - DCF Series
Integrated, In-line Diffusion System
The new, Integrated, In-line Diffusion System is Despatch's latest addition to the company's photovoltaic product portfolio. The new in-line diffusion systems are designed to consistently deliver highly homogeneous emitters that are critical for creating high efficiency professional solar cells.
The production of the DCF Systems represents an important advance in the solar cell manufacturing process by integrating the following into one single piece of equipment:
A patent-pending, in-line phosphorus doper that utilizes top and bottom spray technology
An infrared diffusion furnace featuring a patent-pending thermal processing chamber
Critical process technology
The new integrated systems are recognized for superior thermal processing control, improved cost of ownership, value-added feature sets and ease of maintenance. These special features provide customers with high throughputs and maximum yields.
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Model 616A Peg Bonders are used for ultrasonic bonding of bare wires, insulated wires, copper leads, gold ribbons, gold coated copper flex leads, coining bumps and other applications that do not require the wire be fed by the machine. Bare wire diameters equal to or smaller than 75um, insulated wires up to 51um and flat conductors up to 25um x 500um can be bonded with the 616A.
The 616A has a series of seven different configurations that allow it to fit into existing production units, single work benches or new production lines.
For more information, please contact us at mailus@hybond.com. |
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Complete Applications Coverage
Our evolving line comprises mid dose, high dose, and high energy platforms designed to address the continued scaling trends of implant applications to lower energy ranges. This means we have the technology to cover all critical implant applications - including all existing and emerging needs of the 65nm era and beyond. In addition, our platform is designed to provide a high degree of process overlap to provide both back up capability, and improved system ultilization... |
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DJ-9100 DispenseJet® Valve
HIGH-SPEED JET DISPENSING FOR LIQUID INDUSTRIAL CRYSTAL FLUIDS
Dispense Liquid Crystal (LC) fluids quickly and accurately with the DJ-9100 jet. Fast, simple and more accurate, the DJ-9100 jet is based on Asymtek%u2019s standard DJ-9000 design. Jetting offers advantages over other LC dispensing methods and delivers better quality, increased flexibility and a low cost of ownership.
Speed: High flow rate %u2013 20 mg or more per second with a high shot rate up to 200 dots per second
Fluid Handling: Bottled LC material is fed directly rather than first transferred to a industrial syringe, eliminating potential contamination and minimizing fluid waste
Cleaning: Quick and easy to clean in ten minutes or less
Quality: High wet-dispense accuracy; multiple dots jetted precisely where needed for One Drop Fill (ODF) of liquid crystal material
Avoids common hidden expenses: Easier and cheaper to operate
Other advantages include:
Jet small dots that promote wetting and allows for complex patterns impossible with other cocks
Weighs material automatically, the professional dispenser adjusts automatically
Minimal wetted parts
Automatic tip cleaning and purge
Calibrated Process Jetting (CPJ%u2122 ) ensures volumetric repeatability during long production runs to improve process capability (Cpk). Dispense patterns are programmed with a specified weight. CPJ periodically samples the dispense weight per dot and computes the number of dots for each pattern. With this data, CPJ optimizes line speed based on the maximum specified shot interval.
Features
Up to 7 times faster than other valves
Eliminates setup complexities associated with multiple pump configurations
Designed for LC fluids
Fewer disposable parts
Avoids contamination of LC fluids while feeding to the jet
Platforms
FPD G-5000 - Flat Panel Display Dispensing System |
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- Professional diodes professional laser
- Laser power: 60, 90 or 120W
- Surface of the focal point 1 x 1.2mm
- Precision of the wire in-feed ± 2,5%
- Diameter of the soldering wire from 0.46 - 1.6mm
- Wire alloy leaded or lead free
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Machines for electronics production
