COM Express system-on-module TGH960

PICMG11th Generation Intel® Core™Intel® Core™ i5-11500H

The TGH960 is a COM Express® Basic (Type 6) system-on-module from DFI designed for industrial applications that require high I/O density, multiple expansion lanes and long CPU lifecycle support.

Highlights

• COM Express® Basic (Type 6) form factor — 95 mm x 125 mm
• Supports 11th Gen Intel® Core™ / Xeon® / Celeron® processors with Intel® Iris® Xe Graphics
• DDR4 3200MHz SO-DIMM support up to 96GB (128GB on request)
• Multiple expansion: 1 x PCIe x16 (Gen4), 8 x PCIe x1 (Gen3), LPC, I2C, SMBus
• Rich I/O: 1 x Intel® 2.5GbE (I225), 4 x USB 3.2 Gen2, 8 x USB 2.0, 4 x SATA 3.0 (RAID 0/1/5/10)
• Video outputs: VGA + LVDS/eDP (eDP on request) + 3 x DDI (HDMI/DP++), DP++ supports 4K
• Operating temperature: standard 0–60°C; wide-temp models available -40–85°C

Processor options

• Intel® Xeon® W-11865MRE — 8 cores, 24 MB cache, 2.6 GHz (4.7 GHz), 45 W
• Intel® Xeon® W-11865MLE — 8 cores, 24 MB cache, 1.5 GHz (4.5 GHz), 25 W
• Intel® Core™ i7-11850HE — 8 cores, 24 MB cache, 2.6 GHz (4.7 GHz), 45 W
• Intel® Xeon® W-11555MRE — 6 cores, 12 MB cache, 2.6 GHz (4.5 GHz), 45 W
• Intel® Xeon® W-11555MLE — 6 cores, 12 MB cache, 1.9 GHz (4.4 GHz), 25 W
• Intel® Core™ i5-11500HE — 6 cores, 12 MB cache, 2.6 GHz (4.5 GHz), 45 W
• Intel® Xeon® W-11155MRE — 4 cores, 8 MB cache, 2.4 GHz (4.4 GHz), 45 W
• Intel® Xeon® W-11155MLE — 4 cores, 8 MB cache, 1.8 GHz (3.1 GHz), 25 W
• Intel® Core™ i3-11100HE — 4 cores, 8 MB cache, 2.4 GHz (4.4 GHz), 45 W
• Intel® Celeron® 6600HE — 2 cores, 8 MB cache, 2.6 GHz, 35 W

Technical specifications

• Chipset: Intel® RM590E / QM580E / HM570E
• Memory: 3 x DDR4 3200MHz SO-DIMM (up to 96GB; optional 4th DIMM by request), dual channel; ECC available on request
• BIOS: AMI SPI 256 Mbit
• Graphics: Intel® Iris® Xe — OpenGL 4.5, DirectX 12, OpenCL 2.1; HW decode/encode for multiple codecs (HEVC/AVC/VP9/AV1)
• Display: 1 x VGA; 1 x LVDS / eDP (eDP on request); 3 x DDI (HDMI / DP++) — multiple display configurations supported
• Storage: optional NVMe SSD (PCIe x4 Gen4, 64 GB–1 TB); SSD and 2nd SO-DIMM share signals (alternative functions)
• Expansion interfaces: 1 x PCIe x16 (Gen4), 8 x PCIe x1 (Gen3), LPC, I2C, SMBus, 2 x UART (TX/RX)
• Audio: HD Audio codec
• Ethernet: 1 x Intel® I225 series PHY (10/100/1000 / 2.5G)
• USB: 4 x USB 3.2 Gen2; 8 x USB 2.0
• SATA: 4 x SATA 3.0 (up to 6 Gb/s), RAID 0/1/5/10 supported
• DIO: 1 x 8-bit DIO (default 4 inputs, 4 outputs)
• Watchdog: programmable 1–255 seconds
• Security: TPM 2.0 available on request
• Power: Input 8.5 V–20 V; 5 VSB, VCC_RTC (ATX mode) — power consumption TBD
• OS support: Windows 10 IoT Enterprise 64-bit; Linux Ubuntu 20.04
• Environment: Operating 0–60°C (wide -40–85°C optional); storage -40–85°C; humidity 5–90% RH
• Mechanics / Dimensions: COM Express® Basic — 95 mm x 125 mm (3.74" x 4.9")
• Compliance: PICMG COM Express® R3.0 Type 6
• Certifications: CE, FCC, UKCA, RoHS
• Country of origin: Taiwan