3.5" SubCompact single-board computer 3.5"-SBC-TGL
Intel® Celeron® 6305E11th Generation Intel® Core™M.2 Key B

3.5" SubCompact single-board computer - 3.5"-SBC-TGL - Kontron - Intel® Celeron® 6305E / 11th Generation Intel® Core™ / M.2 Key B
3.5" SubCompact single-board computer - 3.5"-SBC-TGL - Kontron - Intel® Celeron® 6305E / 11th Generation Intel® Core™ / M.2 Key B
3.5" SubCompact single-board computer - 3.5"-SBC-TGL - Kontron - Intel® Celeron® 6305E / 11th Generation Intel® Core™ / M.2 Key B - image - 2
3.5" SubCompact single-board computer - 3.5"-SBC-TGL - Kontron - Intel® Celeron® 6305E / 11th Generation Intel® Core™ / M.2 Key B - image - 3
3.5" SubCompact single-board computer - 3.5"-SBC-TGL - Kontron - Intel® Celeron® 6305E / 11th Generation Intel® Core™ / M.2 Key B - image - 4
3.5" SubCompact single-board computer - 3.5"-SBC-TGL - Kontron - Intel® Celeron® 6305E / 11th Generation Intel® Core™ / M.2 Key B - image - 5
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Characteristics

Form factor
3.5" SubCompact
Processor
Intel® Celeron® 6305E, 11th Generation Intel® Core™
Extension slot
M.2 Key B, SATA3, M.2 Key M, M.2, M.2 Key E
Connectivity
DisplayPort, GbE, USB 3.2, 2.5 GbE, USB 2.0, RS-485, RS-422, LVDS, RS-232
Memory
DDR4 3200 MHz, DDR4 SO-DIMM
Other characteristics
dual Ethernet, embedded, Edge AI, multiple display, industrial
Processor frequency

Max.: 8 GHz

Min.: 0 GHz

Memory size

Max.: 64 GB

Min.: 0 GB

Description

Overview
3.5"-SBC-TGL is a 3.5" single-board computer powered by 11th Generation Intel® Core™ U-Series and Celeron® 6000 Series processors (Tiger Lake UP3) with Intel® Iris® Xe Graphics. It is designed for AI, deep learning, computer vision and low-latency deterministic applications in industrial and embedded systems.

Key benefits
  • Native AI inferencing capabilities for edge deployments
  • Support for up to two 8K UHD video outputs at 60 fps
  • Time Coordinated Computing / Time Sensitive Networking (TSN) for real-time control
  • Flexible expansion: next‑gen M.2 sockets and extended board‑to‑board (B2B) connector
  • Hardware-based security features to protect against malware and advanced cyberattacks


Product details
Ideal for AI / Deep Learning Applications
3.5"-SBC-TGL brings improved CPU, GPU and AI performance via Tiger Lake UP3 processors and Intel® Iris® Xe (on Core™ i7/i5). It suits vision workloads, inference at the edge and deterministic compute tasks requiring low latency.

8K Ultra HD Video Outputs
The board supports up to two 8K@60 Hz streams (Core™ i7/i5) and, via the extended B2B connector, can expose four DP channels to drive four independent 4K@60 Hz displays or form 2x2 / 4x1 video walls.

Optimized Bandwidth Utilization
Includes both 1x GbE and 1x 2.5 GbE LAN ports to support bandwidth‑intensive networking, multimedia and cloud services.

Flexibility in System Design & Performance
TDP profiles are configurable in BIOS, allowing integrators to adjust performance vs. thermal budgets for target cooling solutions and application scenarios.

Harsh Environment Deployments
Available variants include consumer (0 °C ~ 60 °C) and industrial (-40 °C ~ 85 °C) operating temperature ranges for use in demanding environments.

Additional features
  • Multiple expansion options: M.2 Key B/M/M.2 Key E and extended B2B connector for additional I/Os and multi-channel DP
  • Optional vPro support (where applicable)
  • Wide I/O set: USB 3.2 Gen 2, USB 2.0, SATA 3.0, RS232/422/485, 8-bit DIO
  • Security: TPM 2.0 support and hardware protection mechanisms


Technical data
  • Model family: 3.5"-SBC-TGL
  • Processor options: Intel® Core™ i7-1185G7E / i7-1185GRE; i5-1145G7E / i5-1145GRE; i3-1115G4E; Intel® Celeron® 6305E
  • Memory: 2x DDR4-3200 SO-DIMM, up to 64 GB
  • Graphics: Intel® Iris® Xe (i7/i5) or Intel® UHD (i3/Celeron)
  • Display outputs: 1x LVDS, 2x DP (up to 8K@60Hz), additional DP via B2B connector
  • Audio: TSI 92HD91B; speaker-out, line-in/out, mic-in headers
  • Networking: 1x GbE + 1x 2.5 GbE
  • Expansion: M.2 Key B/M/E, B2B connector
  • Storage: SATA 3.0
  • Operating temperature: standard 0 °C ~ 60 °C; industrial -40 °C ~ 85 °C (variants)
  • Form factor: ECX (146 mm x 105 mm)

Catalogs

Exhibitions

Meet this supplier at the following exhibition(s):

electronica Munich 2026
electronica Munich 2026

10-13 Nov 2026 Munich (Germany) Hall A1 - Stand 449

  • More information
    Semicon
    Semicon

    10-13 Nov 2026 Munich (Germany)

  • More information

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    Boards & Standard Form Factors

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