{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
AAEON has partnered with Kneron to deliver modules featuring their innovative AI Edge Computing processor, the KL520 Neural Processor Unit (NPU). The KL520 provides efficient AI computing performance of 0.56 TOPS per Watt, perfect for remote, mobile, ...
AAEON
Memory size: 0 GB - 64 GB
... The COM-HPC Mini module HPC-ARHm is a compact, high-performance embedded computing module based on Intel® Core™ Ultra Processors (Series 1/2), designed for space-constrained applications requiring multiple I/O and high-speed interfaces.
Key ...
AAEON
... Overview COM Express Compact Type 6 with 11th Generation Intel® Core™ Processor Family (formerly Tiger Lake UP3) Features -11th Generation Intel® Core™ Tiger Lake-UP3 SoC Processor -2 x SODIMM DDR4 3200MHz Memory, up to 64GB (in-band ECC) -Intel I225LM ...
AAEON
Memory size: 0 GB - 32 GB
... Overview
SMARC® Rel. 2.1.1 module for edge and embedded applications equipped with Qualcomm® Dragonwing™ IQ8 application processors. Designed for integration on a SMARC carrier board for industrial and commercial use.
Highlights
- CPU
SECO
Memory size: 0 GB - 64 GB
... Overview
COM-HPC® Size A Client Module SOM-COM-HPC-A-ARL designed for Intel® Core™ Ultra Processors (Series 2, Arrow Lake H and U). Modular board in COM-HPC Size A form factor (120 x 95 mm) for industrial edge, automation, vision systems and ...
SECO
Memory size: 0 GB - 64 GB
... Overview
μQseven Computer on Module (CoM) ELECTRA C72 integrating NXP i.MX 8M Mini and NXP i.MX 8M Nano processors. Compact 40 x 70 mm form factor with soldered DDR4 memory, on-board eMMC storage options and video interfaces for embedded industrial ...
SECO
Memory size: 64 GB
... Rich I/O: 1 Intel GbE, 4 10Gbase-KR, 2 USB 3.0, 4 USB 2.0 Multiple expansion: 2 PCIe x 8, 2 SATA 3.0 Support BMC features Dual channel DDR4 2400MHz SODIMM up to 32GB 15-Year CPU Life Cycle Support Until Q4' 31 (Based on Intel IOTG Roadmap) ...
DFI
Memory size: 64 GB
... Intel® Core™ Ultra Processor (Meteor Lake: U/H-series) Dual Channel DDR5 5600MHz SODIMM up to 64GB Multiple Displays: 1 VGA + 1 LVDS/eDP + 3 DDI Supports 4K / 2K resolution Multiple Expansion: 2 PCIe x4, 5 PCIe x1, 1 PCIe x8, 1 I2C, 1 SMBus Rich ...
DFI
Memory size: 64 GB
... Intel® Core® Processor Raptor Lake Series DDR5 4800MHz SODIMM up to 64GB 1 LVDS/eDP, 1 VGA, 3 DDI (HDMI/DP++) Multiple expansions: 2 PCIe x4 (Gen4 PCH), 5 PCIe x1 Rich I/O: 1 Intel GbE, 4 USB 3.2, 8 USB 2.0 15-Year CPU Life Cycle Support Until Q1' 38 ...
DFI
Memory size: 2 GB
... Unleash the full potential of the NXP i.MX8M Plus, featuring ARM® Cortex®-A53 processor and Neural Processing Unit (NPU). This empowers Artificial Intelligence (AI) and Machine Learning (ML) capabilities, enhances multimedia performance, supports cutting-edge ...
VEST
The robust CoreExpress plug connections are an important feature of the Syslogic computer-on-modules (COM boards). In contrast to other COM standards, this connection technology is suitable for heavy-duty industrial use. In addition, the computer-on-modules ...
Memory size: 16 GB - 128 GB
... UCM-iMX95 is an ultra-miniature System-on-Module (SoM) with high performance graphics and image processing, optimised for industrial applications and offering up to 6 ARM Cortex A55 Cores. Unique multi-core architecture with upto 6 ARM Cortex-A55 CPU, ...
... COM Express Type 6 Compact Size with Intel® J6412 Processor Specification Form Factor - COM Express® R3.0 Compact Module, Type 6 95W x 95D (mm) CPU - Intel® Celeron® J6412 Processor 10nm, 4 cores, 4 threads, up to 2.60 GHz TDP 10W Socket - ...
... ARM Cortex-A53 NXP i.MX8M, Small Footprint, System-on-Module. WiFi 802.11ac and Bluetooth 5 communication interfaces. Linux, Android and Yocto source code. Open carrier board specifications, design guides, and schematics. Pre-loaded plug and play ...
... Do you have growing requirements in the areas of multimedia and high-speed interfaces? The emCON-MX6 addresses these requirements and offers a long-term availability of up to 15 years. emtrions software specialists also provide you with in-house ...
emtrion GmbH
The VAR-SOM-MX8M-PLUS System on Module / Computer on Module is based on a 1.8GHz Quad Cortex™-A53 NXP’s iMX8M Plus processor with 800MHz Cortex™-M7 Real-time co-processor – a new generation of processors that combine integrated Artificial Intelligence ...
variscite
... COM-HPC Client Size A high performance module based on 11th Gen Intel® Core™ processor series (code name "Tiger Lake") COM HPC Client Size A PCI Express Gen 4 Embedded/Industrial use condition Extended temperature options available Integrated high ...
Congatec
Memory size: 2 GB - 8 GB
... Product overview
The Edge AI SoM computing module delivers scalable AI acceleration and multimedia processing for security, industrial automation and smart IoT at the edge. Built for real-time video analytics, predictive maintenance and autonomous ...
the best suppliers