Laser marking machine FLMS series

Nd:YAG laserUV laserfor silicon

Product name
This equipment is mainly aimed at the etching processing of graphics and logos in semiconductor wafers, and uses precise positioning and identification systems to realize automatic identification of processed parts. Widely used in graphics and logo etching in wafers.

Features

• Designed for graphics and logo etching on semiconductor wafers.
• Uses precise positioning and recognition (CCD contour positioning) to automatically identify workpieces.
• Supports automatic pick-and-place using multi-axis robots or handling modules to achieve fully automatic processing.
• Wide application in wafer graphics and logo etching processes.

Sample display

• Wafer marking sample
• Wafer grooving sample

Specifications (table)
Device model | Laser type | Laser wavelength | Laser power | Standard Position Accuracy | Reclaimer | Targeting | Machine Dimensions | Laser service life
TH-JYA-FLMS20 / TH-JYB-FLMS20 | Infrared IR | 1064nm | 20W / 30W | ±0.1mm | Six axis manipulator | CCD contour positioning (CCD) | 1200x1600x2000mm | 100,000 hours
TH-JYB-FLMS3 / TH-JYB-FLMS5 | UV | 355nm | 3W / 5W | ±0.1mm | Multi-Axis Servo Module | CCD contour positioning (CCD) | 1280x850x1700mm | 15,000 hours

Notes
Commodity ID listed on the source: 1475857210771394560.

Caractéristiques / spécifications techniques

• Product: Fully Automatic Wafer Laser Marking Machine
• Available device models: TH-JYA-FLMS20, TH-JYB-FLMS20, TH-JYB-FLMS3, TH-JYB-FLMS5
• Laser types: Infrared (IR) and UV
• Laser wavelengths: 1064 nm (IR), 355 nm (UV)
• Laser power options: 3W, 5W, 20W, 30W
• Standard positioning accuracy: ±0.1 mm
• Reclaimer/handling: Six-axis manipulator (IR models) or Multi-Axis Servo Module (UV models)
• Targeting / positioning system: CCD contour positioning (CCD)
• Machine dimensions (approx.): IR models 1200 x 1600 x 2000 mm; UV models 1280 x 850 x 1700 mm
• Laser service life: IR models ~100,000 hours; UV models ~15,000 hours
• Typical applications: Graphics and logo etching/marking on semiconductor wafers; automated pick-and-place and full automatic processing