The RK701 is a Qseven form-factor System-on-Module from DFI, powered by Rockchip RK3568 / RK3568J quad‑core Cortex‑A55 processors. It is designed for embedded and edge systems that require multi-display support, multiple expansion interfaces and configurable DDR4 memory options.
Highlights- Memory options: 2GB / 4GB / 8GB DDR4 (memory down)
- Supports 4K / 2K resolutions and dual-display configurations (eDP/LVDS + DP/TMDS)
- Expansion: 2 x PCIe 3.0, 1 x PCIe 2.0
- Rich I/O: 1 x Realtek GbE, 1 x USB 3.2, 4 x USB 2.0
Documentation & downloads- Datasheet, Quick Reference and Manual available as product PDFs (see product documents)
Technical specifications- Processor: Rockchip RK3568 quad‑core Cortex‑A55 @ 2.0 GHz; Rockchip RK3568J quad‑core Cortex‑A55 @ 1.8 GHz
- Memory: 2GB / 4GB / 8GB DDR4 Memory Down, 3200 MHz
- Graphics: GPU G52 2EE; supports OpenGL ES 1.1/2.0/3.0/3.1/3.2, Vulkan 1.1, OpenCL 2.0
- Display: 1 x eDP/LVDS and 1 x DP/TMDS; HDMI up to 4096 x 2160 @ 30Hz; LVDS up to 1024 x 600 @ 60Hz; eDP up to 3840 x 2160 @ 60Hz
- Dual Displays: eDP/LVDS + DP/TMDS
- Expansion / Interfaces: 2 x PCIe x1 (Gen3), 1 x PCIe x1 (Gen2), 1 x uSD (on request), 1 x I2C, 2 x SPI (SPI0 set to TPM 2.0), 1 x CAN bus, 2 x UART, 1 x MIPI‑CSI (on request)
- Audio: HD Audio interface
- Ethernet: 1 x RTL8211F‑CG (Realtek Gigabit Ethernet)
- USB: 1 x USB 3.2, 4 x USB 2.0
- SATA: 2 x SATA 3.0 (up to 6 Gb/s; SATA 1 co‑lay PCIe Gen2)
- eMMC: Supports up to 128 GB eMMC; eMMC 5.1, BGA‑153 Ball 8~128G (MLC mode); default NC
- GPIO: 1 x 4‑bit GPIO
- Security: TPM 2.0
- Power: Type: 5V, 5VSB, VCC_RTC; Consumption: TBD
- OS Support: Linux
- Environment: Operating temperature ranges: 0 to 60°C (standard), -40 to 85°C (selected SKUs); Humidity operating: 5 to 90% RH; Storage: 5 to 90% RH
- Mechanics: Qseven form factor, dimensions 70 mm x 70 mm; Compliance: Qseven specification revision 2.1
- Standards & Certifications: CE, FCC Class B, RoHS
- Packing List: 1 x RK701 board; 1 x Heat sink
- Country of Origin: Taiwan