UV laser marking machine TH-UVLMS series

glassfor siliconplastics

Product description
Designed for high-precision marking and micro-processing on glass, polymer materials and other substrates, the TH-UVLMS series (355 nm) performs surface marking, microporous drilling and coating removal on metal and non-metal surfaces. Typical applications include marking on packaging bottles and boxes, flexible PCB, LCD/TFT scribing and cutting, and silicon wafer micro-hole processing.

Features

• High photoelectric conversion 355 nm ultraviolet laser with selectable output power per model (3 W–15 W at 50 kHz).
• Advanced hardware control and intelligent software for low energy consumption, stable operation and high-precision marking.
• Full PC control with intuitive interface; compatible with common graphics and marking software for easy data input and job management.
• Ultra-fine spot and precise beam quality suitable for electronic precision processing and micro-drilling of specialized materials.

Specifications (table)
Device model: TH-UVLMS3 / TH-UVLMS5 / TH-UVLMS8 / TH-UVLMS10 / TH-UVLMS15
Laser wavelength: 355 nm
Laser power: 3 W@50 kHz / 5 W@50 kHz / 8 W@50 kHz / 10 W@50 kHz / 15 W@50 kHz
Marking range: 100 × 100 mm (optional)
Minimum character height: 0.15 mm
Marking speed: ≤ 7000 mm/s
Positioning repeatability: ±0.003 mm
Minimum line width: 0.01 mm (depends on material) @ F=160 mm
Beam quality: ≤ 1.3
Pulse repetition frequency / single pulse energy (examples): 30–150 kHz / ~100 μJ / 267 μJ / 250 μJ / >300 μJ
Overall power consumption (by model): 1000 W / 1000 W / 2500 W / 3000 W / 3000 W
Cooling method (by model): Air cooling / Water cooling / Air cooling / Water cooling / Water cooling

Sample display
Sample images illustrate typical marking results and application examples for UV laser marking on various materials.

Technical characteristics

• Product name: UV Laser Marking Machine
• Product ID: 1475857206505787392
• Model / Series: TH-UVLMS series
• Laser wavelength: 355 nm
• Available laser power options: 3 W, 5 W, 8 W, 10 W, 15 W (specified at 50 kHz)
• Typical marking area: 100 × 100 mm (optional)
• Minimum character height (typical): 0.15 mm
• Maximum marking speed: ≤ 7000 mm/s
• Positioning repeatability: ±0.003 mm
• Minimum line width (material dependent): 0.01 mm (tested @ F=160 mm)
• Beam quality: ≤ 1.3
• Pulse repetition frequency (typical): 30–150 kHz
• Pulse energy examples (varies by model): approx. 100 μJ / 267 μJ / 250 μJ / >300 μJ
• Overall power consumption (varies by model): from 1000 W up to 3000 W
• Cooling: air cooling or water cooling depending on model/configuration