Palomar's Model 8000 Wire Bonder Palomar's Model 8000 Wire Bonder is a fully automated thermosonic high-speed ball-and-stitch wire bonder. As the assembly method of choice for first level interconnection, it’s suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs, and high reliability devices. The planarBump™ feature, a patented technology that uses gold wire to produce tailless ball bumps, also makes the Model 8000 suitable for flip chip and other advanced packaging applications. The overall precision of the Model 8000 Wire Bonder, along with its large work area and its available deep access capability, result in high yield processing of fine pitch/high wire count applications. Typical applications include: - Automotive assemblies - Chip on board (COB) - Disk drive assemblies - Fine pitch devices - Flex circuits - High bright/high power LEDs - Large complex hybrids - Multichip modules (MCMs) - Multi-tiered ICs - Specialty lead frames - Stacked die - System in packages (SIPs)