COM-HPC computer-on-module PN-SOM-COM-HPC-A-ARL

Intel® Core™ UltraHDMIDisplayPort

Overview
COM-HPC® Size A Client Module SOM-COM-HPC-A-ARL designed for Intel® Core™ Ultra Processors (Series 2, Arrow Lake H and U). Modular board in COM-HPC Size A form factor (120 x 95 mm) for industrial edge, automation, vision systems and embedded clients.

Highlights

• CPU: Supports Intel® Core™ Ultra Processors (Series 2, Arrow Lake -H and -U variants)
• Graphics: Integrated Intel® Xe LPG graphics controller up to 128 EU, up to 4 independent displays
• Memory: 2x DDR5 SO‑DIMM (IBECC) supporting up to 64 GB
• Connectivity: Up to 2x NBase‑T 2.5GbE (Intel® I226), multiple high‑speed USB (20/10 Gbps) and Hi‑Speed ports
• Expansion: Multiple PCIe Gen4/Gen5 lanes (x1/x4/x8 options) for peripherals and accelerators

Security & Compliance

• Secure Boot: Built‑in Secure Boot to protect system integrity from first startup
• OTA Updates: Secure remote firmware and software update support
• Device Monitoring: Platform‑level monitoring and management (Clea integration)
• Secure OS: Yocto‑based Clea OS support for customizable secure builds
• Certified Security: Designed for compliance with EN18031‑1 where applicable; optional TPM 1.2/2.0
• Containerization: Docker support for isolated application deployment

Technical Specifications

• Form factor: COM‑HPC® Size A (Client pinout), 120 x 95 mm
• Processor family: Intel® Core™ Ultra Processors (Series 2, Arrow Lake H/U)
• CPU options: Multiple H and U series variants (examples: 165H/155H/135H/125H and 165U/155U/135U/125U)
• Graphics: Intel® Xe LPG up to 128 EU, 4x independent displays
• Memory: 2x DDR5 SO‑DIMM (IBECC), up to 64 GB (DDR5‑5600/6400 depending on configuration)
• Video interfaces: DDIs supporting DP/HDMI and DP Alt‑Mode over Type‑C; eDP
• Video resolution: HDMI 2.1 / DP 2.1 / eDP 1.4b — up to 8K@60Hz, DP up to 8K60 / 5K120, eDP up to 4K120 HDR
• Mass storage: Up to 2x SATA Gen3.2; optional onboard NVMe SSD (PCIe x4) up to 512 GB / 1 TB depending on SKU
• Networking: Up to 2x NBase‑T (2.5GbE) with Intel® I226; TSN support
• USB: 2x USB 10 Gbps; 2x USB 20/40 Gbps; 8x Hi‑Speed USB ports
• PCIe: Up to 7x PCIe x1 Gen4 (4x groupable); up to 3x PCIe x4 Gen4; 1x PCIe x8 Gen5 (H‑series)
• Audio: HD audio interface; 2x SoundWire
• Serial: 2x 4‑wire UARTs
• Other I/O: SPI (Boot + GP), 2x I2C, SMBus, eSPI, 12x GPIO, 2x MIPI‑CSI‑2 (4‑lane), watchdog, fan and thermal management
• Power: +12VDC ±10% (optional +5VSB, +3VRTC)
• OS support: Microsoft® Windows 11 IoT Enterprise; Clea OS (Yocto)
• Operating temperature: 0°C to +60°C (commercial)
• Dimensions: 120 x 95 mm