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Memory size: 0 GB - 16 GB
... Overview
- COM Express Type 6 compact module (95 mm × 95 mm) for embedded systems
- Supports Intel Atom® X Series / N-series and Intel Core™ processors — maximum CPU TDP 15 W
- Onboard LPDDR5 memory, configurable up to 16 GB
- Integrated
AAEON
Memory size: 0 GB - 16 GB
... Overview
COM-TWLC6 Rev.B is a COM Express Type 6 Compact size module designed for embedded systems and industrial applications, supporting Intel Atom® N-series and Intel Core™ processors with a maximum TDP of 15W.
Key features
- Intel
AAEON
Memory size: 0 GB - 16 GB
... Overview
COM-ASLC6 Rev.B — COM Express Type 6 compact module featuring Intel Atom® X Series processors. Designed for compact COM Express Type 6 applications with a 95 mm × 95 mm footprint.
Key features
- Intel Atom® X
AAEON
... Overview
The VX3124 is a long-life 3U VPX computing node for embedded aerospace, defense and transportation systems. It provides dense multicore Arm® processing, secure architecture and high-speed I/O in a compact VPX form factor, optimized ...
Memory size: 1 GB - 4 GB
... Product Information
The OSM-S i.MX8M Mini from Kontron Electronics is a compact System-on-Module (SoM) compliant with the OSM standard. As a directly solderable module without connectors it supports automated, cost-efficient assembly in a 30 ...
Memory size: 64 GB
... Rich I/O: 1 Intel GbE, 4 10Gbase-KR, 2 USB 3.0, 4 USB 2.0 Multiple expansion: 2 PCIe x 8, 2 SATA 3.0 Support BMC features Dual channel DDR4 2400MHz SODIMM up to 32GB 15-Year CPU Life Cycle Support Until Q4' 31 (Based on Intel IOTG Roadmap) ...
DFI
Memory size: 64 GB
... Intel® Core™ Ultra Processor (Meteor Lake: U/H-series) Dual Channel DDR5 5600MHz SODIMM up to 64GB Multiple Displays: 1 VGA + 1 LVDS/eDP + 3 DDI Supports 4K / 2K resolution Multiple Expansion: 2 PCIe x4, 5 PCIe x1, 1 PCIe x8, 1 I2C, 1 SMBus Rich ...
DFI
Memory size: 64 GB
... Intel® Core® Processor Raptor Lake Series DDR5 4800MHz SODIMM up to 64GB 1 LVDS/eDP, 1 VGA, 3 DDI (HDMI/DP++) Multiple expansions: 2 PCIe x4 (Gen4 PCH), 5 PCIe x1 Rich I/O: 1 Intel GbE, 4 USB 3.2, 8 USB 2.0 15-Year CPU Life Cycle Support Until Q1' 38 ...
DFI
Memory size: 0 GB - 32 GB
... Overview
SMARC® Rel. 2.1.1 module for edge and embedded applications equipped with Qualcomm® Dragonwing™ IQ8 application processors. Designed for integration on a SMARC carrier board for industrial and commercial use.
Highlights
- CPU
SECO
Memory size: 0 GB - 64 GB
... Overview
COM-HPC® Size A Client Module SOM-COM-HPC-A-ARL designed for Intel® Core™ Ultra Processors (Series 2, Arrow Lake H and U). Modular board in COM-HPC Size A form factor (120 x 95 mm) for industrial edge, automation, vision systems and ...
SECO
Memory size: 0 GB - 64 GB
... Overview
μQseven Computer on Module (CoM) ELECTRA C72 integrating NXP i.MX 8M Mini and NXP i.MX 8M Nano processors. Compact 40 x 70 mm form factor with soldered DDR4 memory, on-board eMMC storage options and video interfaces for embedded industrial ...
SECO
Memory size: 96 GB
... Product Overview
COM Express Type 6 Compact-size computer-on-module PCOM-B65C with AMD Ryzen™ Embedded 8000 family support. Designed for embedded and industrial applications requiring high CPU/GPU performance, extensive PCIe lanes and flexible ...
Memory size: 2 GB - 8 GB
... Unleash the full potential of the NXP i.MX8M Mini, featuring ARM® Cortex®-A53 processor. This empowers Artificial Intelligence (AI) and Machine Learning (ML) capabilities, enhances multimedia performance, supports cutting-edge Edge Computing, provides ...
VEST
The robust CoreExpress plug connections are an important feature of the Syslogic computer-on-modules (COM boards). In contrast to other COM standards, this connection technology is suitable for heavy-duty industrial use. In addition, the computer-on-modules ...
Memory size: 16 GB - 128 GB
... UCM-iMX95 is an ultra-miniature System-on-Module (SoM) with high performance graphics and image processing, optimised for industrial applications and offering up to 6 ARM Cortex A55 Cores. Unique multi-core architecture with upto 6 ARM Cortex-A55 CPU, ...
... COM Express Type 6 Compact Size with Intel® J6412 Processor Specification Form Factor - COM Express® R3.0 Compact Module, Type 6 95W x 95D (mm) CPU - Intel® Celeron® J6412 Processor 10nm, 4 cores, 4 threads, up to 2.60 GHz TDP 10W Socket - ...
... ARM Cortex-A53 NXP i.MX8M, Small Footprint, System-on-Module. WiFi 802.11ac and Bluetooth 5 communication interfaces. Linux, Android and Yocto source code. Open carrier board specifications, design guides, and schematics. Pre-loaded plug and play ...
... Do you have growing requirements in the areas of multimedia and high-speed interfaces? The emCON-MX6 addresses these requirements and offers a long-term availability of up to 15 years. emtrions software specialists also provide you with in-house ...
emtrion GmbH
The VAR-SOM-MX8M-PLUS System on Module / Computer on Module is based on a 1.8GHz Quad Cortex™-A53 NXP’s iMX8M Plus processor with 800MHz Cortex™-M7 Real-time co-processor – a new generation of processors that combine integrated Artificial Intelligence ...
variscite
... COM-HPC Client Size A high performance module based on 11th Gen Intel® Core™ processor series (code name "Tiger Lake") COM HPC Client Size A PCI Express Gen 4 Embedded/Industrial use condition Extended temperature options available Integrated high ...
Congatec
Memory size: 2 GB - 8 GB
... Product overview
The Edge AI SoM computing module delivers scalable AI acceleration and multimedia processing for security, industrial automation and smart IoT at the edge. Built for real-time video analytics, predictive maintenance and autonomous ...
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