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Overview COM Express Type 6 Compact Size with AMD Ryzen™ Embedded R2000 Series Processors Features - DDR4 3200MHz SODIMM x 2, up to 32GB - USB 2.0 x 8, USB3.2 10Gbps x2, USB3.2 5Gbps x1 - PCIe [x4] x 1, PCIe [x1] x 4, PEG [x4] ...
AAEON
Overview COM Express Compact Type 6 with 11th Generation Intel® Core™ Processor Family (formerly Tiger Lake UP3) Features -11th Generation Intel® Core™ Tiger Lake-UP3 SoC Processor -2 x SODIMM DDR4 3200MHz Memory, up to 64GB (in-band ...
AAEON
COM Express Type 10 CPU Module with Onboard Intel® Atom™/Celeron®/Pentium®Processor Features - Intel Atom® x6000E,Pentium®, Celeron® series Processor - Onboard Memory LPDDR4, up to 16GB - Intel i226IT 2.5GbE x 1 - 18/24-bit Single ...
AAEON
Memory size: 2 GB - 8 GB
Unleash the full potential of the NXP i.MX8M Mini, featuring ARM® Cortex®-A53 processor. This empowers Artificial Intelligence (AI) and Machine Learning (ML) capabilities, enhances multimedia performance, supports cutting-edge Edge Computing, ...
VEST
Memory size: 1 GB - 3 GB
Unleash the full potential of the NXP i.MX8M Nano, featuring Arm® Cortex®-A53 cores and Cortex®-M7 core. This provides cost-effective integration and affordable performance for smart, connected, power-efficient devices requiring graphics, vision, ...
VEST
Memory size: 2 GB - 8 GB
Unleash the full potential of the NXP i.MX8M Plus, featuring ARM® Cortex®-A53 processor and Neural Processing Unit (NPU). This empowers Artificial Intelligence (AI) and Machine Learning (ML) capabilities, enhances multimedia performance, ...
VEST
Memory size: 12 GB
SMARC® 2.1.1 module with Qualcomm® QCS5430 processor Cpu 2x Arm® Cortex®-A78 @2.4 GHz, 4x Arm® Cortex®-A55 Memory Soldered-down LPDDR5-6400 memory, up to 12GB total, 32-bit interface 2 channels Graphics Qualcomm® Adreno™ 642L Video ...
SECO S.p.A.
Memory size: 0 GB - 8 GB
The COM Express® Computer on Module (CoM) SOM-COMe-CT6-APL is a real powerhouse, with up to 8GB DDR3L memory on two SO-DIMM slots. Also available in the industrial temperature range, it delivers outstanding graphics performance through ...
SECO S.p.A.
Memory size: 0 GB - 8 GB
SMARC® Rel. 2.1.1 Computer on Module (CoM) with MediaTek Genio 700 Applications Processors Audio - 2x I2S port Serial Ports - 2x UART (4-wires) 2x UART (2-wires) Other Interfaces - GPIOs MIPI-CSI camera interface General ...
SECO S.p.A.
Memory size: 2, 4 GB
JSOM-N8MC is an Arm-based SMARC 2.1.1 Computer-on-Module powered by industrial grade NXP i.MX 8M Mini SoC, which includes 4x Arm Cortex-A53 cores and integrates a Cortex-M4 co-processor for real-time control. It features on on-board WiFi+BT ...
JWIPC TECHNOLOGY CO., LTD.
Memory size: 2, 4, 6 GB
JSOM-N8PC is an Arm-based SMARC 2.1.1 Computer-on-Module powered by industrial grade NXP i.MX 8M Plus SoC, whichincludes 4x Arm Cortex-A53 cores, and integrates a 2.3 TOPS NPU for machine learning acceleration. It offers multiple display ...
JWIPC TECHNOLOGY CO., LTD.
