OverviewThe QRB812 is an Open Standard Module (OSM 1.1) System-on-Module from DFI based on the Qualcomm QRB5165 SoC. It is engineered for compact industrial and embedded applications such as AMR, robotics and drones, where multi-camera support, dual-display capability and multiple high-speed expansion interfaces are required.
Technical specifications- Processor: Qualcomm QRB5165 — Kryo cluster: quad high-performance Kryo Gold and quad low-power Kryo Silver. Three Kryo Gold cores with 256 KB L2/core (Fmax 2.419 GHz); one Kryo Gold prime core with 512 KB L2 (Fmax 2.842 GHz); quad Kryo Silver cores with 128 KB L2/core (Fmax 1.805 GHz).
- Memory: PoP LPDDR5, 8GB (soldered).
- Graphics: Adreno 650 GPU; supports OpenGL ES 3.2, Vulkan 1.1, DirectX12 FL 12_1, OpenCL 2.0.
- Display: 1 × 4-lane MIPI-DSI (carrier board to HDMI); 1 × DisplayPort 1.4 via USB Type-C on carrier board.
- Storage: 128GB UFS 3.1.
- I/O & Interfaces: 2 × PCIe x2 (Gen3); 1 × PCIe x1 (Gen3); 2 × I2C; 2 × SPI; 4 × PWM; 2 × UART (TX/RX/RTS/CTS); 2 × UART (TX/RX); 1 × UART (console); 1 × 4-bit SDIO; 6 × 4-lane MIPI-CSI; 2 × USB 3.1 Gen2 (USB0 for download or USB Type-C); 16 × GPIO.
- Security: Qualcomm® Trusted Execution Environment (TEE) v5.
- Power: Input: 5 V DC; Consumption: TBD.
- OS support: Linux — Ubuntu.
Mechanical & Environmental- Dimensions: 45 mm × 45 mm (1.77" × 1.77"); OSM 1.1 compliant (some pins may differ — refer to user manual).
- Operating temperature: -5°C ~ 65°C.
- Storage temperature: -40°C ~ 85°C.
- Humidity: Operating/Storage: 10% ~ 90% RH.
- MTBF: TBD.
Certifications & Packing- Standards: CE, FCC, RoHS.
- Packing list: 1 × QRB812 module.
- Country of origin: Taiwan.
Applications & Ordering- Intended applications: Automation, AMR, robotics, drones and other compact embedded systems.
- Ordering example: Model: QRB812BC82-5165 — Qualcomm QRB5165, 8GB memory, 128GB UFS 3.1, MIPI-DSI + USB-C DP, 5VDC, -5°C~65°C. Part number and options: contact DFI for variants and availability.