SO-DIMM computer-on-module a supp

COM ExpressIntel® Core™ Ultra2.5 GbE

Overview
COM Express Rel. 3.1 Type 6 module featuring Intel® Core™ Ultra Series 3 processors (codename: Panther Lake-H), designed for high-performance embedded and edge systems requiring AI acceleration, multi-display support and extensive I/O.

Highlights

• CPU: Intel® Core™ Ultra Series 3 processors with embedded Intel NPU5 (50 TOPS) — platform up to 180 TOPS.
• Graphics: Integrated Intel® Graphics up to 12 3rd Gen Xe cores; IPU 7.5 for advanced imaging and camera management.
• Memory: 2x DDR5 SO-DIMM slots (DDR5-5600), up to 96 GB.
• Connectivity: 1x NBase-T 2.5GbE; up to 2x USB4 (40 Gbps); up to 4x Superspeed USB (10 Gbps); 8x Hi-Speed USB; up to 20 PCIe lanes.

Security, Updates & Management

• Secure Boot: built-in secure boot for system integrity at first startup.
• OTA Updates: remote and secure firmware/software distribution.
• Device Monitoring: continuous device status and activity monitoring.
• Secure OS: Yocto-based secure OS integration; Clea OS supported.
• Compliance: designed to support EN18031-1 security standards.

Product Description (short)
COM Express Rel. 3.1 Type 6 module SOM-COMe-BT6-PTL based on Intel® Core™ Ultra Series 3 (Panther Lake-H) for embedded/edge applications requiring on‑board AI, multi-display output and high-speed I/O.

Technical Specifications

• Description: COM Express Rel. 3.1 Type 6 module with Intel® Core™ Ultra Series 3 processors (Panther Lake-H).
• CPU Description: Intel® Core™ Ultra X9 Series 3; Intel® Core™ Ultra X7 Series 3; Intel® Core™ Ultra 9 Series 3; Intel® Core™ Ultra 7 Series 3; Intel® Core™ Ultra 5 Series 3 (selectable).
• Memory: 2x DDR5-5600 SO-DIMM slots, up to 96 GB.
• Graphics: Integrated Intel® Graphics up to 12 3rd Gen Xe cores; support for up to 4 independent displays; IPU 7.5 enabling 3x concurrent camera streams.
• Video Interfaces: 2x Type-C (DP / DP Alt Mode over Type-C / HDMI / DP tunneled); 1x DDI (DP 2.1 2-lane/4-lane, factory option); 1x eDP 1.5 (4K120Hz HDR) or 1x LVDS Single/Dual Channel (factory alternatives).
• Video Resolution: Up to 4x 4K120Hz simultaneous displays.
• Mass Storage: optional onboard NVMe PCIe x4 SSD up to 1 TB; optional 2x SATA (commercial temperature modules only).
• Networking: 1x NBase-T Ethernet via Intel® I226 controller (2.5 GbE, TSN support).
• USB: Up to 2x USB4 (40 Gbps); up to 4x Superspeed USB (10 Gbps); 8x Hi-Speed USB ports.
• PCI: Up to 8 PCIe Gen4 lanes; 1x PEG x8 Gen5 (depending on CPU); optional PEG x4 Gen4.
• Audio: HD Audio interface; SoundWire support.
• Serial: 2x 2-wire UARTs.
• Other Interfaces: optional 2x MIPI-CSI 4-lane; SPI; 2x I2C; SMBus; thermal and fan management; eSPI or LPC (factory alternatives); optional TPM 2.0; LID#/SLEEP#/PWRBTN#; watchdog; 4x GPI, 4x GPO.
• Power Supply: Main +12 VDC ±10%; Auxiliary +5VSB, +3VRTC.
• Operating System: Microsoft® Windows 11 IoT Enterprise 2021 LTSC; Clea OS.
• Operating Temperature: 0°C to +60°C (commercial); -40°C to +85°C (industrial).
• Dimensions: 125 x 95 mm (COM Express® Basic form factor, Type 6 pinout).
• Part Number: PN-SOM-COMe-BT6-PTL.