SMARC® Rel. 2.1.1 computer-on-moduleJSOM-R68C series
Memory size: 2, 4 GB
JSOM-R68C is an Arm-based SMARC 2.1.1 Computer-on-Module powered by industrial grade Rockchip RK3568J SoC, which includes 4x Arm Cortex-A55 cores, and integrates a 1 TOPS NPU for machine learning acceleration. It offers multiple display ...
JWIPC TECHNOLOGY CO., LTD.
Memory size: 64 GB
Intel® Core™ Ultra Processor (Meteor Lake: U/H-series) Dual Channel DDR5 5600MHz SODIMM up to 64GB Multiple Displays: 1 VGA + 1 LVDS/eDP + 3 DDI Supports 4K / 2K resolution Multiple Expansion: 2 PCIe x4, 5 PCIe x1, 1 PCIe x8, 1 I2C, ...
DFI
Memory size: 16, 8 GB
Intel® Atom® Processor Amston Lake Series Dual Channel LPDDR5 4800MHz up to 16GB 1 LVDS/eDP, 1 DDI (HDMI/DP++)；Supports dual displays: DDI + LVDS/eDP Multiple expansions: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC Rich I/O: 2 USB 3.1, 8 USB ...
DFI
Memory size: 64 GB
Intel® Core® Processor Raptor Lake Series DDR5 4800MHz SODIMM up to 64GB 1 LVDS/eDP, 1 VGA, 3 DDI (HDMI/DP++) Multiple expansions: 2 PCIe x4 (Gen4 PCH), 5 PCIe x1 Rich I/O: 1 Intel GbE, 4 USB 3.2, 8 USB 2.0 15-Year CPU Life Cycle Support ...
DFI
Memory size: 8 GB
◼ Compatible with SMARC2.0 and SMARC2.1 ◼ Triple display up to 4K2K (DP++, HDMI, LVDS/eDP) ◼ Dual-channel LPDDR4 has up to 8GB of memory and supports IBECC ◼ Rich I/O extensions include PCIe (gen2), USB3.2 (Gen2), USB2.0, and ...
Memory size: 32, 64 GB
*45W CPU SKUs are available upon request Chipset - MCP BIOS - AMI SPI 256 Mbit Form Factor Dimensions - COM Express Compact Type 6 (3.74-in x 3.74-in x 0.52-in, 9.5 cm x 9.5 cm x 1.3 cm) Memory Technology - Dual Channel DDR4 ...
ASRock Industrial
Memory size: 32, 64 GB
chipset - MCP BIOS - AMI SPI 256 Mbit Form Factor Dimensions - COM Express Compact Type 6 (3.74-in x 3.74-in x 0.52-in, 9.5 cm x 9.5 cm x 1.3 cm) Graphics Controller - Intel® Iris® Xe Graphics HDMI - HDMI 2.1 Max resolution ...
ASRock Industrial
Memory size: 32, 64 GB
Chipset - MCP BIOS - AMI SPI 256 Mbit Form Factor Dimensions - COM Express Compact Type 6 (3.74-in x 3.74-in x 0.52-in, 9.5 cm x 9.5 cm x 1.3 cm) Memory Socket - 2 x 260-pin SO-DIMM Graphics Controller - Intel® Iris® Xe Graphics HDMI ...
ASRock Industrial
Memory size: 0 GB - 8 GB
Asus EHLMA-IM-A is designed with Intel® Elkhart Lake Atom® x6000 series SOC with Type 10 pin definition. It brings three important factors including DDR4 memory support, PCIe Gen3 support, and USB 3.2 GEN2 support. Extend PCIe Gen3 ports ...
ASUSTeK computer INC
Memory size: 64, 128 GB
The COM Express® module COMe-bDV7 based on the Intel® Atom® processor C3000 series extends Kontron’s product family of server-grade COM platforms. The COMe-bDV7 as an entry level platform is as a complementary product to the high performance ...
