COM Express computer-on-module SOM-COMe-CT6-TWL

COM Express CompactIntel® Core i3Intel® Processor N-series

Overview
COM Express® Rel. 3.1 Type 6 computer-on-module SOM-COMe-CT6-TWL featuring Intel® Core™ i3 and Intel® Processors N Series (codename: Twin Lake). Compact 95 x 95 mm form factor designed for embedded and industrial systems.

Highlights

• CPU: Intel® Core™ i3-N355 and Intel® Processor N-Series options (N250, N150)
• Graphics: Integrated Intel® Gen12 UHD graphics, up to 32 EU; up to 3 independent displays
• Memory: 1x DDR5 SO‑DIMM slot supporting DDR5-4800 IBECC, up to 16 GB

Key features

• Multiple CPU SKUs supported (i3-N355: 8 cores, up to 3.9 GHz Turbo; N250/N150 low-power variants)
• Video outputs: 2x DDIs (DP/HDMI®, DP Alt-Mode over Type-C), 1x DDI (DP/HDMI®), 1x eDP or single/dual-channel LVDS (factory options)
• Video resolution: HDMI® up to 4K@60 Hz; DP 1.4 / eDP 1.4 up to 4096×2304@60 Hz; LVDS up to 1920×1200@60 Hz
• Mass storage: up to 2x SATA Rev.3 channels; optional eMMC 5.1 soldered on-board
• Networking: 1x NBase‑T Ethernet (MaxLinear GPY211/215), supporting 2.5GbE and TSN
• USB: up to 2x USB 10 Gbps; optional 3x USB 5 Gbps; 8x Hi‑Speed USB ports
• PCIe: up to 6x PCIe Gen3 lanes
• I/O: HD audio, SoundWire, 2x UARTs, SPI, 2x I2C, SMBus, watchdog, 4x GPI, 4x GPO; optional TPM 1.2/2.0, optional 2x CSI
• Power: +12 VDC ±10% (optional +5VSB, +3VRTC)
• OS support: Windows 10 IoT Enterprise 2019/2021 LTSC; Clea OS (Yocto)
• Operating temperature: 0°C to +60°C (commercial); -40°C to +85°C (industrial)

Technical specifications

• Form factor: COM Express® Rel. 3.1 Type 6 (Compact), 95 x 95 mm
• CPU options: Intel® Core™ i3-N355 (8 cores @1.9 GHz, up to 3.9 GHz Turbo, 15 W); Intel® Processor N250 (4 cores, up to 3.8 GHz Turbo, 6 W); Intel® Processor N150 (4 cores, up to 3.6 GHz Turbo, 6 W)
• Memory: 1x DDR5 SO‑DIMM, DDR5-4800 IBECC, up to 16 GB
• Graphics: Intel® Gen12 UHD, up to 32 EU, up to 3 independent displays
• Video interfaces: 2x DDI (DP/HDMI®, DP Alt‑Mode Type‑C); 1x DDI (DP/HDMI®); 1x eDP or LVDS (factory options)
• Storage: Up to 2x SATA Rev.3; optional eMMC 5.1 soldered
• Networking: 1x NBase‑T (2.5GbE) with MaxLinear GPY211/215, TSN support
• USB: up to 2x USB 10 Gbps; optional 3x USB 5 Gbps; 8x Hi‑Speed
• PCIe: up to 6x Gen3 lanes
• Audio / Serial: HD Audio, SoundWire; 2x UARTs
• Other interfaces: SPI, 2x I2C, SMBus, thermal & fan management, optional eSPI/LPC, TPM optional, LID#/SLEEP#/PWRBTN#, watchdog, 4x GPI, 4x GPO, optional 2x CSI
• Power input: +12 VDC ±10% (optionally +5VSB, +3VRTC)
• OS: Windows 10 IoT Enterprise 2019 LTSC / 2021 LTSC; Clea OS (Yocto)
• Temperature range: Commercial 0°C to +60°C; Industrial -40°C to +85°C (measured at standard heatspreader)
• Dimensions: 95 x 95 mm
• Example part numbers: ME90-H140-1122-C1; ME90-G100-2121-C1; ME90-F100-1121-C1; ME90-F100-1201-C1

Recommended applications

• Embedded controllers, industrial automation and HMI
• Edge computing, digital signage and vision systems
• Transportation, building automation and specialized OEM equipment