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SMARC® Rel. 2.1.1 computer-on-module SOM-SMARC-Dragonwing-IQ8
QualcommLVDSUSB 2.0

SMARC® Rel. 2.1.1 computer-on-module - SOM-SMARC-Dragonwing-IQ8 - SECO - Qualcomm / LVDS / USB 2.0
SMARC® Rel. 2.1.1 computer-on-module - SOM-SMARC-Dragonwing-IQ8 - SECO - Qualcomm / LVDS / USB 2.0
SMARC® Rel. 2.1.1 computer-on-module - SOM-SMARC-Dragonwing-IQ8 - SECO - Qualcomm / LVDS / USB 2.0 - image - 2
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Characteristics

Form factor
SMARC® Rel. 2.1.1
Processor
Qualcomm
Ports
LVDS, USB 2.0, gigabit Ethernet, 2.5 GbE, USB 3.1, PCI Express, LPDDR5
Operating system
Linux, Yocto
Other characteristics
embedded, Edge AI, edge computing
Applications
industrial, for industrial automation, for HMI interface
Memory size

Min.: 0 GB

Max.: 32 GB

Description

Overview
SMARC® Rel. 2.1.1 module for edge and embedded applications equipped with Qualcomm® Dragonwing™ IQ8 application processors. Designed for integration on a SMARC carrier board for industrial and commercial use.

Highlights
  • CPU Qualcomm® Dragonwing™ IQ8 QCS8275-AA; QCS8275-AC
  • AI Qualcomm® Hexagon™ Embedded NPU up to 40 TOPS
  • Memory Up to 32GB LPDDR5/LPDDR5X soldered
  • Connectivity 1x Gigabit Ethernet; 1x 2.5 Gigabit Ethernet


Security & Software
  • Built-in Secure Boot ensuring system integrity from first boot
  • OTA updates for secure remote software distribution
  • Device monitoring and management support
  • Yocto-based OS integration (Clea OS, Yocto Linux); Arduino compatibility
  • Docker support for containerized applications
  • Security: TPM 2.0 (SLB9678), FIPS 140-3 compliant


Video & Multimedia
  • Adreno™ A623 GPU up to 877 MHz
  • 2 independent displays: DP 1.4 4K@120Hz; LVDS single/dual channel (max 1920x1200@60Hz) or DSI 4-lane 4K@120Hz (factory option)
  • MIPI-CSI: 1x 2-lane + 2x 4-lane with dedicated I2C
  • Video support up to 2x 4K@120Hz


Storage & Memory
  • On-board UFS 3.1 Gen4 2-lane up to 1TB (boot device)
  • SDIO interface (boot device)
  • Up to 32GB LPDDR5/LPDDR5X soldered memory


Connectivity & I/O
  • Networking: 1x Gigabit Ethernet; 1x 2.5 Gigabit Ethernet
  • USB: up to 5x USB 2.0; factory options for 2x USB SS 5Gbps or 1x USB SS 10Gbps
  • PCIe: 1x PCIe x4 Gen4 or 2x PCIe x2 Gen4 (factory option)
  • Audio: 2x I2S
  • Serial: 2x 4-wire UART; 2x 2-wire UART
  • Other: Boot SPI, general SPI, QSPI, PMIC I2C (SMBus), I2C, 8x GPIO, JTAG, ACPI


Product Notes
Module complies with SMARC Rel. 2.1.1 and requires a compatible carrier board for full I/O access. Target applications include industrial edge computing, HMI, vision and AI inference at the edge.

Technical specifications
  • Description: SMARC® Rel. 2.1.1 module with Qualcomm® IQ8 Applications Processors
  • CPU: Qualcomm® Dragonwing™ IQ8 QCS8275-AA; QCS8275-AC
  • Memory: Up to 32GB LPDDR5/LPDDR5X soldered
  • Graphics: Adreno™ A623 GPU up to 877MHz
  • Video Interfaces: DP 1.4 4K@120Hz; LVDS Single/Dual Channel (max 1920x1200@60Hz) or DSI 4-lane 4K@120Hz (factory option); 1x MIPI-CSI 2-lane; 2x MIPI-CSI 4-lane
  • Video Resolution: Up to 2x 4K@120Hz
  • Mass Storage: UFS 3.1 Gen4 2-lane up to 1TB (boot); SDIO interface
  • Networking: 1x Gigabit Ethernet; 1x 2.5 Gigabit Ethernet
  • USB: Up to 5x USB 2.0; options for USB SS
  • PCI: 1x PCI-e x4 Gen4 or 2x PCI-e x2 Gen4 (factory option)
  • Audio: 2x I2S
  • Serial Ports: 2x 4-wire UART; 2x 2-wire UART
  • Other Interfaces: Boot SPI; SPI; QSPI; PMIC I2C (SMBus); I2C; 8x GPIO; JTAG; ACPI
  • Security: TPM 2.0, SLB9678, FIPS 140-3 compliant
  • Power Supply: +5VDC ±5%
  • Operating System: Clea OS, Yocto Linux; Arduino compatibility
  • Operating Temp: Commercial 0°C to +60°C; Industrial -40°C to +85°C
  • Dimensions: 82 x 50 mm
  • Part Number: PN-SOM-SMARC-IQ8

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