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ERmet ZD connectors were specially developed for differential high-speed signal transmission in telecom applications with data rates of up to 10Gbits/sec.
This robust, high quality modular connector system is just as well-suited for use in conjunction with the 2mm HM (IED 61076-4-101) ERmet line of connectors.
The inline design of the signal and ground contacts makes simple, economic routing (conductor track routing) possible. Signal and ground contacts have different connection levels with a gap of 1.5mm, thus ensuring a safe connection. In addition, the contacts are assembled into a robust housing.
The ERmet ZD connector utilizes an optimal grid construction that reduces signal interference and offers ample room for conductor track routing. Its optimized design and effective shielding allow the ERmet ZD system to exhibit superb performance when it comes to crosstalk and reflections.
The ERmet ZD connector has been selected as the backplane interconnect for the PICMG 3.x (ATCA) industry standard.
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ERmet ZD connectors were specially developed for differential high-speed signal transmission in telecom applications with data rates of up to 10Gbits/sec.
This robust, high quality modular connector system is just as well-suited for use in conjunction with the 2mm HM (IED 61076-4-101) ERmet line of connectors.
The inline design of the signal and ground contacts makes simple, economic routing (conductor track routing) possible. Signal and ground contacts have different connection levels with a gap of 1.5mm, thus ensuring a safe connection. In addition, the contacts are assembled into a robust housing.
The ERmet ZD connector utilizes an optimal grid construction that reduces signal interference and offers ample room for conductor track routing. Its optimized design and effective shielding allow the ERmet ZD system to exhibit superb performance when it comes to crosstalk and reflections.
The ERmet ZD connector has been selected as the backplane interconnect for the PICMG 3.x (ATCA) industry standard.
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The high-speed SMT connector Microspeed with the pitch 1.0mm is especially designed for modern board-to-board applications in telecom and datacom equipments with data rates up to 10 GBit/s. MicroSpeed features differential signal transmission with a impedance of 100 Ohm or single ended signal transmission with a impedance of 50 Ohm. Two different signal contact arrangements are possible. For improved crosstalk parallel signal ports are recommended. A excellent signal integrity is achieved by a design with 2 signal and 2 shield contact rows. The termination area of the shield contacts is available in 2 options: SMT or THR (Thru Hole Reflow).
For fully automatic SMT assembly the connector features:
- Tape and reel packaging
- Black high-temperature insulator for fast and reliable visual recognition.
- Integral pick and place surface for easy grip with a vacuum pipette
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Top-mounting connector supporting 5 memory card types: SmartMediaTM, MEMORY STICK DUO, SD Memory Card, MultiMediaCard, and xD-picture card
Width 54.2mm / Length 46.35mm / Height 10.5mm
Write-protect switch and card-detect function adopted
Polarized connector preventing mis-mating
RoHS compliant
Pb-free mounting
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BASICS+
Basics+ brings together our proven, standard connectors for board-to-board and wire/cable-to-board applications. Our goal is to save you time by providing “Easy To Use” services. All services are accessible via the dedicated Basics+ web site : www.fciconnect.com/basics
EASY TO SELECT A PRODUCT
This catalogue provides an easy overview of the most standard Basics+ products. For even more choice, our web catalogue provides the step search possibility that guides you step-by-step to your part number
EASY TO GET DOCUMENTATION
Data sheets, product drawings, specifications, application notes, packaging drawings and more are available on the web site for download.
EASY TO GET TECHNICAL SUPPORT
Get your technical questions answered within 24 hours on our e-mail hotline basics.help@fciconnect.com
EASY TO GET SAMPLES
Order a sample today, and you can start to work with your Basics+ product right away! Sample orders can be placed via the web site.
EASY TO GET COMMERCIAL INFORMATION
As a customer, you can have registered online access to prices, packaging quantities, minimum order quantities, and lead times. All the commercial information you need is at your fingertips.
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Available in 4 through 32 circuits Insulator material : glass filled nylon 6-T UL 94V-0 contact material: dual contact in phosphor bronze Tin –lead plated contact with kink tail . Low insertion force .Accommodated 0.30mm FFC /FPC thickness
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Tyco Electronics' HXC125 Board-to-Board Connectors offer a high performance, high density interconnect for today's design challenges.
Connectors are available in 1mm to 4mm heights, with centerline spacing as low as 1mm. This solderless, compression system allows for ease of assembly while offering excellent power management capability. Standard 1.0 mm contacts are rated to 4 Amps each.
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Winchester Electronics offers a comprehensive line of pre-assembled press-fit Edgecard connectors for backplane applications that features Winchester's proven, reliable, and industry leading C-Press compliant pin technology.
Winchester Electronics Edgecard product line is available in a variety of contact centerline spacings, contact pair position sizes, and contact tail lengths. Additional options include bifurcated or non-bifurcated contacts, standard or high scoop insulators, .415-, .350-, or .300- inch card slot depths, and closed-ended or open-single-ended connectors.
