Mini-ITX motherboard K4131-P

AMD Ryzen™ EmbeddedAMDDDR5 SDRAM

Product Information
The K4131-Px mITX industrial motherboard integrates AMD Ryzen™ AI Embedded processors with an on‑SoC AMD Radeon™ RDNA 3.5 GPU and an XDNA™2 NPU, delivering combined compute, graphics and edge‑AI acceleration for industrial applications.
Designed for multi‑display HMI, visualisation and edge‑AI systems, the board supports up to four independent display outputs and extensive expansion options.

Highlights

• AMD Radeon™ RDNA 3.5 graphics integrated in SoC
• 4x DisplayPort™ V2.0 outputs (up to 8K)
• eDP V1.4 (up to 5K) and dual‑channel 24‑bit LVDS onboard
• Integrated XDNA™2 NPU delivering up to 50 TOPs for on‑device inference
• Dual LAN (1GbE + 5GbE) with Teaming support

Technical Data (excerpt)
Processors: AMD Ryzen™ AI Embedded series (examples: P121, P132) with integrated Radeon™ RDNA 3.5 graphics and XDNA™2 NPU up to 50 TOPs
Memory: DDR5-5600, 2x SO‑DIMM, up to 96 GB, ECC support
Display interfaces: 1x USB4® (DP2.1 up to UHBR20 8K); 4x DP V2.0 up to 8K; 1x eDP V1.4 up to 5K; dual‑channel 24‑bit LVDS; USB4/DP Alt Mode support
Storage & expansion: multiple M.2 sockets (Key‑M, Key‑B, Key‑E) for NVMe, wireless and expansion modules
Networking & I/O: USB4® Type‑C, USB 3.2 Gen 2, multiple COM ports, GPIO, dual LAN (1GbE/5GbE)

Benefits

• Integrated AI and GPU acceleration for reduced system complexity
• Flexible multi‑display support for advanced HMI and signage
• Multiple M.2 and I/O options for modular system design
• Engineered for continuous 24/7 operation in industrial environments
• Lifecycle and maintenance practices suited to long‑term deployments

Technical specifications

• Form factor: Mini‑ITX industrial motherboard (mITX)
• Supported processors: AMD Ryzen™ AI Embedded family (e.g. P121, P132)
• Integrated accelerator: XDNA™2 NPU up to 50 TOPs
• Integrated GPU: AMD Radeon™ RDNA 3.5 (within SoC)
• Display: up to 4 independent outputs; DisplayPort™ V2.0; USB4®/DisplayPort Alt Mode; eDP V1.4 (up to 5K); dual‑channel 24‑bit LVDS
• Memory: DDR5-5600, 2x SO‑DIMM, up to 96 GB, ECC
• Storage/expansion: multiple M.2 (Key‑M/Key‑B/Key‑E) supporting NVMe, wireless modules
• Networking: Dual LAN (1 GbE + 5 GbE) with Teaming support
• USB/I/O: USB4® Type‑C, USB 3.2 Gen 2, COM ports, GPIO
• Operating: 24/7 operation, temperature range −10 °C to +60 °C
• Target markets: industrial automation, edge‑AI computing, digital signage, embedded intelligent systems