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BASICS+
Basics+ brings together our proven, standard manufacturer of connectors for board-to-board and wire/cable-to-board applications. Our goal is to save you time by providing “Easy To Use” services. All services are accessible via the dedicated Basics+ web site : www.fciconnect.com/basics
EASY TO SELECT A PRODUCT
This catalogue provides an easy overview of the most standard Basics+ products. For even more choice, our web catalogue provides the step search possibility that professional guides you step-by-step to your part number
EASY TO GET DOCUMENTATION
Data sheets, product drawings, specifications, application notes, packaging drawings and more are available on the web site for download.
EASY TO GET TECHNICAL SUPPORT
Get your technical questions answered within 24 hours on our e-mail hotline basics.help@fciconnect.com
EASY TO GET SAMPLES
Order a sample today, and you can start to work with your Basics+ product right away! Sample orders can be placed via the web site.
EASY TO GET COMMERCIAL INFORMATION
As a customer, you can have registered online access to prices, packaging quantities, minimum order quantities, and lead times. All the commercial information you need is at your fingertips. |
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When space is at a premium, our board-to-board industrial connectors are the perfect solutions. Proven reliability combined with design flexibility provide effective results for even the most demanding SMT and thru-hole applications.
Featured with :
- available in .050" (1.27mm), .079" (2mm), and .100"(2.54mm) pitch
- high density, low-profile interconnects
- high quality screw-machined terminals offer reliable electrical/mechanical interconnects
- wide variety of terminals and plating options
- mezzanine board applications
- unique solder preforms allow multi-tier Z-axis expansion
- RoHS Compliant insulators with either Gold/Gold or Matte Tin/Gold terminal plating are compatible with lead-free processing
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Tyco Electronics' HXC125 Board-to-Board Supplier of connectors offer a high performance, high density interconnect for today's design challenges.
Connectors are available in 1mm to 4mm heights, with centerline spacing as low as 1mm. This solderless, compression system allows for ease of assembly while offering excellent power management capability. Standard 1.0 mm contacts are rated to 4 Amps each.
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ERmet ZD industrial connectors were specially developed for differential high-speed signal transmission in telecom applications with data rates of up to 10Gbits/sec.
This robust, high quality modular connector system is just as well-suited for use in conjunction with the 2mm HM (IED 61076-4-101) ERmet line of connectors.
The inline design of the signal and ground contacts makes simple, economic routing (conductor track routing) possible. Signal and ground contacts have different connection levels with a gap of 1.5mm, thus ensuring a safe connection. In addition, the contacts are assembled into a robust housing.
The ERmet ZD connector utilizes an optimal grid construction that reduces signal interference and offers ample room for conductor track routing. Its optimized design and effective shielding allow the ERmet ZD system to exhibit superb performance when it comes to crosstalk and reflections.
The ERmet ZD connector has been selected as the backplane interconnect for the PICMG 3.x (ATCA) industry standard.
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ERmet ZD supplier of connectors were specially developed for differential high-speed signal transmission in telecom applications with data rates of up to 10Gbits/sec.
This robust, high quality modular connector system is just as well-suited for use in conjunction with the 2mm HM (IED 61076-4-101) ERmet line of connectors.
The inline design of the signal and ground contacts makes simple, economic routing (conductor track routing) possible. Signal and ground contacts have different connection levels with a gap of 1.5mm, thus ensuring a safe connection. In addition, the contacts are assembled into a robust housing.
The ERmet ZD connector utilizes an optimal grid construction that reduces signal interference and offers ample room for conductor track routing. Its optimized design and effective shielding allow the ERmet ZD system to exhibit superb performance when it comes to crosstalk and reflections.
The ERmet ZD connector has been selected as the backplane interconnect for the PICMG 3.x (ATCA) industry standard.
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The high-speed SMT connector specification Microspeed with the pitch 1.0mm is especially designed for modern board-to-board applications in telecom and datacom equipments with data rates up to 10 GBit/s. MicroSpeed features differential signal transmission with a impedance of 100 Ohm or single ended signal transmission with a impedance of 50 Ohm. Two different signal contact arrangements are possible. For improved crosstalk parallel signal ports are recommended. A excellent signal integrity is achieved by a design with 2 signal and 2 shield contact rows. The termination area of the shield contacts is available in 2 options: SMT or THR (Thru Hole Reflow).
For fully automatic SMT assembly the connector features:
- Tape and professional reel packaging
- Black high-temperature insulator for fast and reliable visual recognition.
- Integral pick and place surface for easy grip with a vacuum pipette |
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