COM Express Compact computer-on-module PN-SOM-COMe-CT6-R8000

AMDAMD Ryzen™AMD Ryzen™ Embedded

Product overview
COM Express® 3.1 Type 6 compact module SOM-COMe-CT6-R8000 with AMD Ryzen™ Embedded 8000 Series processors (F07); small 95 x 95 mm form factor for embedded industrial applications.

Highlights

• CPU AMD Ryzen™ Embedded 8000 Series (options include Ryzen 7 Pro 8845HS, Ryzen 5 Pro 8645HS, Ryzen 7 Pro 8840U, Ryzen 5 Pro 8640U)
• Graphics Integrated AMD RDNA 3 graphics (up to 6 WGPs)
• Memory 2x DDR5-5600 SODIMM slots
• Displays Up to 4 independent displays; DP 2.0, HDMI 2.1, eDP 1.5 or LVDS factory options
• Connectivity / AI Embedded XDNA Neural Processing Unit (NPU); multiple high-speed USB and NBase-T Ethernet support

Security & Software

• Secure Boot and optional TPM 2.0 for platform integrity
• OTA updates and device monitoring for remote maintenance and fleet management
• Clea OS (Yocto) support and Microsoft® Windows 11 IoT Enterprise compatibility
• Docker container support for isolated application deployment
• Certified compliance with EN18031-1 for embedded systems

Technical specifications

• Description COM Express® 3.1 Type 6 Compact Module, F07 pinout (95 x 95 mm)
• Part number PN-SOM-COMe-CT6-R8000
• CPU details AMD Ryzen™ Embedded 8000 Series: Ryzen 7 Pro 8845HS; Ryzen 5 Pro 8645HS; Ryzen 7 Pro 8840U; Ryzen 5 Pro 8640U
• Memory 2x DDR5-5600 SODIMM slots
• Graphics Integrated AMD RDNA 3 (up to 6 WGPs)
• Video interfaces Up to 4 independent displays; 2x DDI (DP 2.0 / HDMI 2.1 / USB-C DP Alt Mode), 1x DDI (DP 2.0 / HDMI 2.1); eDP 1.5 or LVDS single/dual channel
• Video resolution HDMI up to 8K60; DP up to 7680 x 4320 @60Hz; eDP/USB-C DP Alt up to 3840 x 2160 @240Hz; LVDS up to 1920 x 1200; max 4 x 3840 x 2160 @60Hz
• USB Configurations including 2x USB 40 Gbps, 2x USB 10 Gbps, additional 10/5 Gbps ports and 8x Hi-Speed USB
• PCIe Up to 8x PCIe Gen4 lanes (max 6 root ports); PEG options 1x8 or 2x4 Gen4
• Audio HD Audio interface; SoundWire
• Serial 2x 2-wire serial ports
• Other interfaces SPI, I2C, SMBus, LPC, TPM 2.0 (factory option), LID#/SLEEP#/PWRBTN#, watchdog, 4x GPI, 4x GPO, fan/thermal management
• Power Main +12 VDC ±10%; auxiliary rails +5V_SBY, +3V_RTC
• Operating system Clea OS (Yocto) and Microsoft® Windows 11 IoT Enterprise
• Operating temperature 0°C to +60°C (commercial)
• Dimensions 95 x 95 mm (COM Express Compact)