PICMG system-on-module ADN9A2

COM Express MiniIntel® Core™ i3-N305Intel Atom® x7425E

Overview

The ADN9A2 is a COM Express® Mini (Type 10) System-on-Module from DFI, powered by Intel® Atom® / Core / Pentium / Celeron processors (Alder Lake‑N family). It is engineered for fanless embedded applications, supports LPDDR5 memory and offers multiple high-speed I/O, expansion and dual-display options for industrial deployments.

Key features

• Fanless design for passive cooling
• Supports LPDDR5 dual-channel memory up to 16 GB
• 4 x PCIe x1 (Gen3) expansion lanes
• Dual-display: DDI + LVDS/eDP; up to 4K resolution support
• Rich I/O: USB 3.2, USB 2.0, SATA, eMMC options
• 2.5G Ethernet (Intel® I226 family)

Technical specifications

• Processor: Intel® Atom x7000E / Core-i / Pentium / Celeron series (Alder Lake‑N). Examples: Intel® Atom x7425E (4 cores, 1.5–3.4 GHz, 12 W); Intel® Core i3‑N305 (8 cores, 1.0/1.8–3.8 GHz, 9/15 W); Intel® N97 (4 cores, 2.0–3.6 GHz, 12 W); Intel® N50 (2 cores, 1.0–3.4 GHz, 6 W).
• Memory: LPDDR5 dual channel up to 16 GB (LPDDR5 4800 MHz). 8 GB / 16 GB options by project basis. In‑band ECC (IBECC) supported.
• BIOS: AMI SPI 256 Mbit (UEFI only).
• Graphics controller: Intel® UHD. Graphics features: OpenGL 4.6, DirectX 12.1, Vulkan 1.2 (Windows); Mesa/OpenGL/Vulkan stack on Linux. HW decode: 4K60 10b HEVC/VP9/AV1; HW encode: 4K60 HEVC/VP9.
• Display: 1 x DDI; 1 x LVDS/eDP. LVDS: single channel 24-bit up to 1920×1200@60Hz. eDP: up to 4096×2160@60Hz. HDMI: up to 4096×2160@30Hz. DP++: up to 4096×2160@60Hz (3840×2160@60Hz).
• Dual displays: DDI + LVDS/eDP.
• Expansion / Interfaces: 4 x PCIe x1 (Gen3); 1 x I2C; 1 x SMBus; 1 x LPC; 1 x SNDW (on request); 1 x GSPI; 2 x UART (TX/RX).
• Audio: HD Audio.
• Ethernet: 1 x Intel® I226‑IT / I226‑LM supporting 10/100/1000 Mbps and 2.5 Gbps.
• I/O: 2 x USB 3.2 Gen2; 8 x USB 2.0; 2 x SATA 3.0 (6 Gb/s); 1 x eMMC 5.1 (8/16/32/64/128 GB options on request); 1 x 8‑bit DIO.
• Watchdog timer: System reset, programmable 1–255 s.
• Security: Optional dTPM or fTPM.
• Power: Input: ATX mode 4.75–20 V, 5VSB, VCC_RTC; AT mode 4.75–20 V, VCC_RTC. Power consumption: TBD.
• OS support (UEFI only): Windows 11/10 IoT Enterprise 64‑bit; Linux.
• Environment: Operating: -5 to 65 °C; Storage: -40 to 85 °C. Humidity: 5–90% RH. MTBF: 1,394,204 hrs @25 °C; 927,579 hrs @45 °C; 637,575 hrs @60 °C (excl. accessories).
• Mechanism / Dimensions: COM Express® Mini 84 mm × 55 mm (3.3" × 2.16").
• Compliance: PICMG COM Express® R3.1 Type 10.
• Standards & certifications: CE, FCC.
• Packing list: Heat sink A71-008356-000G (included).
• Country of origin: Taiwan.

Ordering & support

Project options (memory, eMMC, SNDW, TPM) and customization available on request. Contact DFI for qualification, thermal options and long-term supply agreements.