PICMG system-on-module MTH966

COM Express CompactIntel® Core™ Ultra 7 155HIntel® Core™ Ultra 5 125H

Overview

The MTH966 is a COM Express® Compact Type 6 system-on-module by DFI, built for industrial and embedded applications that require high compute density, multiple display outputs and extensive I/O expansion. It is powered by Intel® Core™ Ultra (Meteor Lake) U/H-series processors and offered in wide-temperature variants for rugged environments.

Key highlights

• Processor: Intel® Core™ Ultra (Meteor Lake) U/H-series (multiple SKUs available: Ultra 7 155H/165H, Ultra 5 125H, Ultra 7 155U, Ultra 5 125U).
• Memory: Dual-channel LPDDR5 up to 32 GB (up to 7467 MHz).
• Display: 1 x LVDS/eDP (eDP on request) + up to 3 x DDI, supports up to 4K/2K resolutions.
• Expansion: Multi-lane PCIe (8 x PCIe x1, 2 x PCIe x4, 1 x PCIe x8), I2C, SMBus, LPC/eSPI, UARTs.
• I/O connectivity: 1 x Intel® 2.5GbE, 2 x USB4 (option), 4 x USB 3.2 Gen2, 8 x USB 2.0, 2 x SATA 3.0.
• Storage & security options: On-board NVMe SSD options and TPM available on request.

Ordering / variants summary

• Available SKUs address different thermal and power envelopes (H-series for higher TDP, U-series for low-power / wide-temp operation).
• Example SKUs: MTH966-BC30-155H (Core Ultra 7 165H, 32GB LPDDR5, 0–60°C), MTH966-TC10-155U (Core Ultra 7 155U, 16GB LPDDR5, -40–85°C).

Certifications & compliance

• CE, FCC, RoHS compliant.

Technical specifications

• Processor details: Supported SKUs include Core Ultra 7 155H (6 P‑Cores @1.4 GHz + 8 E‑Cores @0.9 GHz), Core Ultra 5 125H, Core Ultra 7 155U, Core Ultra 5 125U.
• Memory: Dual-channel LPDDR5 up to 32 GB (spec up to 7467 MHz).
• BIOS: AMI BIOS.
• Graphics: Intel® Arc™ Graphics on H SKUs; Intel® Graphics on U SKUs. Support for DirectX12, OpenGL 4.6, Vulkan 1.2; HW decode/encode (4K60).
• Display interfaces: LVDS up to 1920x1200@60Hz (dual‑channel), eDP up to 4096x2304@60Hz, HDMI up to 4096x2160@30Hz, DP++ up to 4096x2304@60Hz.
• PCIe & expansion: 8 x PCIe x1 (Gen4), 2 x PCIe x4 (Gen4, optional), 1 x PCIe x8 (Gen5, H‑line only).
• Audio: HD Audio interface.
• Ethernet: Intel® I226 series (1 x 2.5GbE + 1Gb support).
• USB & storage: 2 x USB4 (BOM option), 4 x USB 3.2 Gen2, 8 x USB 2.0, 2 x SATA 3.0, optional on-board NVMe SSDs (128/256/512/1024 GB).
• DIO & watchdog: 1 x 8-bit DIO, programmable watchdog (1–255 s).
• Security: TPM available on request.
• Power: Input 8.5–20 V (ATX/AT modes with 5VSB and VCC_RTC variations).
• OS support: Windows 10 IoT Enterprise 64-bit, Windows 11, Linux.
• Environment: Operating temp 0–60°C (H-series) or -40–85°C (U-series); storage -40–85°C; humidity 10–90% RH.
• Mechanics: COM Express® Compact form factor, 95 mm x 95 mm.
• Compliance: PICMG COM Express® R3.1, Type 6.

Packing & origin

• Packing list: Cooler A71-108310-A00G included (check SKU packing for options).
• Country of origin: Taiwan.