I.MX computer-on-module SOM-SMARC-MX952

NXPARM® Cortex®-A55 Quad-coreARM® Cortex M7

Overview
SOM-SMARC-MX952 is an SMARC® Rel. 2.1.1 module based on the NXP i.MX 952 Applications Processor. Featuring a quad-core Arm® Cortex®-A55 CPU, dedicated real-time processing cores and an integrated NPU delivering up to 0.5 TOP/s, it is designed for embedded applications requiring AI acceleration, multimedia capabilities and reliable industrial performance.

Highlights

• CPU: NXP i.MX 952 Applications Processor with 4x Arm® Cortex™-A55 cores @ 1.7 GHz, 1x Arm® Cortex®-M33 core @ 333 MHz and 1x Arm® Cortex®-M7 core @ 800 MHz
• AI Acceleration: Integrated NPU delivering up to 0.5 TOP/s, operating at up to 1.0 GHz
• Graphics: Arm Mali-G310 GPU (108 GFLOPS) with 2D acceleration
• Memory: Up to 16 GB LPDDR5 6.4 GT/s (32-bit)
• Video & Vision: 2x LVDS single-channel or 1x LVDS dual-channel; optional HDMI® interface; 1x 4-lane CSI camera interface
• Networking: 1x 2.5GbE and 1x or 2x 1GbE configurations
• Wireless Connectivity: Optional onboard Wi-Fi (802.11a/b/g/n/ac/ax) and Bluetooth®/BLE 5.3 module
• Storage: Up to 128 GB onboard eMMC 5.1; SD 4-bit interface
• Expansion: 1x PCIe Gen3 lane, multiplexed with the 2.5GbE interface

Security & Compliance

• Secure Boot: Built-in Secure Boot to ensure system integrity from the first startup
• OTA Updates: Remote and secure software update distribution for connected devices
• Device Monitoring: Continuous monitoring of device status and activity through Clea
• Secure Operating System: Yocto-based OS integration for customizable and secure system builds
• Certified Security: SECO products integrate security functions designed to enable compliance with the RED Directive (EN18031-1). Certification documentation is available upon request
• TPM: Optional onboard TPM 2.0
• Containerization: Docker technology for isolated and flexible application management

Technical Specifications

• Form factor: SMARC® Rel. 2.1.1
• Processor family: NXP i.MX 952 Applications Processor
• CPU: 4x Arm® Cortex™-A55 @ 1.7 GHz; 1x Arm® Cortex®-M33 @ 333 MHz; 1x Arm® Cortex®-M7 @ 800 MHz
• NPU: 0.5 TOP/s neural network performance, up to 1.0 GHz
• Graphics: Arm Mali-G310 GPU (108 GFLOPS) with 2D acceleration
• Memory: Up to 16 GB LPDDR5 6.4 GT/s (32-bit)
• Video interfaces: 2x LVDS single-channel or 1x LVDS dual-channel; optional HDMI® interface
• Camera interfaces: 1x 4-lane CSI camera interface
• Video resolution: LVDS and HDMI® up to 1080p @ 60 Hz
• Mass storage: Up to 128 GB eMMC 5.1 soldered onboard (boot device); SD 4-bit interface (boot device)
• Networking: 1x 2.5GbE; 1x 1GbE or 2x 1GbE
• Wireless connectivity: Optional onboard Wi-Fi 802.11a/b/g/n/ac/ax and Bluetooth®/BLE 5.3
• USB: Up to 5x USB 2.0 host ports
• PCIe: 1x PCIe Gen3 1-lane port, multiplexed with 2.5GbE
• Audio: 1x I2S audio interface
• Serial ports: 2x UART (4-wire); 2x UART (2-wire)
• Other I/O: 2x general-purpose PWM; fan management signals; up to 12x GPIOs; 1x general-purpose I2C bus; 1x power management I2C bus; 1x general-purpose SPI interface; 1x QuadSPI interface or additional general-purpose SPI interface; watchdog; boot select signals; power management signals; JTAG header
• TPM: Optional onboard TPM 2.0
• Power supply: +5VDC ±5% and +3.3V_RTC

Operating system:

• Linux; Clea OS; Yocto

Operating temperature:

• 0°C to +60°C (Commercial Range); -40°C to +85°C (Industrial Range)

Dimensions:

• 82 x 50 mm