MediaTek Genio 360 computer-on-module SODIMM-200

WiFiUSB 2.0gigabit Ethernet

Overview
SOM-Trizeps-X-Genio360 is a SODIMM-200 Computer-on-Module based on the MediaTek Genio 360 Applications Processor. Featuring a hexa-core Arm® CPU, a 5th-generation MediaTek NPU delivering up to 5.1 TOPS and an Arm Mali-G57 GPU, it is designed for embedded applications requiring efficient Edge AI processing, multimedia capabilities and compact integration. Its small 67.6 x 36.7 mm form factor makes it suitable for space-constrained embedded systems.

Highlights

• CPU: MediaTek Genio 360 processor with 1x Arm Cortex-A76 core @ 1.8–2.0 GHz and 5x Arm Cortex-A55 cores @ 1.7–2.0 GHz
• AI Acceleration: MediaTek 8th-Gen NPU delivering up to 5.1 TOPS
• Graphics: Arm Mali-G57 GPU operating at 550–700 MHz, with dual-display support
• Memory: 1 GB, 2 GB or 4 GB LPDDR4X/LPDDR4-3733 soldered onboard
• Display: DisplayPort 1.4 or eDP 1.3, LVDS and MIPI-DSI interfaces
• Camera Interfaces: 1x 4-lane MIPI-CSI and 1x 2-lane MIPI-CSI
• Connectivity: 1x Gigabit Ethernet MAC/PHY, with optional Wi-Fi and Bluetooth
• Storage: Onboard eMMC 5.1, up to 64 GB, plus EEPROM for configuration
• Expansion: 1x PCIe Gen2 x1 interface

Security & Compliance

• Secure Boot: Built-in Secure Boot to ensure system integrity from the first startup
• OTA Updates: Remote and secure software update distribution for connected devices
• Device Monitoring: Continuous monitoring of device status and activity through Clea
• Secure Operating System: Yocto-based OS integration for customizable and secure system builds
• Certified Security: SECO products integrate security functions designed to enable compliance with the RED Directive (EN18031-1). Certification documentation is available upon request
• TPM: Optional TPM 2.0
• Containerization: Docker technology for isolated and flexible application management

Technical Specifications

• Form factor: SODIMM-200
• Processor family: MediaTek Genio 360 Applications Processor
• CPU: 1x Arm Cortex-A76 @ 1.8–2.0 GHz; 5x Arm Cortex-A55 @ 1.7–2.0 GHz; ARMv8-A architecture; 128 KB L2 cache and shared L3 cache
• NPU: MediaTek 8th-Gen NPU, up to 5.1 TOPS
• Graphics: Arm Mali-G57 GPU @ 550–700 MHz, with dual-display support
• Memory: 1 GB, 2 GB or 4 GB LPDDR4X/LPDDR4-3733 soldered onboard
• Video interfaces: DisplayPort 1.4 or eDP 1.3; LVDS; MIPI-DSI
• Video resolution: Up to 4K @ 60 Hz via DisplayPort 1.4 or eDP 1.3
• Camera interfaces: 1x 4-lane MIPI-CSI; 1x 2-lane MIPI-CSI
• Mass storage: Onboard eMMC 5.1, up to 64 GB; EEPROM for configuration
• Networking: 1x Gigabit Ethernet MAC/PHY; optional Wi-Fi and Bluetooth
• USB: 1x USB 3.2 Gen 1; 1x USB 2.0 Host
• PCIe: 1x PCIe Gen2 x1
• Audio: Microphone input; Line-in; Headphone output; Mono speaker output
• Serial ports: 3x UART
• Other I/O: SDIO; I2C; 2x PWM; SPI; 4x Analog inputs
• Security: Optional TPM 2.0
• Power supply: 3.3V

Operating system:

• Clea OS

Operating temperature:

• 0°C to +70°C (Consumer); -25°C to +85°C (Extended Consumer); -40°C to +85°C (Industrial)

Dimensions:

• 67.6 x 36.7 x 6.4 mm