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BASICS+
Basics+ brings together our proven, standard connectors for board-to-board and wire/cable-to-board applications. Our goal is to save you time by providing “Easy To Use” services. All services are accessible via the dedicated Basics+ web site : www.fciconnect.com/basics
EASY TO SELECT A PRODUCT
This catalogue provides an easy overview of the most standard Basics+ products. For even more choice, our web catalogue provides the step search possibility that guides you step-by-step to your part number
EASY TO GET DOCUMENTATION
Data sheets, product drawings, specifications, application notes, packaging drawings and more are available on the web site for download.
EASY TO GET TECHNICAL SUPPORT
Get your technical questions answered within 24 hours on our e-mail hotline basics.help@fciconnect.com
EASY TO GET SAMPLES
Order a sample today, and you can start to work with your Basics+ product right away! Sample orders can be placed via the web site.
EASY TO GET COMMERCIAL INFORMATION
As a customer, you can have registered online access to prices, packaging quantities, minimum order quantities, and lead times. All the commercial information you need is at your fingertips. |
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Tyco Electronics' HXC125 Board-to-Board Connectors offer a high performance, high density interconnect for today's design challenges.
Connectors are available in 1mm to 4mm heights, with centerline spacing as low as 1mm. This solderless, compression system allows for ease of assembly while offering excellent power management capability. Standard 1.0 mm contacts are rated to 4 Amps each.
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ERmet ZD connectors were specially developed for differential high-speed signal transmission in telecom applications with data rates of up to 10Gbits/sec.
This robust, high quality modular connector system is just as well-suited for use in conjunction with the 2mm HM (IED 61076-4-101) ERmet line of connectors.
The inline design of the signal and ground contacts makes simple, economic routing (conductor track routing) possible. Signal and ground contacts have different connection levels with a gap of 1.5mm, thus ensuring a safe connection. In addition, the contacts are assembled into a robust housing.
The ERmet ZD connector utilizes an optimal grid construction that reduces signal interference and offers ample room for conductor track routing. Its optimized design and effective shielding allow the ERmet ZD system to exhibit superb performance when it comes to crosstalk and reflections.
The ERmet ZD connector has been selected as the backplane interconnect for the PICMG 3.x (ATCA) industry standard.
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ERmet ZD connectors were specially developed for differential high-speed signal transmission in telecom applications with data rates of up to 10Gbits/sec.
This robust, high quality modular connector system is just as well-suited for use in conjunction with the 2mm HM (IED 61076-4-101) ERmet line of connectors.
The inline design of the signal and ground contacts makes simple, economic routing (conductor track routing) possible. Signal and ground contacts have different connection levels with a gap of 1.5mm, thus ensuring a safe connection. In addition, the contacts are assembled into a robust housing.
The ERmet ZD connector utilizes an optimal grid construction that reduces signal interference and offers ample room for conductor track routing. Its optimized design and effective shielding allow the ERmet ZD system to exhibit superb performance when it comes to crosstalk and reflections.
The ERmet ZD connector has been selected as the backplane interconnect for the PICMG 3.x (ATCA) industry standard.
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The high-speed SMT connector Microspeed with the pitch 1.0mm is especially designed for modern board-to-board applications in telecom and datacom equipments with data rates up to 10 GBit/s. MicroSpeed features differential signal transmission with a impedance of 100 Ohm or single ended signal transmission with a impedance of 50 Ohm. Two different signal contact arrangements are possible. For improved crosstalk parallel signal ports are recommended. A excellent signal integrity is achieved by a design with 2 signal and 2 shield contact rows. The termination area of the shield contacts is available in 2 options: SMT or THR (Thru Hole Reflow).
For fully automatic SMT assembly the connector features:
- Tape and reel packaging
- Black high-temperature insulator for fast and reliable visual recognition.
- Integral pick and place surface for easy grip with a vacuum pipette |
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2.54mm Board to Cable Connectors (Latch Headers) Series LPV acc. to IEC 60603-13
Female connectors
IDC
Interlocking latches
Male connectors, with interlocking
Solder
Pressfit
THR (black)
Male connectors, without interlocking (low profile)
Solder
Pressfit
Strain relief clamp |
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Tyco Electronics offers a broad portfolio of connectors for main Memory modules, removable Memory cards and microprocessors made to the many industry standard specifications.
The Tyco Electronics main Memory connectors are made to JEDEC industry standards for SIMM (Single In-line Memory Modules) and DIMM (Dual In-line Memory Modules) for computer and communication applications. Each product family consists of vertical, right-angle and various angled configurations in solder tail, press fit and SMT mounting options. |
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Tyco Electronics' Flex-to-Board Connectors combine the benefits of flex circuitry with the superior electrical performance of HXC125 for backplane to backplane interconnect. This solderless, compression mount connector allows for easy field replacement or repair. The simple hardware design minimizes the space needed for connector mounting.
This combination of HXC contacts and flexible circuits has allowed many difficult applications to be addressed. Backplane to backplane, as well as parallel PCB's, have benefited from these low profile and high density connectors. Due to the geometry of the contact, minimum real estate is required.
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The SMT connector series MicroStac with 0.8 mm pitch and with SMT termination is based on a hermaphroditic design. As result of this the male and the female connector are identical. The same style for male and female connector meet the requirement for a economical connector solution in modern applications in electronics. The dual-sided PCB application contact principle provides for a tilt-proof and insertion-proof connector position on the PCB. The gripper surface is integrated within the insulator body. This obviates is the need for the standard assembly hood. Optionally, versions featuring positioning pegs are also available. Using the MicroStac a board-to-board height from 5.0 mm up to 6.5 mm is achieved.
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Features:
- Available with 8 contacts which are designed to give a consistently reliable normal force over the life of the connector.
- For added reliability, the card detection switch (which is normally open) is sealed against dust and debris.
- Available with through-hole or surface mount contact termination and its lightweight design means that the connector can be automatically pick-and-placed.
- The moldings are made from high temperature thermoplastics suited for infrared and convection soldering processes. |
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Tyco Electronics offers a broad portfolio of connectors for main Memory modules, removable Memory cards and microprocessors made to the many industry standard specifications.
The Tyco Electronics main Memory connectors are made to JEDEC industry standards for SIMM (Single In-line Memory Modules) and DIMM (Dual In-line Memory Modules) for computer and communication applications. Each product family consists of vertical, right-angle and various angled configurations in solder tail, press fit and SMT mounting options. |
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