All Edgecard connectors are designed to be seated into .093 inch minimum thick backplanes and to mate to double-sided PCBs ranging in thickness between .054 - .071 inch.
- "A" Grid, NK & NJ Series, .100 X .100 inch
- "B" Grid, 276 Series, .125 X .125 inch (Early/Late Make and Shorting Contacts)
- "C" Grid, MK, NK, MJ, & NJ Series, .100 X .200 inch
- "D" Grid, MK, NK, MJ, & NJ Series, .125 X .250 inch
- "E" Grid, MK, NK, MJ, & NJ Series, .156 X .200 inch
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When space is at a premium, our board-to-board connectors are the perfect solutions. Proven reliability combined with design flexibility provide effective results for even the most demanding SMT and thru-hole applications.
Featured with :
- available in .050" (1.27mm), .079" (2mm), and .100"(2.54mm) pitch
- high density, low-profile interconnects
- high quality screw-machined terminals offer reliable electrical/mechanical interconnects
- wide variety of terminals and plating options
- mezzanine board applications
- unique solder preforms allow multi-tier Z-axis expansion
- RoHS Compliant insulators with either Gold/Gold or Matte Tin/Gold terminal plating are compatible with lead-free processing
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F4 - The smallest pitch (0.4mm) and lowest mating height (0.9mm) available
This series for board to fpc board connection has a pitch of only 0.4mm and a height of 0.9mm. Despite its small size, the connector includes spring-elastic contacts and a locking mechanism.
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Board to board connectors from GCT are of high quality and very competitive prices, with connector pitches ranges from 0.5mm, 0.8mm, 1.00mm, 1.27mm, 2.00mm to 2.54mm (0.019", 0.031", 0.050", 0.079" to 0.100" centerline), of single, double, triple or quadruple rows, with vertical (straight) or horizontal (right-angle) orientations in surface mount or through-hole(DIP) lead style. All the board to board connectors can be custom made based on specific customers design requirements, to achieve different stacking heights, from as low as 3mm, to more than 60mm, as well as different PCB orientations (right-angle, planar, and stacked). All posts & tails pin lengths, insulator or profile heights, contact plating (gold flash, tin, gold or selective gold plating from 1u" to 30u" thickness), locating pegs or polarization keys, contact terminals types (tuning fork, dual beam folded, triple beam folded or 4-side closed spring contacts), insulator materials of UL94V-0 thermoplastics (Nylon 6T, LCP, or PBT), suitable for high temperature reflow or wave soldering and are RoHS compliant, different entry types (top entry or dual entry sockets), voided pins or contacts for increasing pin pitch, can all be built and customized based on customers requirements.
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Global Connector Technology SD Card Connectors are designed for ease & benefits of customers use, with push push style for easy & smooth card insertion & extraction, and 2.8mm ultra-low profile push pull style for simple, economic and space saving applications. All these SD Card Connectors are built with Read/Write Protection Switch to avoid accidental deletion of data stored in the SD memory card. The Push-Push style are built with card detection switch that can confirm card presence, and make Instant Plug & Play feasible. Both styles are designed for durability that supports more than 10,000 mating/unmating cycles, with also the grounded & shielded metallic shell enabling un-interrupted read/write operations from EMI, RFI or ESD.
Global Connector Technology offers both Push-Push style & Hinged Style Micro SD (or formerly called T-Flash) Card Connectors. Unlike the simple push pull design, the push push style, with our built-in spring system, braking tabs and rib-wall in the inner housing, card insertion and extraction is controlled for smooth and reliable entry and ejection, eliminating the risk of card fall-out or card sticking or any card damage during insertion & extraction.
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2.54mm Board to Cable Connectors (Latch Headers) Series LPV acc. to IEC 60603-13
Female connectors
IDC
Interlocking latches
Male connectors, with interlocking
Solder
Pressfit
THR (black)
Male connectors, without interlocking (low profile)
Solder
Pressfit
Strain relief clamp
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The SMT connector series MicroStac with 0.8 mm pitch and with SMT termination is based on a hermaphroditic design. As result of this the male and the female connector are identical. The same style for male and female connector meet the requirement for a economical connector solution in modern applications in electronics. The dual-sided PCB application contact principle provides for a tilt-proof and insertion-proof connector position on the PCB. The gripper surface is integrated within the insulator body. This obviates is the need for the standard assembly hood. Optionally, versions featuring positioning pegs are also available. Using the MicroStac a board-to-board height from 5.0 mm up to 6.5 mm is achieved.
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For cable-to-board connections with flat cables, where space is at a premium. Plugs and solder-in connectors in insulation displacement technology, tab headers for THT and SMT soldering. For signal and low load currents up to 1.2 A, pitch 1.27 mm (.050").
