Storage micro server VX307H
networkcalculationblade

Storage micro server - VX307H - Kontron - network / calculation / blade
Storage micro server - VX307H - Kontron - network / calculation / blade
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Characteristics

Type
calculation, network, storage
Mounting
blade, 3U
Processor
Intel® Xeon
Applications
industrial, for harsh environments
Memory
DDR4 SDRAM, DDR4-ECC
Other characteristics
Ethernet, rugged, NVMe
RAM capacity

Max.: 64 GB

Min.: 0 GB

Description

Product overview
SOSA-aligned Intel® 10nm x86 microserver 3U VPX blade designed for high-performance microserver and parallel computing nodes. Delivers improved performance over previous Intel® Xeon® D-1500 series while maintaining a conservative power envelope.

Key features
  • Intel® Xeon® D-2700 processors with integrated 100G Ethernet
  • Up to 20 cores with AVX-512 vector engine
  • Security enforced by Hardware Root of Trust
  • VITA48 cooling builds with VITA 47 CC3 conduction-cooled option
  • Designed in accordance with SOSA™ requirements


Product information
The VX307H leverages a 10nm SoC to target next-generation microserver and parallel compute applications, offering higher core counts and enhanced vector performance while balancing power consumption and thermal constraints typical of VPX blade deployments.

Technical data (excerpt)
Processor: Intel® Xeon® D-2775TE (16 cores, 25M cache, up to 3.10 GHz, 100W TDP) or Intel® Xeon® D-2896TER (20 cores, 30M cache, up to 3.20 GHz, 110W TDP)
Cache: 25 MByte or 30 MByte
DRAM: Up to 64 GB dual-channel DDR4 SDRAM at 2400 MT/s, ECC, soldered
Expansion: Optional XMC slot (VITA42/VITA61, AFT variant)
Backplanes: Supported slot/module profiles: SLT3-PAY-1F1U1S1S1U1U2F1H-14.6.11-0; SLT3-PAY-1F1U1S1S1U1U4F1J-14.6.13-0; MOD3-PAY-1F1U1S1S1U1U2F1H-16.6.11-11; MOD3p-PAY-1F1U1S1S1U1U4F1J-16.6.13-1

Characteristics / technical specifications
  • Model: VX307H
  • Architecture: SOSA-aligned 3U VPX microserver, Intel® 10nm x86 SoC
  • Processor options: Intel® Xeon® D-2775TE (16 cores) or Intel® Xeon® D-2896TER (20 cores)
  • Max cores: Up to 20 cores with AVX-512
  • Network: Integrated 100G Ethernet
  • Memory: Up to 64 GB DDR4 (dual channel, 2400 MT/s, ECC, soldered)
  • Storage: 320 GB NVMe 1.4 (M.2) for boot
  • I/O planes: Data plane single 40/100GbE or dual 40/10GbE; Expansion plane x8/x16 PCIe Gen4; Control plane 1/10GbE
  • Interfaces: Dual SMB/IPMB, JTAG, power supply interfaces
  • Cooling: VITA47 CC3 conduction-cooled (-40°C to +70°C) or VITA48.8 airflow-through FC-2 (-40°C to +55°C)
  • Security & compliance: Designed to SOSA™ requirements; Hardware Root of Trust enforced
  • Front panel: No front panel

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Exhibitions

Meet this supplier at the following exhibition(s):

ASHG
ASHG

20-24 Oct 2026 Montreal (Canada)

  • More information
    ELECTRONICA 2026
    ELECTRONICA 2026

    10-13 Nov 2026 Munich (Germany) Hall A1 - Stand 449

  • More information

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