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COM Express computer-on-module PN-SOM-COMe-BT6-ARL
Intel® Core™ UltraHDMIDisplayPort

COM Express computer-on-module - PN-SOM-COMe-BT6-ARL - SECO - Intel® Core™ Ultra / HDMI / DisplayPort
COM Express computer-on-module - PN-SOM-COMe-BT6-ARL - SECO - Intel® Core™ Ultra / HDMI / DisplayPort
COM Express computer-on-module - PN-SOM-COMe-BT6-ARL - SECO - Intel® Core™ Ultra / HDMI / DisplayPort - image - 2
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Characteristics

Form factor
COM Express
Processor
Intel® Core™ Ultra
Ports
HDMI, LVDS, DisplayPort, eDP, USB 3.0, 2.5 GbE, SATA, SATA III, PCI Express, DDR5 SO-DIMM
Operating system
Yocto, Windows 10 IoT Enterprise
Data storage
SSD 512GB
Other characteristics
embedded
Applications
industrial
Memory size

Max.: 64 GB

Min.: 0 GB

Description

Overview
COM Express Rel. 3.1 Type 6 Basic Module (E59) SOM-COMe-BT6-ARL based on Intel® Core™ Ultra Processors Series 2 (Arrow Lake) in H and U variants. Designed for embedded applications requiring CPU/GPU performance, multiple video outputs and extensive I/O and PCIe connectivity.

Highlights
  • CPU: Intel® Core™ Ultra Processors (Series 2 family), H and U SKUs
  • Graphics: Integrated Intel® Xe LPG+ graphics (up to 8 Xe cores / 128 EU)
  • Memory: 2x DDR5 SO-DIMM slots, IBECC support, up to 64 GB (DDR5-6400)
  • Connectivity: 1x NBase-T 2.5GbE (Intel® I226), up to 2x USB4 Gen2, 4x USB 10 Gbps, 8x Hi-Speed USB, up to 20 PCIe Gen4 lanes


Display & Video
  • Video interfaces: 3x DDIs (DP/HDMI), 1x eDP or single/dual-channel LVDS (factory options), 2x MIPI CSI channels (option)
  • Max resolution: HDMI® up to 8K60 (HDMI® 2.1); DP 2.1 up to 8K60 / 5K120; eDP 1.4b up to 4K120 HDR; up to 4 independent 4K60 displays


Storage & Expansion
  • Mass storage: optional onboard NVMe SSD (PCIe x4) up to 512 GB; factory alternative: up to 2x SATA Gen3.2 channels
  • PCIe: 1x PEG Gen4 x8 (H series) or 1x PEG Gen4 x4 (factory alt); up to 8x PCIe Gen4 lanes configurable in groupings x4/x2/x1


Audio, Serial & Other I/O
  • Audio: HD audio interface; SoundWire
  • Serial: 2x UARTs
  • Other interfaces: SPI, I2C, SMBus, eSPI or LPC (factory alt), TPM 2.0 (option), LID#/SLEEP#/PWRBTN#, watchdog, 4x GPI, 4x GPO, fan and thermal management


Power, OS & Environmental
  • Power supply: main +8 VDC to +20 VDC; auxiliary +5VSBY, +3VRTC
  • Operating systems: Windows 10 IoT Enterprise (2019 & 2021 LTSC); Yocto (Kirkstone)
  • Operating temperature: 0 °C to +60 °C (commercial version)
  • Dimensions: 125 x 95 mm (COM Express Basic, Type 6)


Security & Software Features
  • Built-in Secure Boot for platform integrity
  • OTA updates for secure remote software distribution
  • Device monitoring and management integration (Clea-compatible)
  • Yocto-based secure OS integration and Docker support for containerized applications


Technical specifications
  • Model: SOM-COMe-BT6-ARL (COM Express Rel. 3.1 Type 6 Basic, E59)
  • CPU variants: examples include 285H, 265H, 235H (H-SKUs) and 265U, 235U (U-SKUs) with vPRO options
  • Memory: 2x DDR5 SO-DIMM, up to 64 GB, IBECC
  • Graphics: Intel® Xe LPG+ up to 8 Xe cores (128 EU), up to 4 displays
  • Video: HDMI® 2.1, DP 2.1, eDP 1.4b, MIPI CSI (optional)
  • Storage: optional NVMe onboard (PCIe x4) up to 512 GB; up to 2x SATA Gen3.2 (factory alt)
  • Networking: 1x NBase-T (Intel I226) 2.5GbE
  • USB: up to 2x USB4 Gen2, 4x USB 10Gbps, 8x Hi-Speed USB
  • PCIe: PEG x8 Gen4 (H only) or PEG x4 Gen4 (alt), +8 lanes Gen4
  • Serial/other: 2x UART, SPI, I2C, SMBus, TPM 2.0 (opt), watchdog, GPI/GPO
  • Power: +8V ÷ +20V main; aux +5VSBY, +3VRTC
  • OS: Windows 10 IoT Enterprise (2019/2021 LTSC), Yocto Kirkstone
  • Operating temp: 0 °C ÷ +60 °C
  • Dimensions: 125 x 95 mm
  • Part number: PN-SOM-COMe-BT6-ARL

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