COM-HPC system-on-module RPS9HC series

13th Generation Intel® Core™Intel® Core™ i9-13900EIntel® Core™ i9-13900TE

Overview
The RPS9HC is a COM-HPC® Client Size C system-on-module family for high-performance embedded computing. It supports 14th and 13th Gen Intel® Core™ processors, DDR5 memory, multiple high-speed expansions and quad independent displays up to 8K, aiming at long CPU lifecycle applications.

Key highlights

• Form factor / compliance: PICMG COM-HPC® R1.15, Client Size C
• CPU: 14th / 13th Gen Intel® Core™ (LGA 1700)
• Memory: 4 × DDR5 SO-DIMM sockets, up to 192 GB
• Graphics / displays: Quad display support (eDP + 3 × DDI); DDI up to 8K, eDP up to 5K
• Expansion: 1 × PCIe x16 (Gen5); 4 × PCIe x4 (Gen4); additional PCIe lanes
• I/O: 2 × Intel 2.5GbE, multiple USB ports, SATA, GPIO
• Lifecycle: Typical CPU lifecycle support to Q1'38 (Intel IOTG roadmap)

Technical specifications

• Processor support: 14th Gen Intel® Core™ (LGA 1700, TDP up to 65 W) including i9-14900 and low-power T SKUs; 13th Gen Intel® Core™ supported (e.g. i9-13900E, i7-13700E).
• Chipset: Intel® R680E / Q670E / H610E variants.
• Memory: 4 × DDR5 SO-DIMM, dual-channel, up to 192 GB; ECC supported on R680 with certain CPUs.
• BIOS: AMI SPI 256 Mbit.
• Graphics: Intel® HD Gen9 (OpenGL 4.5, DirectX 12, OpenCL 2.1); hardware decode/encode for AVC/H.264, HEVC/H.265, VP8/VP9, JPEG/MJPEG.
• Displays: 3 × DDI (HDMI/DP++) up to 8K; 1 × eDP up to 5K; quad display via eDP + 3 DDI.
• Expansion / interfaces: 1 × PCIe x16 (Gen5); 4 × PCIe x4 (Gen4); 2 × PCIe x4 (Gen3); 2 × PCIe x1 (Gen3); eSPI, I2C, SMBus, 2 × UART.
• Ethernet: 2 × Intel® I226 PHYs (1 GbE and 2.5 GbE support).
• USB / Storage / GPIO: 4 × USB 3.2 Gen2; 8 × USB 2.0; 2 × SATA 3.0; 12-bit GPIO.
• Audio: HD Audio codec.
• Watchdog: Programmable 1–255 s; system reset.
• Security: TPM 2.0 available on request.
• Power: ATX mode and AT mode supported. Typical: 12V @ 2.7A (32.4 W); Max: 12V @ 24.2A (290.4 W).
• OS support: Windows 10 IoT Enterprise 64-bit, Windows 11; Linux (Ubuntu 20.04).
• Environment: Operating 0–60°C; storage −40–85°C; humidity 5–90% RH.
• Dimensions: COM-HPC® Client Size C; 160 × 120 mm (6.30" × 4.72").
• Packing list: COM836 carrier board kit (770-COM8361-000G) included as kit item.
• Compliance: PICMG COM-HPC® R1.15; Certifications: CE, FCC, RoHS.
• Country of origin: Taiwan.

Typical applications

• High-performance embedded computing
• Industrial automation and control
• Edge servers, network appliances, vision and imaging systems
• Medical imaging and instrumentation (subject to certification requirements)

Ordering & support

• Contact DFI for configuration options, lifecycle roadmap and TPM provisioning.
• Kit includes COM836 carrier board; additional carrier or customization available on request.