COM Express computer-on-module SOM-COMe-CT6-Dragonwing-IQ9

QualcommHDMIUSB 2.0

Overview
SOM-COMe-CT6-Dragonwing-IQ9 is a COM Express® 3.1 Type 6 Compact module based on Qualcomm Dragonwing™ IQ9 processors. Featuring an octa-core Kryo Gen 6 CPU, an integrated Qualcomm® Hexagon™ NPU delivering up to 100 TOPS and a Qualcomm® Adreno™ 663 GPU, it is designed for demanding embedded applications requiring advanced Edge AI capabilities, graphics performance and high-speed connectivity in a compact 95 x 95 mm form factor.

Highlights

• CPU: Qualcomm Dragonwing™ IQ-9075, available with QCS9075-0-AC (up to 2.1 GHz) and QCS9075-0-AA (up to 2.36 GHz)
• AI Acceleration: Integrated Qualcomm® Hexagon™ NPU delivering up to 50 TOPS (QCS9075-0-AC) or 100 TOPS (QCS9075-0-AA)
• Graphics: Qualcomm® Adreno™ 663 GPU, up to 800 MHz
• Memory: Up to 36 GB LPDDR5-3200 soldered onboard with inline ECC
• Display: Up to 4 independent displays, with eDP 1.4 or single-/dual-channel LVDS (factory alternatives), plus 3x DisplayPort 1.4 interfaces
• Storage: UFS 3.1 Gear 4, 2-lane onboard storage, up to 256 GB
• Connectivity: 1x NBase-T Ethernet port with 2.5GbE PHY and TSN support
• Expansion: 1x PCIe Gen4 x4 port (NVMe ready) and 1x PCIe Gen4 x2 port
• USB: Up to 8x USB 2.0 ports and 4x SuperSpeed USB ports, up to 5 Gbps

Security & Compliance

• Secure Boot: Built-in Secure Boot to ensure system integrity from the first startup
• OTA Updates: Remote and secure software update distribution for connected devices
• Device Monitoring: Continuous monitoring of device status and activity through Clea
• Secure Operating System: Yocto-based OS integration for customizable and secure system builds
• Certified Security: Security functions designed to enable compliance with the RED Directive (EN18031-1). Certification documentation is available upon request
• TPM: Optional onboard TPM 2.0
• Containerization: Docker technology for isolated and flexible application management

Technical Specifications

• Form factor: COM Express® 3.1 Type 6 Compact, 95 x 95 mm
• Processor family: Qualcomm Dragonwing™ IQ9 Series
• CPU options: Qualcomm Dragonwing™ IQ-9075 (QCS9075-0-AC) – Octa-core Kryo Gen 6 up to 2.1 GHz; Qualcomm Dragonwing™ IQ-9075 (QCS9075-0-AA) – Octa-core Kryo Gen 6 up to 2.36 GHz
• NPU: Qualcomm® Hexagon™ NPU delivering up to 50 TOPS (QCS9075-0-AC) or 100 TOPS (QCS9075-0-AA)
• Graphics: Qualcomm® Adreno™ 663 GPU, up to 800 MHz
• Memory: Up to 36 GB LPDDR5-3200 soldered onboard with inline ECC
• Video interfaces: Up to 4 independent displays; eDP 1.4 or single-/dual-channel LVDS (factory alternatives); 3x DisplayPort 1.4
• Video resolution: Maximum resolution of 48 MP across all display outputs
• Mass storage: UFS 3.1 Gear 4, 2-lane drive soldered onboard, up to 256 GB
• Networking: 1x NBase-T Ethernet port implemented through a 2.5GbE PHY, with TSN support
• USB: Up to 8x USB 2.0 ports; up to 4x SuperSpeed USB ports, up to 5 Gbps
• PCIe: 1x PCIe Gen4 x4 port (NVMe ready); 1x PCIe Gen4 x2 port
• Audio: I2S audio interface
• Serial ports: 1x 2-wire UART; 1x 2-wire UART or CAN FD
• Other interfaces: 2x optional MIPI-CSI interfaces, 4 lanes

Security:

• Optional TPM 2.0

Power supply:

• +12VDC ±10%; +5V standby voltage; 3.0V RTC power rail

Norms & Standards:

• EN 55032 Class B (EMI); EN 55035 (EMS); FCC; EN 62368-1

Operating system:

• Clea OS; Yocto Linux

Operating temperature:

• 0°C to +60°C (Commercial Version); -40°C to +85°C (Industrial Version)

Dimensions:

• 95 x 95 mm