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PICMG system-on-module EHL9A2
COM Express CompactCOM Express MiniIntel® Atom® x6212RE

PICMG system-on-module - EHL9A2 - DFI - COM Express Compact / COM Express Mini / Intel® Atom® x6212RE
PICMG system-on-module - EHL9A2 - DFI - COM Express Compact / COM Express Mini / Intel® Atom® x6212RE
PICMG system-on-module - EHL9A2 - DFI - COM Express Compact / COM Express Mini / Intel® Atom® x6212RE - image - 2
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Go to the DFI website for more information

Characteristics

Form factor
PICMG, COM Express Compact, COM Express Mini
Processor
Intel® Atom® x6212RE, Intel® Elkhart lake SoC
Ports
Ethernet, HDMI, LVDS, eDP, WiFi, USB 3.1, I2C, SATA, SPI, UART, LPDDR4
Operating system
Windows 10 IoT Enterprise
Data storage
eMMC 64GB
Other characteristics
embedded, fanless
Applications
industrial, medical
Memory size

Max.: 16 GB

Min.: 0 GB

Description

Product Overview
  • Intel® Atom® Processor Elkhart Lake Series
  • Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
  • 1 LVDS/eDP, 1 DDI (HDMI/DP++); Supports dual displays: DDI + LVDS/eDP
  • Multiple expansions: 4 PCIe x1
  • Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q1' 36 (Based on Intel IOTG Roadmap)

Features
  • Wide-temp: -40~85°C
  • 4K2K Display
  • Multiple Expansion

Certifications
  • RoHS Certification
  • CE Certification
  • FCC Certification
  • UKCA Certification

Tags
  • Slim Bootloader
  • 4K2K Display
  • 1G Ethernet
  • Windows
  • Linux
  • DDR4
  • Low Power Consumption
  • RoHS Certification
  • CE Certification
  • FCC Certification
  • Intel® Atom® Processors Elkhart Lake X Series
  • 2.5G Ethernet
  • UKCA Certification

Detailed Description
  • DFI's new-gen EHL Series embedded computing solutions powered by the Intel® Atom™ x6000 series processors are tailored to enhance the management and synergy of IoT devices. The new SoC delivers a 1.7x improvement in single-thread performance and up to 2x performance improvement in graphics than the previous generation. The performance enhancement enables remote industrial controlling devices, Kiosk, medical monitoring devices, or mobile AGV/AMR to quickly respond to edge events and optimize the efficiency of synchronization and collaboration between edge devices through intelligent management for a more comprehensive and seamless system of automation.
  • As IT infrastructures are moving to the edge, they emphasize real-time responsiveness, low power consumption, and environmental resilience of devices more. DFI specially designs the EHL series industrial motherboards, computers on module, and fanless embedded systems based on Intel® Atom™ x6000 processors. Besides having boards in form factors ranging from SBC and Mini-ITX, to COM Express Compact and COM Express Mini, DFI also provides small industrial computers that can easily overcome environmental constraints on IoT device deployment by operating efficiently at -40 to 85°C. From SBC, Mini-ITX, COM Express Compact, COM Express Mini, to small PCs, the EHL series offers more options on computing performance ranging from 4.5W to 12W, and ensures to operate efficiently with the ambient temperature at -40 ~ 85°C to achieve IoT devices management and real-time response in various industrial controls, AGV/robot control, remote medical monitoring, medical display, and transportation management.
  • The independent 2.5G LAN provides amazingly faster transfer experience than the generic 1G LAN, and can simultaneously optimize the synergy between edge devices to be more real-time and seamless by the built-in in-band management functions, vPro and AMT. On the other hand, the EHL series also supports broadband wireless transmission 5G and Wifi 6, eliminating the limits that the cables bring for device deployment.
  • The EHL series leverages the high-speed PCIe Gen3 signal to achieve significant optimization in expansion and connection. In addition to DDR4-3200 memory supporting up to 32G, the EHL series also provides PCIe x4 and PCIe x1 slots, M.2 B & E key, nano SIM slots, and various I/Os such as LAN, COM, USB 3.1 Gen2, and SATA that greatly enhance the responsiveness of edge control, expansion, and connectivity.
  • The EHL series can connect up to three 4K Ultra HD independent displays at the same time, providing a delicate and fast display of every detail for an unparalleled visual experience in industrial, retail, and shopping mall digital signage applications.
  • The EHL series introduces vPro and AMT, which were supported only on desktop and server models, into the Atom platform to monitor as well as manage remote devices and update their operating systems and software through in-band signaling by Wi-Fi or wired Ethernet. Even when the operating system is down, the out-of-band management function can recover the system and application easily to reduce the downtime.
  • From design, development, to production, DFI’s motherboards follow the 100% in-house production principle, guaranteeing manufacture quality and information confidentiality. Developed on the basis of these boards and integrated into durable chassis, our embedded systems are also ensured by turnkey services and timely post-sales assistance.
  • Long life cycle support, no risk occurred. With product life cycle support of up to 15 years, DFI guarantees performance, quality, and future repair and replacement.

