COM Express computer-on-module SOM-COMe-CT6-ADL-N

COM Express CompactIntel® AtomIntel® Core™ i3-N305

Overview
COM Express® 3.1 Type 6 compact module SOM-COMe-CT6-ADL-N powered by Intel Atom® x7000RE series (Alder Lake N) and compatible Intel N / Core i3 N305 processors. Designed for embedded and industrial applications requiring low-power, multi-display and TSN-capable compute in a 95 x 95 mm form factor.

Highlights

• CPU: Intel® Atom® x7000E series, Intel® Processor N series and Intel® Core™ i3 N305 options
• Graphics: Integrated Intel® Gen12 UHD graphics with up to 32 EU, support for up to 3 independent displays
• Memory: 1x DDR5 SO-DIMM slot, DDR5-4800 IBECC support, up to 16 GB
• Networking: NBase-T GbE controller with 2.5GbE and TSN support

Evaluation Kit
Evaluation kit available with carrier board, memory, power supply, cabling, storage media and thermal solution for immediate prototyping and testing. Price starting from €529.90.

Security & Software Features

• Secure Boot for platform integrity
• OTA updates for remote software distribution
• Device monitoring for continuous status and activity tracking
• Clea OS (Yocto) integration for customizable secure OS builds
• Docker support for containerized application deployment

Technical specifications

• Product: COM Express® 3.1 Type 6 compact module, SOM-COMe-CT6-ADL-N (Alder Lake N)
• CPU examples: Intel Atom® x7425E (Quad Core 1.5 GHz, Turbo 3.4 GHz, 12 W TDP), x7213E (Dual Core 1.7 GHz, Turbo 3.2 GHz, 10 W TDP), x7211E (Dual Core 1.0 GHz, Turbo 3.2 GHz, 6 W TDP); Intel® Core™ i3-N305 (Eight Core 1.0/1.8 GHz, Turbo 3.8 GHz, 9/15 W TDP); Intel® Processor N200/N97/N50 variants
• Memory: 1x DDR5 SO-DIMM, DDR5-4800 IBECC, up to 16 GB
• Graphics & displays: Intel® Gen12 UHD up to 32 EU; up to 3 independent displays; 2x DDI (DP/HDMI/DP Alt-Mode Type-C), 1x DDI (DP/HDMI), 1x eDP or LVDS option
• Video resolution: HDMI up to 4K@60Hz (HDMI 2.0b); DP 1.4 / eDP 1.4 up to 4096x2304@60Hz; LVDS up to 1920x1200@60Hz
• Storage: Up to 2x SATA Gen3; optional eMMC 5.1 soldered
• USB & PCIe: Up to 2x USB 10 Gbps, optional 3x USB 5 Gbps, 8x Hi-Speed USB ports; up to 6x PCIe Gen3 lanes
• Audio & peripherals: HD audio, SoundWire, 2x UART, SPI, 2x I2C, SMBus, FAN and thermal management; optional eSPI/LPC, TPM 1.2/2.0, LID#/SLEEP#/PWRBTN#, watchdog, 4x GPI, 4x GPO, optional 2x CSI
• Networking: 1x NBase-T Ethernet (MaxLinear GPY211/215) with 2.5GbE and TSN
• Power: +12 VDC ±10%, optional +5VSB, +3VRTC
• OS support: Microsoft® Windows 10 IoT Enterprise 2019/2021 LTSC, Clea OS (Yocto)
• Operating temperature: Commercial 0°C to +60°C; Industrial -40°C to +85°C (measured on SECO heatspreader)
• Dimensions: 95 x 95 mm
• Example part numbers: ME90-2130-2122-C1 (i3-N305, eMMC 64GB, TPM 2.0, Comm. Temp); ME90-3100-2122-C1 (x7211E); ME90-5100-1121-C1 (N97); ME90-7100-1201-C1 (N50)