CompactPCI CPU board CP6007-SA
Intel® Xeon11th Generation Intel® Core™embedded

CompactPCI CPU board - CP6007-SA - Kontron - Intel® Xeon / 11th Generation Intel® Core™ / embedded
CompactPCI CPU board - CP6007-SA - Kontron - Intel® Xeon / 11th Generation Intel® Core™ / embedded
CompactPCI CPU board - CP6007-SA - Kontron - Intel® Xeon / 11th Generation Intel® Core™ / embedded - image - 2
CompactPCI CPU board - CP6007-SA - Kontron - Intel® Xeon / 11th Generation Intel® Core™ / embedded - image - 3
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Characteristics

Bus standard
CompactPCI
Processor
Intel® Xeon, 11th Generation Intel® Core™
Other characteristics
embedded, 6U
Memory size

32 GB

Description

Highlights
  • PICMG2.16 server and general computing
  • Up to 64 GByte ECC (32 GB soldered + optional 32 GB SODIMM)
  • Support for NVMe or SATA M.2 flash and 2.5" SATA drives
  • European design and production; proven CompactPCI® ecosystem, 10 years availability

Overview
Outstanding performance-per-watt. CP6007-SA is based on 6-core or 8-core 11th Generation Intel® Xeon® processors (10nm), delivering high efficiency. Scalable power budget allows tailoring power dissipation to application requirements. 32 GB soldered memory and the option for an additional 32 GB SODIMM with ECC are provided.

Virtualisation and multi-CPU server suitability
CP6007-SA is well suited for advanced multi-CPU server applications implemented as virtual machines, enabling future-proof deployments in industrial and defense environments.

Extensions and storage
Supports onboard industrial-grade M.2 flash devices (NVMe or SATA) and 2.5" SATA HDD/SSD via a respective rear-I/O module or a separate HDD carrier kit. Features an XMC site (XMC.3) supporting x8 PCI Express® and alternatively a PMC site. Kontron rear I/O module series is fully functional with CP6007-SA.

Reliability and ecosystem
Established CompactPCI® ecosystem, long-term availability of Intel processor family and Kontron technical support make CP6007-SA suitable for long-term programs in critical environments.

Technical data
Processor: Intel® Xeon® W-11555MRE (6 core, 12 MByte cache, 2.6 GHz, 45 W TDP / 2.1 GHz, 35 W cTDP); Intel® Xeon® W-11865MRE (8 core, 24 MByte cache, 2.6 GHz, 45 W TDP / 2.1 GHz, 35 W cTDP)
Main Memory: 32 GByte soldered RAM with ECC (up to 3200 MHz); optional 32 GByte SODIMM ECC (dual channel DDR4 up to 3200 MHz)
SATA: Four ports to rear I/O (SATA 3 Gb/s), one SATA 6 Gb/s connector, one M.2 2280 mounting option (SATA 6 Gb/s); onboard M.2 NVMe/SATA support
Serial: COM1 (RS232) routed to front panel and rear I/O; COM2 (RS232/RS422) routed to rear I/O only
Rear I/O: J3: 2x ETH (rear I/O or PICMG2.16), VGA, COM1/2, 4x USB, GPIO, fan sense; J4: PMC rear I/O; J5: 4x SATA, 2x DVI/HDMI, battery, fan control, additional GPIO

Specifications
  • Form factor: 6U CompactPCI® PICMG2.16 blade (CP6007-SA)
  • Processor options: 6-core or 8-core 11th Gen Intel® Xeon® (W-11555MRE, W-11865MRE)
  • Memory: 32 GB soldered ECC, optional 32 GB SODIMM ECC (up to 64 GB ECC)
  • Storage: M.2 2280 (NVMe or SATA) support; 2.5" SATA HDD/SSD via rear-I/O or HDD carrier
  • Expansion: XMC site (XMC.3) supporting x8 PCIe; alternative PMC site
  • Interfaces: Ethernet, VGA, USB, DVI/HDMI, COM, GPIO, SATA
  • Target applications: PICMG2.16 servers, multi-CPU servers, virtualization in industrial and defense environments
  • Design & availability: European design and production; proven CompactPCI ecosystem, long-term availability (≈10 years)

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Exhibitions

Meet this supplier at the following exhibition(s):

AUSA 2026
AUSA 2026

12-14 Oct 2026 Washington (USA - Virginia)

  • More information
    Semicon West
    Semicon West

    13-15 Oct 2026 San Francisco (USA - California)

  • More information

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