Size-S system-on-module OSM-S AM62L

dual-coreARM® Cortex A53TI AM62x Sitara™

Product overview
The OSM-S AM62L is a compact System-on-Module (SoM) compliant with the Open Standard Module™ (OSM) specification. It integrates a TI AM62L Dual‑Core Arm® Cortex®‑A53 CPU and supports LPDDR4 memory and eMMC flash options in a 30 × 30 mm form factor, enabling space-constrained embedded designs with machine-processable soldering and assembly.

Key features

• TI AM62L Dual‑Core Arm® Cortex®‑A53 @ 1.25 GHz
• LPDDR4 memory: 512 MB (opt.), 1 GB (std.), 2 GB (opt.)
• eMMC flash: 4 GB (std.), up to 128 GB (opt.)
• Compact OSM Size S form factor: 30 × 30 mm
• Supply voltage: 5 V, suitable for fanless continuous-operation systems
• Designed for Embedded Linux (Yocto Distribution)

Performance & architecture
The module's TI AM62L CPU delivers deterministic processing for control and HMI tasks while maintaining low power consumption. The board layout includes LPDDR4 memory routing and advanced pin multiplexing. Integrated security features include Secure Boot, a Trusted Execution Environment and hardware cryptographic acceleration (AES, SHA2, DRBG, PKA). The module is fully machine-processable for reflow soldering and automated assembly.

Communication interfaces

• 2× Gigabit Ethernet with Time Sensitive Networking (TSN) and IEEE 1588 support
• 2× CAN FD for fieldbus and automotive integration
• USB 2.0, UART, I²C, SPI
• GPIO, PWM, SAI, SDIO, ADC
• MIPI DSI and parallel RGB display interfaces, up to 1920 × 1080 @ 60 fps

Applications & benefits
The OSM-S AM62L is aimed at embedded HMI, building and home automation, patient monitoring, EV charging infrastructures, energy gateways, mobile and industrial printers, and industrial automation. The OSM standard simplifies carrier board design, reduces integration effort and shortens time-to-market while providing long-term availability and energy-efficient operation.

Technical specifications

• Model: OSM-S AM62L
• Form factor: OSM Size S, 30 mm × 30 mm
• CPU: TI AM62L, Dual‑Core Arm® Cortex®‑A53 @ 1.25 GHz
• Memory (LPDDR4): 512 MB (opt.), 1 GB (std.), 2 GB (opt.)
• Flash (eMMC): 4 GB (std.), optional up to 128 GB
• EEPROM: 8 kByte
• Ethernet: 2× 1 Gbit/s with TSN (IEEE 1588)
• Fieldbus / Automotive: 2× CAN FD
• Interfaces: USB 2.0, UART, I²C, SPI, GPIO, PWM, SAI, SDIO, ADC
• Display: MIPI DSI and RGB up to 1920 × 1080 @ 60 fps
• Operating system: Embedded Linux (Yocto Distribution)
• Supply voltage: 5 V
• Security: Secure Boot, Trusted Execution Environment, cryptographic acceleration (AES, SHA2, DRBG, PKA)
• Manufacturing: Fully machine-processable for soldering, assembly and testing
• Target environments: Fanless systems, continuous operation