COM Express computer-on-module PN-SOM-COMe-CT6-P100

AMD Ryzen™ EmbeddedDisplayPortHDMI

Overview
COM Express® 3.1 Type 6 Compact Module SOM-COMe-CT6-P100 featuring AMD Ryzen™ AI Embedded P100 Series processors. Compact 95 x 95 mm module designed for embedded applications requiring AI acceleration, multimedia and extensive I/O options.

Highlights

• CPU AMD Ryzen™ AI Embedded P100 Series (P121, P132 and industrial variants)
• Graphics Integrated AMD Radeon™ RDNA™ 3.5 GPU, up to four concurrent 4K displays
• Memory 2x DDR5-5600 SO-DIMM slots with ECC support, up to 96GB
• Connectivity AMD XDNA™ 2 NPU up to 50 TOPS; 1x Nbase-T Ethernet with TSN (up to 2.5 Gbps); multiple USB and PCIe lanes

Security & Software

• Built-in Secure Boot and optional TPM 2.0
• OTA update support and device monitoring
• Yocto-based secure OS integration and Docker container support
• Compliance with EN18031-1 (vendor certification)

Technical data (summary)

• Description: COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series
• CPU Description: P121 (4x Zen5 cores, Dual Thread, up to 4.4 GHz, 30 TOPS, TDP 15–54W); P132 (6x Zen5 cores, Dual Thread, up to 4.5 GHz, 50 TOPS, TDP 15–54W); industrial variants P121i/P132i available with extended temperature range
• Memory Description: 2x DDR5-5600 SO-DIMM slots with ECC, up to 96GB
• Graphics Description: AMD Radeon™ RDNA™ 3.5 GPU, up to 4 Compute Units; HW-accelerated decode/encode (8K30 HEVC/VP9, 10b AV1)
• Video Interfaces Description: 2x DDI (DP 2.0, HDMI® 2.0b, DP Alt Mode over Type-C); 1x DDI (DP 2.0/HDMI® 2.0b); eDP 1.4 or LVDS dual-channel option
• Video Resolution Description: Up to 4x 4K concurrent; LVDS up to 1920x1200
• Mass Storage Description: Optional 2x SATA Gen3 channels (commercial modules)
• Networking Description: 1x Nbase-T Ethernet with TSN, up to 2.5 Gbps
• USB Description: 8x USB2.0 lanes; up to 1x 10Gbps + 3x 5Gbps Superspeed; 2x USB4 Gen3x2
• PCI Description: Up to 7x PCIe Gen4 x1 lanes; PCIe Graphics (PEG) x8 Gen4 port
• Audio Description: HD audio interface; SoundWire support
• Serial Ports: 2x 2-wire UARTs
• Other Interfaces: SPI, I2C, SMBus, LPC, FAN/thermal management; optional TPM 2.0; GPIOs and watchdog
• Power Supply: +12VDC ±10%; optional +5VSB, +3VRTC
• Operating System: Windows 11 LTSC (Yocto-based integrations supported)
• Operating Temperature Description: Commercial 0°C to +60°C; Industrial -40°C to +85°C
• Dimensions: 95 x 95 mm (COM Express™ Compact, Type 6)

Resources & Documents (references)
Datasheet, product images and developer documentation available from vendor resources.