PICMG system-on-module ASL968

COM Express CompactIntel Atom® x7433REIntel Atom® x7211RE

Overview

The ASL968 is a COM Express® Compact Type 6 module from DFI designed for rugged and industrial embedded systems. It supports Intel® Atom® x7000RE (Amston Lake) and Intel® Core™ 3 / N-series (Twin Lake) processors, single-channel DDR5 memory with In-band ECC, and triple independent display outputs. The module prioritizes flexible expansion and extensive onboard I/O for industrial applications.

Key highlights

• COM Express® Compact Type 6 form factor (95 mm x 95 mm)
• Supports Intel® Atom x7000RE and Intel® Core™ 3 / N-series processors
• Single-channel DDR5-4800 SODIMM up to 16 GB with In-band ECC support
• Triple independent displays: 1 x LVDS/eDP + 2 x DDI (eDP up to 4096x2160 @60Hz)
• Up to 8 x PCIe x1 (Gen3) expansion and rich onboard I/O including Intel® 2.5GbE, SATA, USB

Technical specifications

• Processor: Intel® Atom x7000RE series (Amston Lake) and Intel® Core™ 3 / N-series (Twin Lake). Example SKUs: Atom x7835RE, x7433RE, x7211RE; Core 3 N355, N150.
• Memory: One 262-pin SODIMM, single-channel DDR5‑4800 up to 16 GB; In-band ECC (IBECC) supported.
• BIOS: AMI SPI 256 MHz.
• Graphics: Intel® UHD graphics; supports DirectX 12, OpenGL 4.6, Vulkan 1.2; HW decode/encode up to 4K60 (AV1, HEVC, VP9, SCC).
• Display: 1 x LVDS (dual channel up to 1920x1200 @60Hz) or eDP (4096x2160 @60Hz) + 2 x DDI; triple independent displays supported.
• Expansion: Up to 8 x PCIe x1 (Gen3) with support for multiple device layouts; optional co-layouts with Ethernet and SATA upon request.
• Interfaces: I2C, SMBus, LPC (default) / eSPI (BOM option), 2 x UART (TX/RX), CAN (co-layout option), 1 x 8-bit DIO.
• USB & Storage: 2 x USB 3.2 Gen2 (option to 4 via hub), 8 x USB 2.0; 2 x SATA 3.0 (6 Gb/s); 1 x 64 GB eMMC 5.1 onboard.
• Audio & Ethernet: HD Audio interface; 1 x Intel® I226 series 2.5GbE (co-layout with PCIe x1 available).
• Security: TPM 2.0 (option: fTPM).
• Power: ATX mode 8.5–20 V, 5VSB, VCC_RTC; AT mode 8.5–12 V, VCC_RTC. Power consumption: TBD.
• OS Support: Windows 11/10 IoT Enterprise 64-bit, Linux.
• Environment: Operating temp: -40°C to 85°C (Amston Lake SKUs); 0°C to 60°C (Twin Lake SKUs). Storage: -40°C to 85°C. Operating humidity 10%–90% RH.
• Dimensions & Compliance: COM Express® Compact 95 mm x 95 mm; PICMG COM Express® R3.1 Type 6.
• Certifications: CE, FCC, RoHS.
• Packing list: Cooler (A71-108312-000G); Heatspreader (CPU block only) A71-810417-000G; Thermal grease 912-077832-000G.
• Country of origin: Taiwan.