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Available in 2 through 24 circuits .positive housing lock for secure mating retention .Merial: PBT UL 94 V -0 for free hanging or panel mounted mates with 5741 and 5742 series terminals .3.00mm center spacing wire to wire .low engagement force terminals current rating : 5A max
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Connector system ECO-DOMO
Description of system
IDC housings
* Direct and indirect connector with IDC termination in accordance with the RAST 5 standard specifications for domestic appliances, with locking features inside or outside
* Direct connector with central polarizing and polarizing pegs at sides, locking features for PCB
* Cable exit 90° and 180° according to RAST 5
Pin connectors for indirect connectors
* Versions for vertical or horizontal PC board assembly
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Tyco Electronics offers a broad portfolio of connectors for main Memory modules, removable Memory cards and microprocessors made to the many industry standard specifications.
The Tyco Electronics main Memory connectors are made to JEDEC industry standards for SIMM (Single In-line Memory Modules) and DIMM (Dual In-line Memory Modules) for computer and communication applications. Each product family consists of vertical, right-angle and various angled configurations in solder tail, press fit and SMT mounting options.
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SI - Side Interface Board-To-Backplane Connector Overview
In years past, low frequency transmissions could absorb the difference between the connector parameters and the PCB. As data transfers and rise times push into the gigabit range, signal ringing, jitter and edge rate profiles break down the signal quality to unacceptable levels. Side Interface refers to a revolutionary PCB technology. SI allows the inner layers to exit through the actual side of the PCB (represented by the thickness dimension). This provides a flat mating surface for the HXC125 contact. The advantage of this technology is that you keep the signal within the PCB for greater period of time. By staying within the "Controlled Impedance Environment" longer, there is less disturbance to the signal. This short interconnect distance eliminates the large electrical interruption one would see in traditional two piece connectors.
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-- Enhances Reliability for Portable Electronics --
The Conan 1.00mm mezzanine connector system provides a mechanically secure, high density electrical interface between parallel printed circuit boards. Conan’s mechanical features and palladium/nickel/gold plated electrical contacts qualify it for higher reliability use in portable and mobile electronic equipment.
-- Features & Benefits --
> "Click" engagement assures secure mating.
> 4.15mm low profile to 7.0mm PCB stacking
> 9 sizes: from 9 to 69 positions
> Blade-on-beam contacts allow “peeling”and prevent “stubbing.”
> SMT mounting with SMT hold-down for increased strength
> Mating polarization prevents backward connections
> PCB polarization prevents manufacturing errors
> Tape and reel packaging supports automated assembly.
> High Density 1mm Mezzanine PCB Connector SystemIdeal for Portable Electronics
For more information : www.fciconnect.com
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Tyco Electronics' Flex-to-Board Connectors combine the benefits of flex circuitry with the superior electrical performance of HXC125 for backplane to backplane interconnect. This solderless, compression mount connector allows for easy field replacement or repair. The simple hardware design minimizes the space needed for connector mounting.
This combination of HXC contacts and flexible circuits has allowed many difficult applications to be addressed. Backplane to backplane, as well as parallel PCB's, have benefited from these low profile and high density connectors. Due to the geometry of the contact, minimum real estate is required.
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Connector system RFK 2
Description of system
Wire to Board socket connectors (WtB)
* crimp version for indirect connections, wire range 0.07 - 0.5 mm²
* IDC version for direct and indirect connections, wire range 0.14 - 0.25 mm²
* suitable for terminating ribbon cables and discrete wires
* also available with extended cable support and polarizing pegs
Pin connectors
* with or without snap-in locking device, for vertical or horizontal connections
* the tandem pin connectors can be used as flying lead connection
Board to Board-Federleisten (BtB)
* Board to Board connectors for vertical an horizontal connections
Pin strips
* in line version
* staggered versions and larger pitch sizes on request
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Winchester Electronics TMRACV series 34-position connectors are in compliance with the ISO 2593 CCITT V.35 interface standard for high-speed data communication. Winchester's V.35 connector offering includes products for cable-to-cable and cable-to-board applications and features:
- Right-angle female PCB receptacles available fully loaded or with special contact load patterns.
- Variety of PCB mounting brackets including 4-40 threaded inserts, .120-inch diameter through-holes, and metal snap-mount hold-downs.
- Male and female insulators for cable applications.
- Screw machined or stamped and formed contacts available on reels or loose-piece.
- Conductive and non-conductive drawn cable hoods for cable diameters between .180 - .600 inches
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Amphenol-Tuchel Electronics designs and manufactures the world's broadest range of Smart Card Connectors for a variety of applications including the access control, electronic fund transfer, healthcare, mobile phone and set top box industries.
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Features:
- Available with 8 contacts which are designed to give a consistently reliable normal force over the life of the connector.
- For added reliability, the card detection switch (which is normally open) is sealed against dust and debris.
- Available with through-hole or surface mount contact termination and its lightweight design means that the connector can be automatically pick-and-placed.
- The moldings are made from high temperature thermoplastics suited for infrared and convection soldering processes.
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