SMARC 2.1 computer-on-module SOM-SMARC-TWL

Intel® Core i3Intel® Processor N150Intel® Processor N250

Overview
SMARC® Rel. 2.1 module (E08) featuring Intel® Core™ i3 and Intel® Processors N Series (codename Twin Lake). Compact 50 x 82 mm form factor tailored for industrial embedded applications; LPDDR5 soldered memory and broad I/O options.

Highlights

• CPU Configurations: i3-N355 (8 cores, up to 3.9 GHz, 15 W TDP); N250 (4 cores, up to 3.8 GHz, 6 W TDP); N150 (4 cores, up to 3.6 GHz, 6 W TDP)
• Graphics Integrated Intel® Graphics up to 32 Execution Units; supports up to 3 independent displays
• Memory Up to 16 GB LPDDR5-4800 soldered with IBECC
• Connectivity 2x NBase-T (2.5 GbE), 6x Hi-Speed USB, 2x USB 10 Gbps, 4x PCIe Gen3 lanes (optional SERDES)

Security & Management

• Secure Boot Ensures system integrity from first start
• OTA Updates Remote and secure firmware/software distribution
• Device Monitoring Continuous status and activity monitoring
• Secure OS Yocto-based OS integration for customizable secure builds
• Certifications Compliance with EN18031-1 for embedded security
• Containerization Docker support for isolated application deployment

Resources

• Datasheet (PDF)
• User manual (PDF)
• Developer documentation and product Dev Center entries
• Example part numbers and configuration guides

Technical specifications

• Form factor SMARC® Rel. 2.1 module, 50 x 82 mm
• CPUs i3-N355: 8 cores @ 1.9 GHz (3.9 GHz Turbo), 15 W; N250: 4 cores @ 1.3 GHz (3.8 GHz Turbo), 6 W; N150: 4 cores @ 0.8 GHz (3.6 GHz Turbo), 6 W
• Memory Up to 16 GB LPDDR5-4800 soldered with IBECC
• Graphics i3-N355: 32 EUs @ 1350 MHz; N250: 32 EUs @ 1250 MHz; N150: 24 EUs @ 1000 MHz
• Video interfaces eDP 1.3 or dual-channel 18/24-bit LVDS (factory options); 2x DP++ (DP 1.4 / HDMI® 2.1); 2x MIPI CSI-2 inputs (1x2-lane, 1x4-lane)
• Resolution Up to 4096 x 2160 @ 60 Hz
• Storage 1x external SATA Gen3.2; optional on-board eMMC 5.1
• Networking 2x NBase-T (2.5 GbE) via Intel® i225 controllers; optional SERDES (SGMII) for additional GbE
• USB 6x Hi-Speed USB; 2x USB 10 Gbps
• PCIe 4x PCIe Gen3 lanes — flexible aggregation (4x1, 1x2+2x1) or SERDES alternative
• Audio & serial HD audio, SoundWire/I2S; 2x UART, 2x HS-UART
• Other I/O Up to 14x GPIO, SMBus, I2C, SPI boot, optional eSPI/GP SPI, power management signals, watchdog
• Power +5 VDC and +3 V_RTC
• Operating system Microsoft® Windows 10 LTSC, Windows 11 LTSC; Linux Kernel LTS
• Operating temperature 0°C to +60°C (commercial version)
• Dimensions 50 x 82 mm
• Example part numbers RE08-E231-1121-C3; RE08-F441-2222-C3; RE08-G842-2121-C3