{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
Memory size: 16 GB - 32 GB
... SOSA-aligned 11th Generation Intel Core Processor 6U VPX SBC - 11th Gen Intel® Core™ processor for AI (Artificial Intelligence), CVGIP (Computer Vision, Graphics, and Image Processing), DSP (Digital Signal Processing) workloads - 12-28 W Quad Core™ processor, ...
Memory size: 0 GB - 8 GB
... SMARC® Rel. 2.1.1 Computer on Module (CoM) with MediaTek Genio 700 Applications Processors Audio - 2x I2S port Serial Ports - 2x UART (4-wires) 2x UART (2-wires) Other Interfaces - GPIOs MIPI-CSI camera interface General Purpose ...
SECO
Memory size: 0 GB - 8 GB
... SMARC® Rel. 2.1.1 module with MediaTek Genio 510 Applications Processors Graphics Mali-G57 MC2 GPU Audio 2x I2S port Serial Ports 2x UART (4-wires) 2x UART (2-wires) Other Interfaces - GPIOs MIPI-CSI camera interface General Purpose I2C Bus PWM ...
SECO
SMARC 2.1 computer-on-moduleSOM-SMARC-TWL
Memory size: 0 GB - 16 GB
... Overview
SMARC® Rel. 2.1 module (E08) featuring Intel® Core™ i3 and Intel® Processors N Series (codename Twin Lake). Compact 50 x 82 mm form factor tailored for industrial embedded applications; LPDDR5 soldered memory and broad I/O options.
Highlights
- CPU
SECO
Memory size: 8 GB
... Overview
The QRB812 is an Open Standard Module (OSM 1.1) System-on-Module from DFI based on the Qualcomm QRB5165 SoC. It is engineered for compact industrial and embedded applications such as AMR, robotics and drones, where multi-camera support, ...
Memory size: 0 GB - 192 GB
... Overview
The RPS9HC is a COM-HPC® Client Size C system-on-module family for high-performance embedded computing. It supports 14th and 13th Gen Intel® Core™ processors, DDR5 memory, multiple high-speed expansions and quad independent displays ...
Memory size: 4 GB
... Product Overview
- Intel Atom® E3800 Processor Series
- Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0
- Multiple expansions: 3 PCIe x1, 2 SATA 2.0
- 1 LVDS, 1 DDI (HDMI/DVI/DP)
- Single Channel DDR3L 1333MHz ECC Memory
Memory size: 64 GB
... Intel Alder Lake COM-E core module Support 2 x SATA3.0 Support 4x display output, 3 x DD1 for HDMI/DP, 1 x DD1 for VGA Dimension: 95*95*2.0mm ...
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically ...
ADLINK TECHNOLOGY
SMARC® Rel. 2.1.1 computer-on-moduleJSOM-R88C series
Memory size: 4, 8 GB
JSOM-R88C is an Arm-based SMARC 2.1.1 Computer-on-Module powered by industrial grade Rockchip RK3588J SoC, which includes octa-core Arm Cortex processors and integrates a 6 TOPS NPU for deep learning acceleration. It offers multiple display options and ...
... An advanced System On Module (SOM) solution is now available from ARBOR Technology designed to accelerate the development of IoT applications. The SM1200 is capable of driving 4K displays and multiple touch screens and supports the processing of high-resolution ...
The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that ...
Memory size: 4 GB
MYC-CZU3EG/ZU4EV/ZU5EV-V2 SOM and development board, based on XILINX MPSoC fully programmable processor, the industry's first heterogeneous adaptive SOC, 4-core Cortex-A53 (UPTO 1.5ghz) +FPGA+GPU+VideoCodec (EV series only), dual-core Arm Cortex-R5F 16nm ...
MYIR Electronics Limited
Memory size: 32, 64 GB
... *45W CPU SKUs are available upon request Chipset - MCP BIOS - AMI SPI 256 Mbit Form Factor Dimensions - COM Express Compact Type 6 (3.74-in x 3.74-in x 0.52-in, 9.5 cm x 9.5 cm x 1.3 cm) Memory Technology - Dual Channel DDR4 3200 MHz Socket ...
ASRock Industrial
... COM Express Type 6 Compact Size with Intel® J6412 Processor Specification Form Factor - COM Express® R3.0 Compact Module, Type 6 95W x 95D (mm) CPU - Intel® Celeron® J6412 Processor 10nm, 4 cores, 4 threads, up to 2.60 GHz TDP 10W Socket - ...
COM Express computer-on-moduleconga-TS370
... COM Express Type 6 Basic module based on 8th Generation Intel® Core™ processor family 8th Generation Intel® Core™ processor with up to 6 Cores Intel® Xeon® processors for data center applications Support for USB 3.1 Gen2 with 10Gbit/s Intel® Optane™ ...
Congatec
the best suppliers