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13th Generation Intel® Core™ computer-on-module SOM-COM-HPC-A-RPL COM-HPC®
HDMISATAEthernet

13th Generation Intel® Core™ computer-on-module - SOM-COM-HPC-A-RPL COM-HPC® - SECO - HDMI / SATA / Ethernet
13th Generation Intel® Core™ computer-on-module - SOM-COM-HPC-A-RPL COM-HPC® - SECO - HDMI / SATA / Ethernet
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Characteristics

Processor
13th Generation Intel® Core™
Ports
HDMI, eDP, Ethernet, USB, SATA, I2C, SPI, DDR5 SO-DIMM
Operating system
Yocto, Windows 10 IoT Enterprise
Data storage
64 GB
Other characteristics
GPIO, client module
Applications
industrial

Description

Overview
SOM-COM-HPC-A-RPL is a COM-HPC® Client Size A module based on 13th Gen Intel® Core™ processors (Raptor Lake H/P/U series). Designed for high-performance industrial edge applications, it combines powerful computing capabilities, integrated Intel® UHD Graphics and high-speed connectivity in a compact 120 x 95 mm form factor.

Highlights
  • CPU: 13th Gen Intel® Core™ processors, supporting Raptor Lake H, P and U series
  • Graphics: Integrated Intel® UHD Graphics (Iris® Xe eligible), with up to 96 Execution Units and support for up to 4 independent displays
  • Memory: 2x DDR5-5200 SO-DIMM slots, supporting up to 64 GB
  • Connectivity: 2x 2.5GbE Ethernet interfaces with Intel® I225 controllers and TSN support
  • USB: Up to 4x USB 4.0 / USB 3.2 ports and 4x USB 2.0 ports
  • Expansion: Up to 8x PCIe Gen3 x1 lanes, 1x PCIe Gen5 x8 port or 2x PCIe Gen4 x4 ports
  • Storage: 2x SATA Gen3 channels and support for M.2 NVMe drives through PCIe x4
  • Wireless Connectivity: Optional onboard Wi-Fi 6E and Bluetooth® 5.3 module

Security & Compliance
  • Secure Boot: Built-in Secure Boot to ensure system integrity from the first startup
  • OTA Updates: Remote and secure software update distribution for connected devices
  • Device Monitoring: Continuous monitoring of device status and activity through Clea
  • Secure Operating System: Yocto-based OS integration for customizable and secure system builds
  • Certified Security: SECO products integrate security functions designed to enable out-of-the-box compliance with the RED Directive (EN18031-1). Certification documentation is available upon request
  • TPM: Optional onboard TPM 2.0 module
  • Containerization: Docker technology for isolated and flexible application management

Technical Specifications
  • Form factor: COM-HPC® Client Size A, 120 x 95 mm, Client pinout
  • Processor family: 13th Gen Intel® Core™ processors (Raptor Lake H/P/U series)
  • CPU options: Intel® Core™ i7-13800HRE, i5-13600HRE, i3-1320PRE and i3-1315URE (Industrial Extended Temperature); Intel® Core™ i7-13800HE, i5-13600HE, i3-1320PE and i3-1315UE, plus Intel® Processor U300E (Commercial Temperature)
  • Graphics: Integrated Intel® UHD Graphics for 13th Gen processors, Iris® Xe eligible with Core™ i5 and i7 processors and dual-channel memory, up to 96 Execution Units
  • Memory: 2x DDR5-5200 SO-DIMM slots, up to 64 GB
  • Video interfaces: Up to 3x DDI ports supporting DisplayPort 1.4 and HDMI 2.0b (HDMI 2.1 via LSPCON); up to 2x DP++ interfaces over USB 4.0 (factory alternatives to 2x DDI ports); 1x eDP 1.4b
  • Video resolution: DisplayPort up to 5120 x 3200 @ 60 Hz or 7680 x 4320 @ 60 Hz with DSC; eDP up to 5120 x 3200 @ 60 Hz or 5120 x 3200 @ 120 Hz with DSC; HDMI 1.4 up to 4K x 2K @ 24–30 Hz; HDMI 2.1 up to 4K x 2K @ 48–60 Hz
  • Mass storage: 2x external SATA Gen3 channels; support for M.2 NVMe drives through PCIe x4 on the carrier board
  • Networking: 2x NBase-T Ethernet interfaces supporting 2.5GbE, managed by Intel® I225 controllers with TSN support
  • Wireless connectivity: Optional onboard M.2 1216 module supporting Wi-Fi 6E (802.11ax, 2x2 MIMO and MU-MIMO) and Bluetooth® 5.3, with external antennas
  • USB: Up to 4x USB 4.0 / USB 3.2 host ports; 4x USB 2.0 host ports
  • PCIe: Up to 8x PCIe Gen3 x1 lanes; 1x PCIe Gen5 x8 port (Gen4 with Core™ i3 and U-series processors); 2x PCIe Gen4 x4 ports
  • Audio: HD Audio, SoundWire and I2S audio interfaces
  • Serial ports: 2x UART
  • Other I/O: 2x 4-lane CSI-2 interfaces; SPI; SMBus; 2x I2C; watchdog timer; carrier board fan control; management signals; ACPI signals; safety status signals; deep sleep and battery support; 12x GPIOs
  • AI engine: Intel® Gaussian & Neural Accelerator 3.0 (Intel® GNA), capable of operating while the SoC is in lower power states

Security:
  • Optional onboard TPM 2.0 module

Power supply:
  • +8VDC to +20VDC main power supply; +5V standby

Operating system:
  • Windows 10 IoT Enterprise LTSC; Linux Kernel LTS; Edgehog OS (Yocto)

Operating temperature:
  • 0°C to +60°C (Commercial Version); -40°C to +85°C (Industrial Version)

Dimensions:
  • 120 x 95 mm

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