Qualcomm computer-on-module SOM-COM-HPC-A-Dragonwing-IQ10

EthernetUSB 2.0LPDDR5

Overview
SOM-COM-HPC-A-Dragonwing-IQ10 is a COM-HPC® 1.3 Client Size A module based on the Qualcomm Dragonwing™ IQ10 Series, delivering up to 700 TOPS of AI acceleration. Designed for demanding embedded and industrial applications, it combines advanced AI processing, graphics and high-speed connectivity in a compact 120 x 95 mm form factor.

Highlights

• CPU: Qualcomm Dragonwing™ IQ10 Series, available with IQ-10800MD-AA (64 GB memory) and IQ-10800MD-AD (32 GB memory)
• AI Acceleration: Integrated NPU delivering up to 700 TOPS
• Graphics: Qualcomm® Adreno™ GPU
• Memory: Integrated LPDDR5x ECC memory, available in 64 GB or 32 GB configurations
• Display & Vision: 3x DisplayPort (DDI), 1x eDP and 5x CSI camera inputs
• Connectivity: 2x NBASE-T Ethernet ports, each supporting 2.5GbE / 10GbE
• Expansion: PCIe Gen5 connectivity with x8, x4 and x2 lanes, plus 4x PCIe Gen3 x1 lanes
• Storage: UFS 4.0 storage with 2 lanes, up to 512 GB, plus OSPI flash

Security & Compliance

• Secure Boot: Built-in Secure Boot to ensure system integrity from the first startup
• OTA Updates: Remote and secure software update distribution
• Device Monitoring: Continuous monitoring of device status and activity through Clea
• Secure Operating System: Yocto-based OS integration for customizable and secure system builds
• Certified Security: SECO products integrate security functions designed to enable compliance with the RED Directive (EN18031-1). Certification documentation is available upon request
• Containerization: Docker technology for isolated and flexible application management

Technical Specifications

• Form factor: COM-HPC® 1.3 Client Size A, 120 x 95 mm, Client pinout
• Processor family: Qualcomm Dragonwing™ IQ10 Series
• CPU options: IQ-10800MD-AA (64 GB memory) or IQ-10800MD-AD (32 GB memory)
• AI acceleration: Up to 700 TOPS
• Graphics: Qualcomm® Adreno™ GPU
• Memory: Integrated LPDDR5x ECC memory: 64 GB (IQ-10800MD-AA) or 32 GB (IQ-10800MD-AD)
• Video interfaces: 3x DDI (DisplayPort); 1x eDP
• Camera interfaces: 5x CSI camera inputs
• Video capabilities: 4K video decoding at up to 480 fps; 4K video encoding at up to 240 fps
• Mass storage: UFS 4.0, 2 lanes, up to 512 GB; OSPI flash
• Networking: 2x NBASE-T Ethernet ports, each supporting 2.5GbE / 10GbE
• USB: 4x USB 2.0; up to 4x USB SuperSpeed ports
• PCIe: 1x PCIe Gen5 x8; 1x PCIe Gen5 x4; 1x PCIe Gen5 x2; 4x PCIe Gen3 x1
• Audio: I2S audio interface
• Serial ports: 2x UART; 2x SPI; 1x general-purpose SPI
• Other I/O: 12x SoC GPIOs; 2x I2C; watchdog; fan and management signals; ACPI signals; RTC; interfaces from the internal SIL processor via bottom-side on-board connector

Operating system:
Clea OS; Yocto Linux

Operating temperature:
0°C to +60°C (Commercial version); -40°C to +85°C (Industrial version)

Dimensions:

• 120 x 95 mm