Ordering Information
  • EHL9A2-TC16-6425RE: Intel® Atom® x6425RE, LPDDR4 16GB on board, eMMC 64GB, LVDS, DIO, TPM 2.0, -40 to 85°C
  • EHL9A2-TC16-6414RE: Intel® Atom® x6414RE, LPDDR4 16GB on board, eMMC 64GB, LVDS, DIO, -40 to 85°C
  • EHL9A2-TC86-6212RE: Intel® Atom® x6212RE, LPDDR4 8GB on board, eMMC 64GB, LVDS, DIO, -40 to 85°C
  • EHL9A2-BC86-J6426: Intel® Atom® J6426, LPDDR4 8GB on board, eMMC 64GB, LVDS, DIO, -5 to 65°C
  • EHL9A2-BC86-N6211: Intel® Atom® N6211, LPDDR4 8GB on board, eMMC 64GB, eDP, SDIO, -5 to 65°C
  • EHL9A2-TC86-6425RE: Intel® Atom® x6425RE, LPDDR4 8GB on board, eMMC 64GB, LVDS, DIO, TPM 2.0, -40 to 85°C

Optional Items
  • Heat Spreader: For Atom x6000 Series, For Pentium & Celeron
  • COM100-B Carrier Board Kit
  • COM335 Carrier Board Kit

Technical Specifications
  • System
    • Processor: Intel Atom® x6000 series and Intel® Celeron® and Pentium® N & J series processors
    • Memory: LPDDR4X up to 16GB; Dual Channel LPDDR4X 3733MHz/4267MHz depending on processor; 8GB/16GB supported by project basis; In-band ECC (IBECC) with normal memory chip support on selected ATOM x6000 series SKUs; IBECC can be enabled or disabled in BIOS setup menu
    • BIOS: AMI SPI 256Mbit
  • Graphics
    • Controller: Intel® HD Graphics
    • Feature: OpenGL 5.0, DirectX 12, OpenCL 2.1; HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC; HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, MVC
    • Display: 1 x DDI, 1 x LVDS/eDP; LVDS: single channel 24-bit, resolution up to 1920x1200 @ 60Hz; eDP: resolution up to 4096x2160 @ 60Hz; HDMI: resolution up to 4096x2160 @ 30Hz; DP++: resolution up to 4096x2160 @ 60Hz, 3840x2160 @60Hz
    • Dual Displays: DDI + LVDS/eDP
  • Expansion
    • Interface: 4 x PCIe x1 (Gen 3), 1 x SD/SDIO (available upon request), 1 x I2C, 1 x SMBus, 1 x LPC, 1 x Speaker, 1 x SD 3.0, 1 x SPI, 2 x UART (TX/RX)
  • Audio
    • Interface: HD Audio
  • Ethernet
    • Controller: 1 x Intel® I225-IT / I225-LM (10/100/1000Mbps/2.5Gbps)
  • I/O
    • USB: 2 x USB 3.1, 8 x USB 2.0
    • SATA: 2 x SATA 3.0 (up to 6Gb/s)
    • eMMC: 1 x 8GB/16GB/32GB/64GB/128GB eMMC 5.1 (available upon request)
    • DIO: 1 x 8-bit DIO
  • Watchdog Timer
    • Output & Interval: System Reset, Programmable via Software from 1 to 255 Seconds
  • Security
    • TPM: dTPM or fTPM (Optional)
  • Power
    • Type: 4.75V~20V, 5VSB, VCC_RTC (ATX mode); 4.75V~20V, VCC_RTC (AT mode)
    • Consumption: TBD
  • OS Support
    • Windows: Windows 10 IoT Enterprise 64-bit
    • Linux
  • Environment
    • Temperature: Operating: -5 to 65°C, -40 to 85°C; Storage: -40 to 85°C
    • Humidity: Operating: 5 to 90% RH; Storage: 5 to 90% RH
    • MTBF: TBD
  • Mechanism
    • Dimensions: COM Express® Mini 84mm (3.3") x 55mm (2.16")
    • Compliance: PICMG COM Express® R3.0, Type 10
  • Standards and Certifications
    • Certifications: CE, FCC, UKCA, RoHS
  • Packing List
    • Heat Sink (For Pentium & Celeron) A71-008170-010G
    • Cooler (For Atom x6000 Series) A71-108143-000G
  • Country of Origin
    • Taiwan

Catalogs

Go to the DFI website for more information

Other DFI products

System-On-Modules

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.