Kontron America
COM Express computer modules are perfect for OEMs designing computing platforms into equipment for industrial or harsh environments, and when reducing the overall design cycle and lowering validation costs are of key importance. Available ...
An advanced System On Module (SOM) solution is now available from ARBOR Technology designed to accelerate the development of IoT applications. The SM1200 is capable of driving 4K displays and multiple touch screens and supports the ...
ARBOR Technology Corp.
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior ...
ADLINK TECHNOLOGY
The VIA SOM-6X50 module delivers the perfect balance of performance and rich multimedia features in an ultra-compact, highly-flexible package for a wide range of IoT automation and HMI applications such as transportation, retail, and ...
VIA Technologies
COM Express Compact Size (Type 6) Form Factor Intel® Kaby Lake / Skylake Processor Intel® Kaby Lake / Skylake Core i7/i5/i3 / Celeron ULV processors Intel® vPro technology support 2 x DDR4 SO-DIMM and support up to 32GB Support triple ...
Portwell PQ7-M107 is designed with Intel® Atom™ N3000 series processor. PQ7-M107 Quad core processor features low power than previous Atom platforms. PQ7-M107 could be implemented in manufactory, transportation and automation applications. ...
PORTWELL
Do you have growing requirements in the area of virtualization, multimedia and high-speed Interfaces? The emCON-MX8M Mini meets the requirements and offers a long-term availability of up to 15 years. In addition, emtrion's software ...
emtrion GmbH
The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor ...
COM Express Type 6 Compact Size with Intel® J6412 Processor Specification Form Factor - COM Express® R3.0 Compact Module, Type 6 95W x 95D (mm) CPU - Intel® Celeron® J6412 Processor 10nm, 4 cores, 4 threads, up to 2.60 GHz TDP ...
Features Intel® Atom™ processor (Bay Trail) Onboard DDR3L up to 4GB Max. up to 4 lanes of PCIe 2 SATA-300 8 USB 2.0 and 1 USB 3.0 Introduction The CEM846 COM Express type 10 Mini module is powered by the Intel® Atom™ processor ...
Onboard AMD Geode LX800 @ 0.9W 500MHz with 128K L2 Cache CPU AMD Geode LX800/ CS5536 Chipset One 200-pin SODIMM Up to 1GB DDR SDRAM Dual View, TFT, LVDS, Audio Dual Realtek RTL8101L LAN ITE IT8888G PCI to ISA Bridge ...
Avalue Technology Inc.
The network-enabled ConnectCore for i.MX53 is a highly integrated and future-proof system-on-module (SoM) solution based on the new NXP/Freescale i.MX53 application processor with a high performance 1 GHz ARM Cortex-A8 core, wired and ...
Memory - LPDDR4-1866, 2/4GB, on board Storage - 1*eMMC 16/32/64G, 1*TF Card Expansion Interface - 1*Mini-PCIe (Wifi/3G/4G supported) System - Android, Linux I/O Interface Ethernet - 2*Realtek® 1Gbps PCIe Ethernet Controller, ...
Shenzhen Seavo Technology Co., Ltd.
ST002- carrier board •Flexible interface for verification •Expedite customer's evaluation board development •Interface: 1 x VGA, 1 x HDMI or DP, 4 x mini PCIe, 3 x SIM holder, 2 x USB 3.0, 2 x USB 2.0, 4 x COM, 2 x GbE, Line-out, Mic-in
Energy-efficient System on Module / Computer on Module with integrated AI/ML NPU (Neural Processing Unit) acceleration for smart embedded systems, at an attractive price point. The SoM runs on 1.7GHz Dual Cortex™-A55 NXP iMX93 processor ...
variscite
COM-HPC Server Size E module based on Intel® Xeon® D processor series (code name "Ice Lake") Industrial Use Condition with extended Temperature options 48 PCIe Express lanes AI Capabilities with Intel® DL boost Real Time Capable ...
Congatec
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