COM Express computer-on-module SOM-COMe-CT6-Dragonwing-IQ-X

Qualcommocta-coreeDP

Overview
COM Express 3.1 Type 6 Compact module integrating Qualcomm Dragonwing IQ‑X Series processors in SiP‑A, featuring a Qualcomm Hexagon NPU up to 45 TOPS. Designed for embedded and edge AI applications requiring high CPU/GPU performance and neural processing acceleration.

Highlights

• CPU: Qualcomm Dragonwing IQ‑X Series (SiP‑A) with Hexagon NPU up to 45 TOPS
• GPU: Qualcomm Adreno GPU, up to 3.8 TFLOPS
• Memory: Up to 64 GB LPDDR5‑4224 integrated on SiP
• Connectivity: 1× NBase‑T Ethernet (10/100/1000/2500 Mbps) with Time‑Sensitive Networking (TSN)

Video & Display

• Support for up to 4 independent displays
• 2× DisplayPort (DP / DP Alt Mode over Type‑C), 1× DDI (DP)
• 1× eDP or 1× LVDS (single/dual channel) as factory option
• Max resolutions: DP up to 5120×2880 @60Hz; eDP up to 4K@60Hz; LVDS up to 1920×1200 @60Hz

Storage & I/O

• Optional on‑board UFS 4.0 module up to 1 TB; microSD slot; I2C EEPROM
• USB: configurable 2× USB 10 Gbps (no hub) or 1× USB 10 Gbps + 3× USB 5 Gbps (with hub); 8× Hi‑Speed USB; 2× USB4 Gen3x2
• PCIe: 2× PCIe x2 or 1× PCIe Gen4 x4; 1× PCIe Gen3 x2; 1× PCIe Gen4 x8 on PEG pins
• Serial: Up to 2× 2‑wire UARTs; optional CAN port; I2S audio and SoundWire

Networking

• 1× NBase‑T Ethernet port with TSN (10/100/1000/2500 Mbps). Example controllers: Intel I226, Realtek RTL8125/RTL8111k referenced.

Power & Environmental

• Power: +12 VDC ±10%, +5 V StandBy, +3.0 V RTC
• Operating temperature: 0 °C to +60 °C (Commercial); -40 °C to +85 °C (Industrial)
• Dimensions: 95 × 95 mm (COM Express Compact)

Kits

• Engineering Sample Evaluation Kit (ES1) available to boot quickly, start early development and verify supported I/O (includes known ES1 limitations).

Security & Software

• Built‑in Secure Boot for platform integrity
• OTA updates and remote device monitoring support (Clea)
• Yocto‑based secure OS integration; Microsoft Windows 11 IoT Enterprise supported

Technical specifications

• Form factor: COM Express 3.1 Type 6 Compact module
• CPU variants: IQ‑X7181MD (Custom Oryon 12‑core up to 3.4 GHz), IQ‑X6141MD (Custom Oryon 10‑core up to 3.4 GHz), IQ‑X5121MD (Custom Oryon 8‑core up to 3.4 GHz), IQ‑X3161MD (Custom Oryon 8‑core 2.9 GHz)
• Memory: up to 64 GB LPDDR5 4224 MT/s on SiP
• Graphics: Adreno GPU (variants up to 1.25 GHz)
• Mass storage: optional UFS 4.0 up to 1 TB; microSD; I2C EEPROM
• Interfaces: USB, PCIe, I2C, SPI, QSPI, GPIOs, TPM 2.0 optional
• OS: Microsoft Windows 11 IoT Enterprise; Yocto Linux