PICMG system-on-module MTU9A2
COM Express MiniIntel® Core™ Ultra 7 165UIntel® Core™ Ultra 7 155U

PICMG system-on-module - MTU9A2 - DFI - COM Express Mini / Intel® Core™ Ultra 7 165U / Intel® Core™ Ultra 7 155U
PICMG system-on-module - MTU9A2 - DFI - COM Express Mini / Intel® Core™ Ultra 7 165U / Intel® Core™ Ultra 7 155U
PICMG system-on-module - MTU9A2 - DFI - COM Express Mini / Intel® Core™ Ultra 7 165U / Intel® Core™ Ultra 7 155U - image - 2
PICMG system-on-module - MTU9A2 - DFI - COM Express Mini / Intel® Core™ Ultra 7 165U / Intel® Core™ Ultra 7 155U - image - 3
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Characteristics

Form factor
PICMG, COM Express Mini
Processor
Intel® Core™ Ultra 7 155U, Intel® Core™ Ultra 7 165U, Intel® Core™ Ultra 5 125U
Ports
HDMI, eDP, USB 2.0, USB 3.2, I2C, SPI, UART, LPDDR5
Operating system
Linux, Windows 10 IoT Enterprise, Windows 11
Data storage
SSD 1024GB, SSD 128GB, SSD 256GB, SSD 512GB
Other characteristics
embedded
Applications
industrial
Memory size

Max.: 32 GB

Min.: 0 GB

Description

Overview
The MTU9A2 is a COM Express Mini (Type 10) System-on-Module from DFI for embedded and industrial applications. It integrates Intel® Core™ Ultra (Meteor Lake U-series) processors, supports LPDDR5 memory up to 32GB, provides dual-display capability and a wide set of I/O and expansion interfaces for demanding deployments.

Highlights
  • COM Express® Mini form factor (84 x 55 mm) compliant with PICMG COM Express® R3.1, Type 10.
  • Intel Core Ultra U-series processor options up to Intel Core Ultra 7 165U (10 cores, 15W).
  • LPDDR5 memory up to 32GB; Single/Dual channel options; In-band ECC (IBECC) supported on Ubuntu.
  • Wide operating temperature range: -40 to 85°C; industrial certifications (CE, FCC).


Technical specifications
  • Processor: Intel Core Ultra U-series (Meteor Lake U). Available SKUs include Core Ultra 7 165U, Core Ultra 7 155U and Core Ultra 5 125U (specifications per SKU: P-cores, E-cores, frequencies, cache, 15W TDP).
  • Memory: LPDDR5 up to 32GB; Dual channel LPDDR5 7467 MHz; 8GB option by project; IBECC supported on Ubuntu.
  • BIOS: AMI SPI 256 Mbit.
  • Graphics: Intel UHD graphics with DirectX 12, OpenGL 4.6, Vulkan 1.2 (Windows) and Mesa/OpenGL/Vulkan support on Linux. Hardware decode/encode up to 4K60 (details per codec in product sheet).
  • Display: 1 x DDI and 1 x eDP. eDP up to 4096 x 2160 @ 60Hz; HDMI up to 4096 x 2160 @ 30Hz; DP++ up to 4096 x 2160 @ 60Hz.
  • Dual displays supported (DDI + eDP).
  • Expansion: 4 x PCIe x1 (Gen3), optional onboard NVMe SSDs (128/256/512/1024 GB on request).
  • I/O: 1 x I2C, 1 x SMBus, 1 x eSPI, 1 x GSPI, 2 x UART (TX/RX), 2 x USB 3.2 Gen2, 8 x USB 2.0, 2 x SATA 3.0.
  • Ethernet: 1 x Intel I226-IT (1 GbE + 2.5GbE capable).
  • Digital I/O: 1 x 8-bit DIO; Audio: HD Audio.
  • Security & management: TPM 2.0; Watchdog timer programmable 1–255 seconds; UEFI only.
  • Power: ATX/AT modes supported, input 8.5–20 V; 5VSB and VCC_RTC present.
  • OS support: Windows 10 IoT Enterprise 64-bit, Windows 11, Linux (UEFI).
  • Mechanics: COM Express® Mini 84 x 55 mm.
  • Compliance & certifications: PICMG COM Express® R3.1 Type 10; CE, FCC.
  • Environment: Operating/Storage temperature -40 to 85°C; humidity 5–90% RH. MTBF and power consumption: TBD.
  • Packing list: Cooler A71-108310-A00G included. Country of origin: Taiwan.


Expansion & I/O details
  • PCIe lanes and connectors for peripheral expansion (4 x PCIe x1 Gen3).
  • Serial & management buses: I2C, SMBus, eSPI, GSPI and 2 UART ports.
  • Storage & USB: 2 x SATA 3.0, onboard NVMe options, 2 x USB 3.2 Gen2 and multiple USB 2.0 ports.


Ordering & support
  • Multiple SKUs and NVMe options available on request; contact sales for customization and project-specific configurations.
  • AMIBIOS image (256 Mbit) and OS packages available; technical support for industrial deployment and thermal solutions.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.